Untitled
Abstract: No abstract text available
Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9
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TFBGA256:
OT999-1
MO-195
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1
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TFBGA256:
OT754-1
MO-216
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1 1/2 e e Y V T P M K H F D B ball A1 index area y y1 C ∅v M C A B b ∅w M C W e U R N L
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TFBGA256:
OT829-1
MO-195
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT999-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA256
OT999-1
OT999-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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TFBGA256
OT754-1
OT754-1
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TFBGA256
Abstract: MO-195 sot829 TfBGA-256
Text: PDF: 2003 Oct 01 Philips Semiconductors Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1 e Y V T P M K H F D B ball A1 index area 1/2 e ∅v M
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TFBGA256:
OT829-1
MO-195
TFBGA256
MO-195
sot829
TfBGA-256
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TFBGA256
Abstract: TfBGA-256 MO-216 sot754
Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V e U T R P
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TFBGA256:
OT754-1
MO-216
TFBGA256
TfBGA-256
MO-216
sot754
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AL9V576
Abstract: AL9V576B-LF-PBF microcontroller 8051 application audio sampling c AL9V576B-LF BF256 al9v576b ISO13818-1 ycbcr 8bit AD Mux TfBGA-256 AL9V576B-BF-PBF
Text: AL9V576 MPEG-4/2/1 A/V Encoder Datasheets Version 1.0 2004~2006 by AverLogic Technologies, Corp. INFORMATION FURNISHED BY AVERLOGIC IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER, NO RESPONSIBILITY IS ASSUMED BY AVERLOGIC FOR ITS USE, NOR FOR ANY INFRINGEMENTS OF PATENTS OR OTHER RIGHTS OF THIRD
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AL9V576
1-D-PMK176-0001
AL9V576
AL9V576B-LF-PBF
microcontroller 8051 application audio sampling c
AL9V576B-LF
BF256
al9v576b
ISO13818-1
ycbcr 8bit AD Mux
TfBGA-256
AL9V576B-BF-PBF
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