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    SOT754 Search Results

    SOT754 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT754-1 NXP Semiconductors Footprint for reflow soldering SOT754-1 Original PDF
    SOT754-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1


    Original     		PDF TFBGA256: OT754-1 MO-216

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA256 OT754-1 OT754-1

    TFBGA256

    Abstract: TfBGA-256 MO-216 sot754
    Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V e U T R P


    Original     		PDF TFBGA256: OT754-1 MO-216 TFBGA256 TfBGA-256 MO-216 sot754