Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT99 Search Results

    SOT99 Datasheets (18)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT990-1 NXP Semiconductors Plastic very thin fine-pitch ball grid array package; 469 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm Original PDF
    SOT991-1 NXP Semiconductors Plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Original PDF
    SOT991-1_118 NXP Semiconductors VFBGA56; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT992-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 544 balls; body 14 x 14 x 1.25 mm Original PDF
    SOT993-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 28 terminals Original PDF
    SOT993-3 NXP Semiconductors HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals Original PDF
    SOT994-1 NXP Semiconductors Footprint for reflow soldering SOT994-1 Original PDF
    SOT994-1 NXP Semiconductors Plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm Original PDF
    SOT995-1 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; body 7 x 7 x 1.2 mm Original PDF
    SOT995-2 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based Original PDF
    SOT996-2 NXP Semiconductors Footprint for reflow soldering SOT996-2 Original PDF
    SOT996-2 NXP Semiconductors Plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm Original PDF
    SOT996-2_125 NXP Semiconductors XSON8(U); Reel pack, Reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125 Original PDF
    SOT996-3 NXP Semiconductors Footprint for reflow soldering SOT996-3 Original PDF
    SOT996-3 NXP Semiconductors Plastic extremely thin small outline package; no leads; 8 terminals Original PDF
    SOT998-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 459 balls Original PDF
    SOT999-1 NXP Semiconductors Footprint for reflow soldering SOT999-1 Original PDF
    SOT999-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 256 balls Original PDF

    SOT99 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		PDF OT991-1 VFBGA56; 001aak603 OT991-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 1 2 mm scale Dimensions mm are the original dimensions


    Original     		PDF OT996-2 sot996-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9


    Original     		PDF TFBGA256: OT999-1 MO-195

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.85 mm B D SOT993-1 A terminal 1 index area E A A1 c detail X e1 b e 8 14 v w C C A B C M M y1 C y L 7 15 e e2 Eh 21 1 terminal 1 index area


    Original     		PDF HVQFN28: OT993-1 MO-220

    Untitled

    Abstract: No abstract text available
    Text: Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Β ∆ SOT991-1 Α βαλλ Α1 ινδεξ αρεα Ε Α Α2 Α1 δεταιλ Ξ ε1 C ∅ϖΜ Χ Α Β ∅ωΜ Χ β ε Η Γ Φ Ε ∆ Χ Β


    Original     		PDF VFBGA56: OT991-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint 2.400 pa + oa 2.000 0.500 0.500 0.250 0.025 0.025 4.250 3.400 pa + oa 2.000 4.000 0.900 www.nxp.com 2009 NXP B.V. solder lands placement area solder paste occupied area Dimensions in mm sot996-2_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not


    Original     		PDF sot996-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm B D SOT994-1 A terminal 1 index area E A A1 c detail X e1 1/2 e ∅v ∅w b e 7 12 M M C C A B C y1 C y L 13 6 e e2 Eh 1/2 e 1


    Original     		PDF HWQFN24: OT994-1 Pla75 MO-220

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT999-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA256 OT999-1 OT999-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XSON8 package SOT996-3 Hx Gx P D P1 0.025 0.025 Hy By Gy Ay B solder lands placement area solder paste occupied area DIMENSIONS in mm P P1 Ay By B D Gx Gy Hx Hy 0.5 0.5 4 2 0.9 0.25 2


    Original     		PDF OT996-3 sot996-3

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.85 mm A B D SOT993-3 terminal 1 index area E A A1 c detail X e1 e 8 14 C C A B C v w b y y1 C L 15 7 e e2 Eh 1 21 terminal 1 index area 28


    Original     		PDF HVQFN28: OT993-3 MO-220 sot993-3

    Untitled

    Abstract: No abstract text available
    Text: Package outline VFBGA469S: plastic very thin fine-pitch ball grid array package; 469 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm D e4 ball/land A1 index area 1 2 3 4 6 5 7 8 B D1 e3 9 10 11 SOT990-1 ∅v ∅w b1 12 13 14 15 16 18 20 17 19 C A B


    Original     		PDF VFBGA469S: OT990-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA544: plastic low profile fine-pitch ball grid array package; 544 balls; body 14 x 14 x 1.25 mm B D SOT992-1 A ball A1 index area E A A2 A1 detail X e1 e AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M C C A B C y y1 C AE AC AA e W U


    Original     		PDF LFBGA544: OT992-1

    kt819g

    Abstract: SOT9202 SM2174 2N3055-1 044VH10 B0450 2N3055-6 diode GG 71 SOT9903 STS107
    Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 SOT9903 SOT9903 TIP73B 2N6488 044VH10 B0545B B0545B SK3510 ~~;~:; 25 30 SK3027 SK3029 SK3620 SK3563 BOW41 SM2174 2N3236 B0184 ~+~~g~ 35 40 • 45 50 2N6472 OTL7530 2N5972 BOX23 B0451 BOX23/40636 BOT55


    Original     		PDF B0183 B0450 OT9202 BOW51B OTS105 STS105 2N5882 2N5970 OT9803 kt819g SOT9202 SM2174 2N3055-1 044VH10 2N3055-6 diode GG 71 SOT9903 STS107

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA459: plastic low profile fine-pitch ball grid array package; 459 balls A B D SOT998-1 ball A1 index area E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e


    Original     		PDF LFBGA459: OT998-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HWQFN24 package SOT994-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HWQFN24 OT994-1 OT994-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFN48R: plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 1.15 mm A B D SOT995-2 terminal 1 index area A E detail X e1 e L1 L C 1/2 e v w b 13 24 C A B C y1 C y 25 12 e e2 Eh 1/2 e 1


    Original     		PDF HLQFN48R: OT995-2 sot935 sot995-2

    Untitled

    Abstract: No abstract text available
    Text: XS ON 8U SOT996-2 XSON8 U ; Reel pack, Reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code (12NC) ending 125 Rev. 5 — 2 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel


    Original     		PDF OT996-2 001aak603 Q3/T715 OT996-2

    NXP 12NC ending

    Abstract: SOT996-2 SOT996 SOT99
    Text: SOT996-2 Reversed product orientation 12NC ending 125 Rev. 02 — 24 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT996-2 125


    Original     		PDF OT996-2 NXP 12NC ending SOT996-2 SOT996 SOT99

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFN48R: plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 1.2 mm A B D SOT995-1 terminal 1 index area A E detail X e1 e L1 L 1/2 e v w b 13 24 M M C C A B C y1 C y 25 12 e e2 Eh 1/2 e


    Original     		PDF HLQFN48R: OT995-1

    nz104

    Abstract: No abstract text available
    Text: 74LVC2G66 Bilateral switch Rev. 7 — 22 June 2012 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals nY and nZ and an active HIGH enable input (nE).


    Original     		PDF 74LVC2G66 74LVC2G66 nz104

    MARKING V7 6-PIN

    Abstract: No abstract text available
    Text: 74LVC3G14 Triple inverting Schmitt trigger with 5 V tolerant input Rev. 11 — 6 July 2012 Product data sheet 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.


    Original     		PDF 74LVC3G14 74LVC3G14 MARKING V7 6-PIN

    PA9540

    Abstract: PA9540B
    Text: PCA9540B 2-channel I2C-bus multiplexer Rev. 04 — 3 September 2009 Product data sheet 1. General description The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I2C-bus. The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels.


    Original     		PDF PCA9540B PCA9540B PCA9540B. 771-PCA9540BD PCA9540BD PA9540 PA9540B

    Marking code V7

    Abstract: No abstract text available
    Text: 74LVC2G00 Dual 2-input NAND gate Rev. 11 — 22 June 2012 Product data sheet 1. General description The 74LVC2G00 provides a 2-input NAND gate function. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment.


    Original     		PDF 74LVC2G00 74LVC2G00 Marking code V7

    74AHC3GU04

    Abstract: 74AHC3GU04DC 74AHC3GU04DP 74AHC3GU04GM JESD22-A114E MO-187
    Text: 74AHC3GU04 Inverter Rev. 03 — 26 January 2009 Product data sheet 1. General description The 74AHC3GU04 is a high-speed Si-gate CMOS device. This device provides the inverting single stage function. 2. Features • Symmetrical output impedance ■ High noise immunity


    Original     		PDF 74AHC3GU04 74AHC3GU04 JESD22-A114E JESD22-A115-A JESD22-C101C 74AHC3GU04DP 74AHC3GU04DC 74AHC3GU04DP 74AHC3GU04GM MO-187