SOT810-1 |
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NXP Semiconductors
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Plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm |
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SOT810-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT810-1 |
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SOT811-1 |
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NXP Semiconductors
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Plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm |
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SOT811-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT811-1 |
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SOT812-1 |
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NXP Semiconductors
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Plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm |
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SOT813-2 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals |
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SOT813-3 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals |
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SOT813-4 |
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NXP Semiconductors
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Footprint for reflow soldering SOT813-4 |
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SOT813-5 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals |
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SOT815-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT815-1 |
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SOT815-1_118 |
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NXP Semiconductors
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DHVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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SOT817-1 |
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NXP Semiconductors
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HVQFN100: plastic thermal enhanced very thin quad flat package |
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SOT817-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT817-1 |
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SOT818-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm |
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SOT818-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT818-1 |
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SOT819-1 |
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NXP Semiconductors
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Plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm |
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