Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BGA288 Search Results

    BGA288 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x


    Original     		PDF BGA288: OT869-1 MS-034

    BGA288

    Abstract: MS-034 sot812
    Text: PDF: 2003 May 20 Philips Semiconductors Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e ∅v M b ∅w M AB AA Y W V U T R P N M L K J H G F E


    Original     		PDF BGA288: OT812-1 MS-034 BGA288 MS-034 sot812

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 shape


    Original     		PDF BGA288: OT812-1 MS-034

    BGA288

    Abstract: MS-034 sot869
    Text: Package outline Philips Semiconductors BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A2 A E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y Y W e V U T R P N M L e2 K J 1/2 e H G


    Original     		PDF BGA288: OT869-1 MS-034 BGA288 MS-034 sot869

    BGA288

    Abstract: MS-034 sot812
    Text: Package outline Philips Semiconductors BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.55 mm SOT812-2 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e ∅v M C A B b AB AA Y W V U T R P N M L K J H G F E D C B A y e e2 1/2 e


    Original     		PDF BGA288: OT812-2 MS-034 BGA288 MS-034 sot812

    337-Pin

    Abstract: "ESP" F0412
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS04-22115-3E ASSP IPsec Engine High-Speed IPsec Processing Engine MB86978 • DESCRIPTION MB86978 is IPsec accelerator engine of Inline Architecture. Once setup with appropriate parameters, the device can perform bi-directional 100 Mbps IPsec processing at full wire speed.


    Original     		PDF DS04-22115-3E MB86978 MB86978 IEEE802 10/100BASE-T/TX, 337-pin 288-pin BGA-337P-M02 F0412 "ESP" F0412

    SPC563M64

    Abstract: SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56
    Text: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Preliminary data Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units


    Original     		PDF SPC564A80B4, SPC564A80L7 32-bit e200z4 24-entry SPC563M64 SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    Untitled

    Abstract: No abstract text available
    Text: SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution


    Original     		PDF SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit e200z4 LBGA208 PBGA324 LQFP176

    LF-H72P

    Abstract: intel 945 motherboard repair diagram str 50113 intel chipset 945 motherboard repair 2310 dhi motherboard hannstar 9172-24 d506 intel chipset 845 motherboard repair circuit Hannstar motherboard HANNSTAR
    Text: SERVICE MANUAL FOR 8175 BY: Jacey Liu TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Mar . 2002 8175 N/B MAINTENANCE CONTENTS 1. Hardware Engineering


    Original     		PDF 478Pin 82801BA PCI4410 ICS950805 LF-H72P intel 945 motherboard repair diagram str 50113 intel chipset 945 motherboard repair 2310 dhi motherboard hannstar 9172-24 d506 intel chipset 845 motherboard repair circuit Hannstar motherboard HANNSTAR

    B3370

    Abstract: F0511 BGA337 337P SAS controller chip HMAC-MD5-96 BGA288 "ESP"
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS04-22115-4E ASSP IPsec Engine High-Speed IPsec Processing Engine MB86978A • DESCRIPTION MB86978A is IPsec accelerator engine of Inline Architecture. Once setup with appropriate parameters, the device can perform bi-directional 100 Mbps IPsec processing at full wire speed.


    Original     		PDF DS04-22115-4E MB86978A MB86978A IEEE802 10/100BASE-T/TX, 337-pin 288-pin F0511 B3370 F0511 BGA337 337P SAS controller chip HMAC-MD5-96 BGA288 "ESP"

    B3370

    Abstract: MB86978 HMAC-MD5-96 "ESP" BGA337
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS04-22115-2E ASSP IPsec Engine High-Speed IPsec Processing Engine MB86978 • DESCRIPTION MB86978 is IPsec accelerator engine of Inline Architecture. Once setup with appropriate parameters, the device can perform bi-directional 100 Mbps IPsec processing at full wire speed.


    Original     		PDF DS04-22115-2E MB86978 MB86978 IEEE802 10/100BASE-T/TX, 337-pin 288-pin F0408 B3370 HMAC-MD5-96 "ESP" BGA337

    Untitled

    Abstract: No abstract text available
    Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 288 PIN PLASTIC BGA-288P-M02 288-pin plastic FBGA Ball pitch 0.75 mm Ball matrix 22 Sealing method Plastic mold BGA-288P-M02 288-pin plastic FBGA (BGA-288P-M02) 18.00±0.10(.709±.004)SQ


    Original     		PDF BGA-288P-M02 288-pin BGA-288P-M02) B288002S-1C-1

    SPC564A80

    Abstract: njd287 SPC564A80L7 spc563 D65050 e200z448n3 SPC563M64 SPC564A74 philips half bridge ballast LBGA208
    Text: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units – Up to 2 integer or floating point instructions


    Original     		PDF SPC564A80B4, SPC564A80L7 32-bit e200z4 24-entry SPC564A80 njd287 SPC564A80L7 spc563 D65050 e200z448n3 SPC563M64 SPC564A74 philips half bridge ballast LBGA208

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    STMicroelectronics marking code date

    Abstract: BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics BGA288 Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CMG-IMG/04/457 INTRODUCTION OF KINSUS SUBSTRATE LEAD FREE PACKAGE FOR ST20DC2 2004/02/26 PCN CMG-IMG/04/457 Product Family /Commercial Product ST20DC2 Type Of Change Package assembly material change Reason For Change


    Original     		PDF CMG-IMG/04/457 ST20DC2 ST20DC2. BGA288 19x19 25-Jun-2004 19-Apr-2004 18-Jun-2004 STMicroelectronics marking code date BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
    Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3


    Original     		PDF LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P

    Untitled

    Abstract: No abstract text available
    Text: SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution


    Original     		PDF SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit e200z4 LBGA208 PBGA324 LQFP176

    SPC564A70

    Abstract: SPC564A74 SPC564A80B4 SPC563M64 INTERRUPT VECTORS SPC564A74B4 SPC564A SPC56 manual e200z448
    Text: SPC564A74B4, SPC564A74L7 SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution


    Original     		PDF SPC564A74B4, SPC564A74L7 SPC564A80B4, SPC564A80L7 32-bit e200z4 24-entry SPC564A70 SPC564A74 SPC564A80B4 SPC563M64 INTERRUPT VECTORS SPC564A74B4 SPC564A SPC56 manual e200z448

    SPC564A80

    Abstract: SPC564A70 AN2711 e200z4 SPC564A74B4CF D1875
    Text: SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution


    Original     		PDF SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit e200z4 24-entry SPC564A80 SPC564A70 AN2711 SPC564A74B4CF D1875

    PTC SY 16P

    Abstract: jl audio 500 1 schematics OTP-538 C96F MDC 3023 A03401 yt 1208 diode UAA 1004 DP 3CK10 08TI
    Text: 8170 System Block Diagram . . f0 r . » n-nn irn-ri Pentium 4 . W ill a m e ttel North w ood C.P.U. ADM 1021 Micro-FCPGA 478 pin Thermal Recorder TPS2211 1C CARD Socket CN T- o o c < Q o CO Power Switch


    OCR Scan     		PDF TPS2211 TSB41AB1 PQFP64 ClAl1394 2N7002 7NT002 PMS33 PTC SY 16P jl audio 500 1 schematics OTP-538 C96F MDC 3023 A03401 yt 1208 diode UAA 1004 DP 3CK10 08TI