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    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HSSON18 package SOT810-1 0.55 1.55 1.00 11x 2.55 4.80 6.40 9.00 9.25 8.30 3.40 1.50 0.95 1.05 1.80 3.40 4.60 7.00 solder lands 7.80 10.20 solder resist 0.075 clearance


    Original     		PDF HSSON18 OT810-1 OT810-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b v M C A B w M C 9 y y1 C L terminal 1 index area Eh


    Original     		PDF HSSON18: OT810-1

    HSSON18

    Abstract: sot810
    Text: Package outline Philips Semiconductors HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b 9 y y1 C v M C A B w M C L terminal 1


    Original     		PDF HSSON18: OT810-1 HSSON18 sot810