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    SOT751 Search Results

    SOT751 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT751-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm Original PDF
    SOT751-1 NXP Semiconductors Footprint for reflow soldering SOT751-1 Original PDF
    SOT751-2 NXP Semiconductors Footprint for reflow soldering SOT751-2 Original PDF
    SOT751-2 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm Original PDF

    SOT751 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sot751

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J


    Original     		PDF LFBGA80: OT751-1 sot751

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA80 OT751-2 OT751-2

    sot751

    Abstract: No abstract text available
    Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A


    Original     		PDF LFBGA80: OT751-2 sot751

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA80 OT751-1 OT751-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2


    Original     		PDF LFBGA80: OT751-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e


    Original     		PDF OT751-1 LFBGA80:

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H


    Original     		PDF OT751-1 LFBGA80:

    bgb102

    Abstract: block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 PCF87852
    Text: PCF87852 Bluetooth baseband controller Rev. 01 — 23 April 2004 Preliminary data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth system


    Original     		PDF PCF87852 PCF87852 bgb102 block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101