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    SOT711 Search Results

    SOT711 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT711-1 NXP Semiconductors Plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm Original PDF
    SOT711-1 NXP Semiconductors Footprint for reflow soldering SOT711-1 Original PDF
    SOT711-2 NXP Semiconductors Plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA240: OT711-2 MS-034

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA240 package SOT711-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA240 OT711-1 OT711-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA240: OT711-1 MS-034 IC-7315-001

    BGA240

    Abstract: MS-034 BGA-240 sot711
    Text: Package outline Philips Semiconductors BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F E D C B A shape


    Original     		PDF BGA240: OT711-2 MS-034 BGA240 MS-034 BGA-240 sot711

    BGA240

    Abstract: IC-7315-001 BGA-240 MS 034 MS-034 sot711
    Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F


    Original     		PDF BGA240: OT711-1 MS-034 IC-7315-001 BGA240 IC-7315-001 BGA-240 MS 034 MS-034 sot711