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    BGA240 Search Results

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    BGA240 Price and Stock

    Schneider Electric BGA24090Y1

    MOLDED CASE CIRCUIT BRKR 480Y/27
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    DigiKey BGA24090Y1 Box 1
    • 1 $1129
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    Schneider Electric BGA24015Y1

    MOLDED CASE CIRCUIT BRKR 480Y/27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA24015Y1 Box 1
    • 1 $964.01
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    • 100 $964.01
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    Schneider Electric BGA24070Y1

    MOLDED CASE CIRCUIT BRKR 480Y/27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA24070Y1 Box 1
    • 1 $1129
    • 10 $1129
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    Schneider Electric BGA24020Y1

    MOLDED CASE CIRCUIT BRKR 480Y/27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA24020Y1 Box 1
    • 1 $964.01
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    Schneider Electric BGA24050Y1

    MOLDED CASE CIRCUIT BRKR 480Y/27
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BGA24050Y1 Box 1
    • 1 $964.01
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    • 100 $964.01
    • 1000 $964.01
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    BGA240 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA240: OT711-2 MS-034

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA240 package SOT711-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA240 OT711-1 OT711-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T R e P N M L K e2 J H G F E D B C A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA240: OT711-1 MS-034 IC-7315-001

    BGA240

    Abstract: MS-034 BGA-240 sot711
    Text: Package outline Philips Semiconductors BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F E D C B A shape


    Original     		PDF BGA240: OT711-2 MS-034 BGA240 MS-034 BGA-240 sot711

    19X19

    Abstract: SF-BGA240E-B-11 land pattern BGA 0,50
    Text: D Package Code: BGA240E .0225" dia. tooling holes X2 non plated (optional) C 0.914mm See BGA pattern code to the right for actual pattern layout Y 0.533mm X 22.86mm Top View (reference only) 0.025" dia. pad 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA240E 914mm 533mm 762mm 508mm FR4/G10 SF-BGA240E-B-11 19X19 land pattern BGA 0,50

    BGA240

    Abstract: IC-7315-001 BGA-240 MS 034 MS-034 sot711
    Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T R e P N M L K e2 J H G F


    Original     		PDF BGA240: OT711-1 MS-034 IC-7315-001 BGA240 IC-7315-001 BGA-240 MS 034 MS-034 sot711

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    FSQ510 Equivalent

    Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
    Text: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178


    Original     		PDF GP-20) FSQ510 Equivalent BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2

    BGA-169

    Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
    Text: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический


    Original     		PDF SOIC-14 SOIC-16 05x10 BGA-100 16x16 BGA-86 25x17 BGA-121/196/68 15x15 BGA-144 BGA-169 TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256

    DIPSW10

    Abstract: BCM5221KPT QS3V245Q mj-179p MJ179P BCM5221 IC197-4807 MS12AAP1 MIC29302BU lcx08
    Text: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM71-10401-1E FR FAMILY EVALUATION BOARD For MB91401 MB91941EB REFERENCE MANUAL PREFACE • Overview This manual is a reference manual for the evaluation board part number: MB91941EB intended to evaluate and develop software for the network security LSI (MB91401) incorporating a Fujitsu's proprietary 32-bit RISC CPU core, 10/100Base-T MAC controller, and encryption/authentication macros.


    Original     		PDF CM71-10401-1E MB91401 MB91941EB MB91941EB) MB91401) 32-bit 10/100Base-T MB91401, MB91401. DIPSW10 BCM5221KPT QS3V245Q mj-179p MJ179P BCM5221 IC197-4807 MS12AAP1 MIC29302BU lcx08

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    MAR8

    Abstract: came dir10 BMP31 japanese TRANSISTOR SUBSTITUTION DATA BOOK MB91401 Philips ID33 A12-212 smi 290 servo bit319 EXD03
    Text: FUJITSU SEMICONDUCTOR Prelminary 2004.11.12 CONTROLLER MANUAL FR 32 bit Microcontroller MB91401 Hardware Manual FR 32 bit Microcontroller MB91401 Hardware Manual FUJITSU LIMITED Preface • Purpose and object reader in this book Thank you very much for giving patronage that is more special than the much


    Original     		PDF MB91401 dir10 dir10/4 MAR8 came dir10 BMP31 japanese TRANSISTOR SUBSTITUTION DATA BOOK MB91401 Philips ID33 A12-212 smi 290 servo bit319 EXD03

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


    Original     		PDF

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
    Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3


    Original     		PDF LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P

    Untitled

    Abstract: No abstract text available
    Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 240 PIN PLASTIC BGA-240P-M01 240-pin plastic FBGA Ball pitch 0.50 mm Ball matrix 19 Package width x package length 10.00 × 10.00 mm Sealing method Plastic mold Mounting height 1.13 + 0.20 / −0.10 mm


    Original     		PDF BGA-240P-M01 240-pin BGA-240P-M01) B240001S-2C-2

    MAR8

    Abstract: A12-212 600 MB91401 icd3 schematic exd6 130 nm CMOS standard cell library fujitsu BGA-240P-M01
    Text: Prelminary 2004.11.12 FUJITSU SEMICONDUCTOR DATA SHEET 32-Bit Proprietary Microcontroller LSI Network Security System MB91401 • DESCRIPTION The MB91401 is a network security LSI incorporating a Fujitsu’s 32-bit, FR-family RISC microcontroller with 10/


    Original     		PDF 32-Bit MB91401 MB91401 32-bit, 100Base-T MAR8 A12-212 600 icd3 schematic exd6 130 nm CMOS standard cell library fujitsu BGA-240P-M01