Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT63 Search Results

    SOT63 Datasheets (26)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT630-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm Original PDF
    SOT630-1 NXP Semiconductors Footprint for reflow soldering SOT630-1 Original PDF
    SOT630-2 NXP Semiconductors Footprint for reflow soldering SOT630-2 Original PDF
    SOT631-1 NXP Semiconductors Footprint for reflow soldering SOT631-1 Original PDF
    SOT631-2 NXP Semiconductors Footprint for reflow soldering SOT631-2 Original PDF
    SOT631-3 NXP Semiconductors LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm Original PDF
    SOT631-4 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm Original PDF
    SOT632a NXP Semiconductors leadless surface mounted package; plastic cap; 12 terminations Original PDF
    SOT633-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT634a NXP Semiconductors Flanged ceramic package; 2 mounting holes; 2 leads Original PDF
    SOT634A_112 NXP Semiconductors CDFM2; blister pack; standard product orientation 12NC ending 112 Original PDF
    SOT635-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink Original PDF
    SOT635-1 NXP Semiconductors Footprint for reflow soldering SOT635-1 Original PDF
    SOT636-1 NXP Semiconductors Footprint for reflow soldering SOT636-1 Original PDF
    SOT636-1 NXP Semiconductors Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink Original PDF
    SOT637 NXP Semiconductors Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads Original PDF
    SOT638-1 NXP Semiconductors Footprint for reflow soldering SOT638-1 Original PDF
    SOT638-1 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-2 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-2 NXP Semiconductors Footprint for reflow soldering SOT638-2 Original PDF

    SOT63 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF LFBGA208 OT631-2 OT631-2

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA388 package SOT636-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF HBGA388 OT636-1 OT636-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HTQFP100 OT638-1 OT638-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA112: plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm D SOT630-1 A B ball A1 index area A A2 E A1 detail X C e1 e y1 C ∅v M C A B b 1/2 e y ∅w M C M L K e J H G e2 F E 1/2 e D C B A ball A1 index area


    Original     		PDF TFBGA112: OT630-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD


    Original     		PDF HTQFP100: OT638-4 MS-026 sot638-4

    Untitled

    Abstract: No abstract text available
    Text: Package outline Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads SOT637 HE1 E A F1 Q1 R L1 bp1 F D D3 1 D2 L D3 (1) A A HE SENSOR DIE POSITION centre of reading point D1 * B L4(1) Q1 L3 A L2 1 2 3 4 5 bp e v A 0.4 c bp2 HE2 E1


    Original     		PDF OT637

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e


    Original     		PDF HTQFP100: OT638-3 MS-026

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2 Eh A3 A1 A pin 1 index θ Lp L detail X


    Original     		PDF HTSSOP38: OT633-1 MO-153

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M AJ AG AC


    Original     		PDF HBGA596: OT635-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp


    Original     		PDF HTQFP100: OT638-1 MS-026

    HTQFP100

    Abstract: a7551
    Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index


    Original     		PDF HTQFP100: OT638-1 HTQFP100 a7551

    HBCC16

    Abstract: SOT639-2 sot639
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C


    Original     		PDF HBCC16: OT639-2 MO-217 HBCC16 SOT639-2 sot639

    HBCC16

    Abstract: sot639
    Text: PDF: 2000 Aug 30 Philips Semiconductors Package outline HBCC16: plastic, heatsink bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOT639-1 x B D b1 w M w M Pin A1 index area b E b3 w M b2 w M detail X x C A e1 B e C y v A e2 E1 e4 1 16 D1 A1 X e3 A2


    Original     		PDF HBCC16: OT639-1 MO-217 HBCC16 sot639

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF HBGA596 OT635-1 OT635-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HTQFP100 OT638-3

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2002 Jan 18 Philips Semiconductors Package outline Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads SOT637 HE1 A E F1 Q1 R L1 bp1 F D D3 D2 L D3 A B HE SENSOR DIE POSITION centre of reading point D1 * L4 L3 L2 1 2 3 4 5 bp


    Original     		PDF OT637

    HTSSOP38

    Abstract: No abstract text available
    Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2


    Original     		PDF HTSSOP38: OT633-1 MO-153 HTSSOP38

    philips l 6.1

    Abstract: HTQFP100 MS-026 sot638
    Text: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index L detail X


    Original     		PDF HTQFP100: OT638-1 MS-026 philips l 6.1 HTQFP100 MS-026 sot638

    HBCC16

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 18 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b v M C A B w M C x B D SOT639-1 terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C detail X x C


    Original     		PDF HBCC16: OT639-1 MO-217 HBCC16

    HTSSOP-38

    Abstract: sot633
    Text: PDF: 2000 Nov 13 Philips Semiconductors Package outline HTSSOP38: plastic, heatsink thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm SOT633-1 E D A X c y heatsink side HE v M A Dh Z 38 20 A2 Eh A3 A1 A pin 1 index θ Lp


    Original     		PDF HTSSOP38: OT633-1 MO-153 HTSSOP-38 sot633

    BGY282

    Abstract: ECEV1VA101P GSM1800 GSM900 v-band P925
    Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2001 Dec 04 Philips Semiconductors Preliminary specification dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A


    Original     		PDF M3D727 BGY282 GSM900 GSM1800 OT632A GSM900) BGY282 ECEV1VA101P GSM1800 v-band P925

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e N M L K e2 J H G F E D C B A ball A1 index area


    Original     		PDF LFBGA208: OT631-3 MO-205

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD


    Original     		PDF HTQFP100: OT638-6 sot638-6

    Untitled

    Abstract: No abstract text available
    Text: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT634A D A F 3 D1 U1 B q C c 1 L p U2 E1 E w1 M A M B M A 2 L Q w2 M C M b 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A b c D D1 mm


    Original     		PDF OT634A