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Abstract: No abstract text available
Text: Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M AJ AG AC
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HBGA596:
OT635-1
MS-034
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA596 package SOT635-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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HBGA596
OT635-1
OT635-1
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MS-034
Abstract: No abstract text available
Text: PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2 A1 detail X C e1 e 1/2 ∅v M b e ∅w M y y1 C
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HBGA596:
OT635-1
MS-034
MS-034
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MS-034
Abstract: sot635 MS 034
Text: PDF: 2001 Apr 24 Philips Semiconductors Package outline HBGA596: plastic, heatsink ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT635-1 B D A D1 ball A1 index area A ∅ j E1 E A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A AK AJ AG AE AC
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Original
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PDF
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HBGA596:
OT635-1
MS-034
MS-034
sot635
MS 034
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