Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA388 package SOT636-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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HBGA388
OT636-1
OT636-1
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PDF
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MS-034
Abstract: SOT636-1
Text: PDF: 2001 Dec 13 Philips Semiconductors Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X e1 C 1/2 e e ∅v M C A B b AD AB y
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Original
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HBGA388:
OT636-1
MS-034
MS-034
SOT636-1
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PDF
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MS-034
Abstract: sot636 SOT636-1
Text: PDF: 2001 Apr 18 Philips Semiconductors Package outline HBGA388: plastic, heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT636-1 B D A D1 ball A1 index area A ∅ j E1 E A2 A1 detail X e1 C v M B b e ∅w M v M A y y1 C AF AE AC AD AB
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Original
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HBGA388:
OT636-1
MS-034
MS-034
sot636
SOT636-1
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PDF
|
Untitled
Abstract: No abstract text available
Text: Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D1 ball A1 index area A j A2 A1 E1 E detail X e1 C 1/2 e e b ∅v M C A B AD AB Y y y1 C ∅w M C AF AE AC e AA V T P M K
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Original
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HBGA388:
OT636-1
MS-034
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PDF
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