SOT542 Search Results

SOT542 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT542-1		NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm		Original	PDF

SOT542 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
TFBGA56 Abstract: MO-195 TFBGA-56 Text: PDF: 2002 Jun 10 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2	Original	TFBGA56: OT542-1 MO-195 TFBGA56 MO-195 TFBGA-56	PDF
Untitled Abstract: No abstract text available Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A	Original	TFBGA56: OT542-1	PDF
Untitled Abstract: No abstract text available Text: Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3	Original	TFBGA56: OT542-1 MO-195	PDF
sot542 Abstract: No abstract text available Text: PDF: 1999 Jun 08 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm SOT542-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4 5 6 7 8	Original	TFBGA56: OT542-1 sot542	PDF
MO-195 Abstract: TFBGA56 TFBGA-56 Text: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A	Original	TFBGA56: OT542-1 MO-195 MO-195 TFBGA56 TFBGA-56	PDF
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316	PDF
handbook philips ic26 packaging Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF