Untitled
Abstract: No abstract text available
Text: SOT538A CDIP2; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 29 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning
|
Original
|
PDF
|
OT538A
msc071
OT538A
|
Untitled
Abstract: No abstract text available
Text: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G
|
Original
|
PDF
|
BGA388:
OT532-2
MS-034
|
Untitled
Abstract: No abstract text available
Text: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x
|
Original
|
PDF
|
BGA316:
OT531-1
MS-034
|
Untitled
Abstract: No abstract text available
Text: Package outline Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 5 10 mm scale Dimensions Unit 1 A b 4.7 11.81 4.2 11.56 w2 w3 0.25 0.25 max 0.185 0.465 0.007 1.242 1.241 0.374 0.375 0.069 0.674 1.005 0.137 0.089 1.275 0.405
|
Original
|
PDF
|
OT539B
50nsions
sot539b
|
Untitled
Abstract: No abstract text available
Text: Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 E A D X c y HE v M A Z 8 5 A2 A A3 A1 pin 1 index θ Lp L detail X 1 4 e w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.
|
Original
|
PDF
|
OT530-1
MO-153
|
Untitled
Abstract: No abstract text available
Text: Package outline Plastic single-ended package IPAK ; 3 leads (in-line) SOT533 E A E1 A1 D1 mounting base D2 L1 Q L 1 2 3 e1 w b c M e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D1 D2 E mm 2.38 2.22 0.93 0.46 0.89 0.71 0.56 0.46
|
Original
|
PDF
|
OT533
O-251
|
PHE13002AU
Abstract: No abstract text available
Text: Philips Semiconductors Product specification Silicon Diffused Power Transistor PHE13002AU GENERAL DESCRIPTION High-voltage, high-speed planar-passivated npn power switching transistor in the SOT533 envelope intended for use in high frequency electronic lighting ballast applications, converters and inverters, etc.
|
Original
|
PDF
|
PHE13002AU
OT533
PHE13002AU
|
philips H1
Abstract: sot539a
Text: PDF: 1999 Dec 09 Philips Semiconductors Package outline Flanged balanced LDMOST package; 2 mounting holes; 4 leads SOT539A Package under development Philips Semiconductors reserves the right to make changes without notice. D A F D1 U1 B q C w2 M C M H1 1 c
|
Original
|
PDF
|
OT539A
philips H1
sot539a
|
sot536
Abstract: No abstract text available
Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm SOT536-1 D ball A1 index area A2 A E A1 detail X b A ∅w M ZD e y v A ZE T R P N M L K J H G F E D
|
Original
|
PDF
|
LFBGA96:
OT536-1
sot536
|
M3D438
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF2043 UHF power LDMOS transistor Objective specification Supersedes data of 1999 Apr 01 2000 Feb 17 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF2043 FEATURES PINNING - SOT538A
|
Original
|
PDF
|
M3D438
BLF2043
BLF2043
OT538A
603516/02/pp8
M3D438
|
Untitled
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D427 BLF2048 UHF power LDMOS transistor Objective specification 1998 Nov 19 Objective specification UHF power LDMOS transistor BLF2048 PINNING - SOT539A FEATURES • High power gain PIN DESCRIPTION • Easy power control
|
Original
|
PDF
|
M3D427
BLF2048
OT539A
SCA60
125108/00/02/pp8
|
Capacitor Tantal SMD
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D427 BLF2048 UHF push-pull power LDMOS transistor Preliminary specification 1999 Nov 23 Preliminary specification UHF push-pull power LDMOS transistor BLF2048 PINNING - SOT539A FEATURES • High power gain PIN DESCRIPTION
|
Original
|
PDF
|
M3D427
BLF2048
OT539A)
125108/00/01/pp11
Capacitor Tantal SMD
|
LFBGA64
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C
|
Original
|
PDF
|
LFBGA64:
OT534-1
LFBGA64
|
S 1040 smd
Abstract: multilayer ceramic capacitor philips 200B BLA1011-2 MGU487
Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLA1011-2 Avionics LDMOS transistor Product specification Supersedes data of 2001 Jun 07 2001 Nov 05 Philips Semiconductors Product specification Avionics LDMOS transistor BLA1011-2 FEATURES PINNING - SOT538A
|
Original
|
PDF
|
M3D438
BLA1011-2
OT538A
SCA73
613524/02/pp8
S 1040 smd
multilayer ceramic capacitor philips
200B
BLA1011-2
MGU487
|
|
|
sot539bpo
Abstract: No abstract text available
Text: Package outline Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 5 10 mm scale Dimensions Unit 1 A b 4.7 11.81 4.2 11.56 c D D1 E E1 0.18 31.55 31.52 9.5 9.53 0.10 30.94 30.96 9.3 9.27 e F H
|
Original
|
PDF
|
OT539B
OT539B
sot539b
sot539bpo
|
MS-034
Abstract: SOT532-1 BGA388
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y
|
Original
|
PDF
|
BGA388:
OT532-1
MS-034
MS-034
SOT532-1
BGA388
|
LFBGA64
Abstract: No abstract text available
Text: PDF: 2003 Feb 05 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e H e G F
|
Original
|
PDF
|
LFBGA64:
OT534-1
LFBGA64
|
BGA316
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K
|
Original
|
PDF
|
BGA316:
OT531-1
MS-034
BGA316
MS-034
|
blf2043
Abstract: TRANSISTOR D 471
Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF2043 UHF power LDMOS transistor Objective specification Supersedes data of 2000 Feb 17 2000 Feb 23 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF2043 FEATURES PINNING - SOT538A
|
Original
|
PDF
|
M3D438
BLF2043
OT538A
603516/03/pp8
blf2043
TRANSISTOR D 471
|
TRANSISTOR D 471
Abstract: BLF1043 SOT538A
Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF1043 UHF power LDMOS transistor Objective specification Supersedes data of 2000 Feb 17 2000 Feb 23 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF1043 FEATURES PINNING - SOT538A
|
Original
|
PDF
|
M3D438
BLF1043
OT538A
603516/02/pp8
TRANSISTOR D 471
BLF1043
SOT538A
|
MCE021
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D438 BLF2043 UHF power LDMOS transistor Product specification Supersedes data of 2002 Jul 02 2002 Sep 10 Philips Semiconductors Product specification UHF power LDMOS transistor BLF2043 PINNING - SOT538A FEATURES • Easy power control
|
Original
|
PDF
|
M3D438
BLF2043
SCA74
613524/05/pp12
MCE021
|
sot538a
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Ceramic surface mounted package; 2 leads SOT538A Package under development D Philips Semiconductors reserves the right to make changes without notice. A 3 D1 D2 B c 1 L E2 H E1 E 2 α w1 M B M b Q 2.5
|
Original
|
PDF
|
OT538A
sot538a
|
SOT538A
Abstract: 0,047 63 iec 157 1b
Text: PDF: 2000 Mar 08 Philips Semiconductors Package outline Ceramic surface mounted package; 2 leads SOT538A D A 3 D1 D2 B c 1 L E2 H E1 E 2 α w1 M B M b Q 2.5 5 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A
|
Original
|
PDF
|
OT538A
SOT538A
0,047 63
iec 157 1b
|
388 transistor
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K
|
Original
|
PDF
|
BGA388:
OT532-1
388 transistor
|
