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    SOT52 Price and Stock

    PanJit Semiconductor 2N7002KTB-R1-00001

    MOSFETs SOT523 N CHAN 60V
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    TTI 2N7002KTB-R1-00001 Reel 48,000 4,000
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    PanJit Semiconductor PJE8403-R1-00001

    MOSFETs SOT523 P CHAN 20V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PJE8403-R1-00001 Reel 48,000 4,000
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    PanJit Semiconductor PJE8405-R1-00001

    MOSFETs SOT523 P CHAN 30V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PJE8405-R1-00001 Reel 40,000 4,000
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    PanJit Semiconductor PJE138K-R1-00001

    MOSFETs SOT523 N CHAN 50V
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    TTI PJE138K-R1-00001 Reel 32,000 4,000
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    PanJit Semiconductor PJE8408-R1-00001

    MOSFETs SOT523 N CHAN 20V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PJE8408-R1-00001 Reel 24,000 4,000
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    SOT52 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT521-1 NXP Semiconductors Plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) Original PDF
    SOT523-1 NXP Semiconductors Plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad Original PDF
    SOT524-1 NXP Semiconductors Plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad Original PDF
    SOT527-1 Philips Semiconductors Package outline Original PDF
    SOT527-1_118 NXP Semiconductors HTSSOP20; reel pack; standard product orientation 12NCending 118 Original PDF
    SOT527-1_518 NXP Semiconductors HTSSOP20; standard orientation; 12NC ending 518 Original PDF
    SOT528-1 NXP Semiconductors Plastic rectangular-DIL-bent-SIL power package; 13 leads Original PDF
    SOT528-2 NXP Semiconductors Plastic rectangular-DIL-bent-SIL power package; 13 leads Original PDF

    SOT52 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A2 Eh pin 1 index A 3 A A1 θ Lp L 1 10 e detail X w M bp 2.5


    Original     		PDF HTSSOP20: OT527-1 MO-153

    Untitled

    Abstract: No abstract text available
    Text: Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z 5 v M e2 m w M bp e c 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF DBS27P: OT521-1

    SOT521-1

    Abstract: DBS27P
    Text: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm


    Original     		PDF DBS27P: OT521-1 SOT521-1 DBS27P

    sot527

    Abstract: 01z1
    Text: PDF: 1999 Nov 12 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M


    Original     		PDF HTSSOP20: OT527-1 OT527-1 sot527 01z1

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad , , non-concave x SOT523-1 q1 Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q


    Original     		PDF OT523-1 OT523-1

    DBS27P

    Abstract: sot521
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm


    Original     		PDF DBS27P: OT521-1 DBS27P sot521

    SOT523

    Abstract: SOT523-1
    Text: PDF: 2000 Jul 04 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp


    Original     		PDF OT523-1 SOT523 SOT523-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z Q w M bp e 5 scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF OT523-1

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF RDBS13P: OT528-2

    HTSSOP20

    Abstract: m.a date sheet
    Text: PDF: 2000 Jul 13 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M


    Original     		PDF HTSSOP20: OT527-1 HTSSOP20 m.a date sheet

    ice 38156

    Abstract: 52169 TARF1504E 6012 transistor 20449 163462 76129 62639 160505 67551
    Text: TARF1504E NPN Planer RF TRANSISTOR SOT-523 □ DESCRIPTION unit : mm The TARF1504E is a low Noise figure and good associated gain performance at UHF, VHF and Microwave frequencies It is suitable for a high density surface mount since transistor has been SOT523 package


    Original     		PDF TARF1504E OT-523 TARF1504E OT523 VC00GHz 800GHz 000GHz 200GHz 400GHz ice 38156 52169 6012 transistor 20449 163462 76129 62639 160505 67551

    Untitled

    Abstract: No abstract text available
    Text: DTA114EM/EE/EUA/ECA/ESA Taiwan Semiconductor Small Signal Product PNP Digital Transistor FEATURES - Built-in bias resistors enable the configuration of SOT523 /SOT323/SOT23 an inverter circuit without connecting external input resistor see equivalent circuit .


    Original     		PDF DTA114EM/EE/EUA/ECA/ESA OT523 /SOT323/SOT23 OT-723 OT-523 S1402004

    DBS7P

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp


    Original     		PDF OT524-1 DBS7P

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp


    Original     		PDF OT523-1

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2000 Jul 04 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp


    Original     		PDF OT524-1

    sot528

    Abstract: No abstract text available
    Text: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF RDBS13P: OT528-2 sot528

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2


    Original     		PDF RDBS13P: OT528-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2


    Original     		PDF RDBS13P: OT528-2

    A 69157

    Abstract: 276-145 transistor 585-42 ice 0565 151-237 74292 ic 74210 16-878-1 TARF1503E 74288
    Text: TARF1503E NPN Planer RF TRANSISTOR SOT-523 □ DESCRIPTION unit : mm The TARF1503E is a low Noise figure and good associated gain performance at UHF,VHF and Microwave frequencies It is suitable for a high density surface mount since transistor has been SOT523 package


    Original     		PDF TARF1503E OT-523 TARF1503E OT523 10GHz 800GHz 000GHz 200GHz 400GHz A 69157 276-145 transistor 585-42 ice 0565 151-237 74292 ic 74210 16-878-1 74288

    transistor c143

    Abstract: C143 Transistor ze 003 ic ZUA SOT23 ze 003 zua SOT-23 ZE SOT-23 marking CODE ZUA SOT23
    Text: DTC143 ZM/ZE/ZUA/ZCA/ZSA Taiwan Semiconductor Small Signal Product PNP Small Signal Transistor FEATURES - Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistor SOT523/SOT323/SOT23 see equivalent circuit


    Original     		PDF DTC143 OT523/SOT323/SOT23 OT-723 S1404021 transistor c143 C143 Transistor ze 003 ic ZUA SOT23 ze 003 zua SOT-23 ZE SOT-23 marking CODE ZUA SOT23

    sot524

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad , , non-concave x SOT524-1 q1 Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q


    Original     		PDF OT524-1 OT524-1 sot524

    HTSSOP20

    Abstract: No abstract text available
    Text: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 518 Rev. 1 — 23 October 2012 Packing information 1. Packing method %DUFRGH ODEHO %DJ 6' SULQW 0RLVWXUH FDXWLRQ SULQW 7DSH %DUFRGH ODEHO 'U\DJHQW 5HODWLYH KXPLGLW\ LQGLFDWRU (6' HPERVVHG


    Original     		PDF OT527-1 HTSSOP20; OT527-1 HTSSOP20

    Untitled

    Abstract: No abstract text available
    Text: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 118 Rev. 1 — 6 November 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal


    Original     		PDF OT527-1 HTSSOP20; msc074 OT527-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 Q w M bp e 5 scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF OT524-1