Untitled
Abstract: No abstract text available
Text: Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A2 Eh pin 1 index A 3 A A1 θ Lp L 1 10 e detail X w M bp 2.5
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HTSSOP20:
OT527-1
MO-153
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sot527
Abstract: 01z1
Text: PDF: 1999 Nov 12 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M
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HTSSOP20:
OT527-1
OT527-1
sot527
01z1
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HTSSOP20
Abstract: m.a date sheet
Text: PDF: 2000 Jul 13 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M
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HTSSOP20:
OT527-1
HTSSOP20
m.a date sheet
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HTSSOP20
Abstract: No abstract text available
Text: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 518 Rev. 1 — 23 October 2012 Packing information 1. Packing method %DUFRGH ODEHO %DJ 6' SULQW 0RLVWXUH FDXWLRQ SULQW 7DSH %DUFRGH ODEHO 'U\DJHQW 5HODWLYH KXPLGLW\ LQGLFDWRU (6' HPERVVHG
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OT527-1
HTSSOP20;
OT527-1
HTSSOP20
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Untitled
Abstract: No abstract text available
Text: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 118 Rev. 1 — 6 November 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal
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OT527-1
HTSSOP20;
msc074
OT527-1
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HTSSOP-20
Abstract: HTSSOP20
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index
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HTSSOP20:
OT527-1
HTSSOP-20
HTSSOP20
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TDA1517ATW
Abstract: HTSSOP20
Text: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 2001 Apr 17 NXP Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES • Electrostatic discharge protection
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TDA1517ATW
753503/02/pp19
TDA1517ATW
HTSSOP20
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Preliminary specification File under Integrated Circuits, IC01 2001 Feb 14 Philips Semiconductors Preliminary specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES
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TDA1517ATW
753503/01/pp20
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smd diode HB
Abstract: BA891 CGY2014ATW HTSSOP20 philips application
Text: INTEGRATED CIRCUITS DATA SHEET CGY2014ATW GSM/DCS/PCS power amplifier Preliminary specification File under Integrated Circuits, IC17 2000 Nov 28 Philips Semiconductors Preliminary specification GSM/DCS/PCS power amplifier CGY2014ATW FEATURES GENERAL DESCRIPTION
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CGY2014ATW
CGY2014ATW
403506/01/pp12
smd diode HB
BA891
HTSSOP20
philips application
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tda 8139
Abstract: IC tda 2140 1517ATW
Text: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 File under Integrated Circuits, IC01 2001 Apr 17 Philips Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier
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TDA1517ATW
753503/02/pp20
tda 8139
IC tda 2140
1517ATW
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fca173
Abstract: h2lb FCA175 BA891 CGY2014TT philips rf manual HTSSOP20
Text: INTEGRATED CIRCUITS DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Product specification Supersedes data of 2000 Apr 11 File under Integrated Circuits, IC17 2000 Oct 16 Philips Semiconductors Product specification GSM/DCS/PCS power amplifier CGY2014TT FEATURES
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CGY2014TT
CGY2014TT
403506/02/pp16
fca173
h2lb
FCA175
BA891
philips rf manual
HTSSOP20
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tda8921th
Abstract: TDA8947J TDA8947 BTL audio 50W HSOP24 TDA8944J tda8925st TDA7056 TDA8920TH tda8921
Text: Semiconductors Amplifier overview Philips Semiconductors has a strong track record in audio solutions, built on our extensive in-house experience and world-leading products such as our audio amplifiers.With audio being integrated into more and more applications, we have expanded our focus to develop flexible, highquality audio amplifiers that can be easily integrated into any system.
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LXA 102 103
Abstract: TEA1211TW HTSSOP20 MBL513
Text: INTEGRATED CIRCUITS DATA SHEET TEA1211TW High efficiency auto-up/down DC-to-DC converter Objective specification 2002 Jul 24 Philips Semiconductors Objective specification High efficiency auto-up/down DC-to-DC converter CONTENTS 1 FEATURES 2 APPLICATIONS 3
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TEA1211TW
SCA74
403502/01/pp24
LXA 102 103
TEA1211TW
HTSSOP20
MBL513
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DAT TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 2001 Apr 17 NXP Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES • Electrostatic discharge protection
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TDA1517ATW
753503/02/pp19
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fca173
Abstract: BA891 Philips DC Power Amplifier 380 CGY2014TT HTSSOP20 Philips DATA Handbook system
Text: INTEGRATED CIRCUITS DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Preliminary specification File under Integrated Circuits, IC17 2000 Apr 11 Philips Semiconductors Preliminary specification GSM/DCS/PCS power amplifier CGY2014TT FEATURES GENERAL DESCRIPTION
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CGY2014TT
CGY2014TT
403506/01/pp16
fca173
BA891
Philips DC Power Amplifier 380
HTSSOP20
Philips DATA Handbook system
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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