SOT514
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C AF AE e AD AC AB AA Y
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BGA492:
OT514-1
MS-034
SOT514
MS-034
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sot514
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm SOT514-1 D D1 ball A1 index A2 A A1 E1 E detail X k A k b e ZD ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D
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BGA492:
OT514-1
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BGA492
Abstract: SOT514
Text: Philips Semiconductors Package outlines BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm 1998 Apr 08 641 SOT514-1
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BGA492:
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BGA492
SOT514
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SOT514
Abstract: MO-151
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X k k e1 b e C v M B ∅w M v M A AF AE AD AC AB AA Y W V U T R P N
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BGA492:
OT514-1
MO-151
SOT514
MO-151
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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f9222
Abstract: philips F2110 F8222 f7326 f9223 F11216 f8113 F9328 F7328 IEC C13 pinout
Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 01 IC27 Data Handbook Philips Semiconductors 1998 Sep 28 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
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PZ3960C/PZ3960N
CPLD--960
PZ3960
f9222
philips F2110
F8222
f7326
f9223
F11216
f8113
F9328
F7328
IEC C13 pinout
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F1022
Abstract: f1031 MC19 PZ3960C7EB PZ3960N8EB sot514 F929 F926 Philips F423 f811
Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N
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PZ3960C/PZ3960N
CPLD--960
PZ3960
F1022
f1031
MC19
PZ3960C7EB
PZ3960N8EB
sot514
F929
F926
Philips F423
f811
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manchester verilog decoder
Abstract: Philips Semiconductors Selection Guide pzlcp AN057
Text: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices CPLDs Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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F9222
Abstract: 05464 MC19 PZ3960C7EB PZ3960N8EB F9328 F9221 f9114 F6222 F9220
Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 28 IC27 Data Handbook Philips Semiconductors 1999 Mar 18 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
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PZ3960C/PZ3960N
CPLD--960
PZ3960
F9222
05464
MC19
PZ3960C7EB
PZ3960N8EB
F9328
F9221
f9114
F6222
F9220
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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f1031
Abstract: f422 f931 F918
Text: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3960 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21
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XCR3960
XCR3960
CPLD--960
f1031
f422
f931
F918
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS l y i E I TI im m Xilinx has acquired the entire Philips CoolRurtner Low Power CPLD Product Family, For more technical or sales information^ please see; 8 £«& ^S l 8 ft « »0» X ft »« www.xillnx.com XCR3960 960 macrocell SRAM CPLD
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XCR3960
OT514-1
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f7326
Abstract: f9114 F6222
Text: [M m SlnlEET PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 21 IC27 Data Handbook Philips Semiconductors 1998 Sep 01 PHILIPS Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
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PZ3960C/PZ3960N
CPLD--960
f7326
f9114
F6222
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F5311
Abstract: F9222 f9114
Text: Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 m acrocells The PZ3960 device is a m em ber of the CoolRunner fam ily of high-density SRAM -based CPLDs Com plex Program mable Logic
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PZ3960C/PZ3960N
PZ3960
F5311
F9222
f9114
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pla macrocells
Abstract: pz3960 Signal Path designer
Text: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 May 12 PHILIPS Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N
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PZ3960C/PZ3960N
PZ3960C/PZ3960N
PZ3960
pla macrocells
Signal Path designer
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MC19
Abstract: PZ3960C7EB PZ3960N8EB 07N22 f7326 f9114
Text: Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 macrocells The PZ3960 device is a m em ber of the CoolRunner fam ily of high-density SRAM -based CPLDs Com plex Program mable Logic
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PZ3960C/PZ3960N
0000-0-9-OOÃ
MC19
PZ3960C7EB
PZ3960N8EB
07N22
f7326
f9114
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F1026V
Abstract: 2F123
Text: Preliminary specification Philips Semiconductors 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 macrocells The PZ3960 device is a member of the CoolRunner family of high-density SRAM-based CPLDs Complex Programmable Logic
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PZ3960C/PZ3960N
1-888-CoolPLD
F1026V
2F123
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