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    Abstract: LFBGA-144
    Text: PDF: 1999 Jun 09 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 10 x 10 x 1.05 mm SOT512-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A M ZE L K J H e G F E D C B A


    Original     		PDF LFBGA144: OT512-1 sot512 LFBGA-144

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original     		PDF AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50