DIP14
Abstract: DIP-14 SOT27-1 MAR111
Text: Philips Semiconductors Package outlines DIP14: plastic dual in-line package; 14 leads 300 mil 1995 Mar 11 1 SOT27-1
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DIP14:
OT27-1
DIP14
DIP-14
SOT27-1
MAR111
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sot27-1
Abstract: MO-001AA
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP14:
OT27-1
OT27-1
050G04
MO-001AA
sot27-1
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sot274
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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SDIP64:
OT274-1
OT274-1
sot274
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4330-030
Abstract: UHF amplifier module BGY201 SC09
Text: DISCRETE SEMICONDUCTORS DATA SHEET BGY201 UHF amplifier module Product specification Supersedes data of June 1994 File under Discrete Semiconductors, SC09 1996 May 22 Philips Semiconductors Product specification UHF amplifier module BGY201 FEATURES PINNING - SOT278A
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BGY201
OT278A
BGY201
4330-030
UHF amplifier module
SC09
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SSOP20 300 mil
Abstract: DIP20 SC603 Package Outline philips ic06
Text: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3
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OT27-1
OT38-4
OT146-1
OT101-1
OT222-1
OT117-1
OT96-1
OT108-1
OT355-1
MO-153AD
SSOP20 300 mil
DIP20
SC603
Package Outline philips ic06
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SDIP64
Abstract: No abstract text available
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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SDIP64:
OT274-1
MS-021
SDIP64
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MO-001
Abstract: sot27
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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DIP14:
OT27-1
77ensions)
050G04
MO-001
SC-501-14
MO-001
sot27
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT278B D A F y U q q1 A U2 E U1 p L 1 2 3 4 bp e2 e1 w M e 10 c v A Z Q 20 mm scale DIMENSIONS mm are the original dimensions
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OT278B
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sot279a
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT279A D A F 5 D1 U1 B q C w2 M C M H1 1 c 4 E1 H U2 E A 2 w1 M A M B M p 3 w3 M b Q e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions
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OT279A
51dimensions
sot279a
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MLD233
Abstract: 2322 731 2222 101 18103 transistor c5 5XL10 BLV946 ferroxcube 4322 philips 18103
Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV946 UHF power transistor Product specification Supersedes data of 1995 Jun 29 1997 Oct 30 Philips Semiconductors Product specification UHF power transistor BLV946 FEATURES PINNING - SOT273A • Internal input and output matching for easy matching,
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BLV946
OT273A
SCA55
127067/00/03/pp12
MLD233
2322 731
2222 101 18103
transistor c5
5XL10
BLV946
ferroxcube 4322
philips 18103
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Untitled
Abstract: No abstract text available
Text: Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1
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SDIP64:
OT274-1
MS-021
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Untitled
Abstract: No abstract text available
Text: Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT
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OT273A
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Untitled
Abstract: No abstract text available
Text: Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1
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SDIP42:
OT270-1
MS-020
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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SDIP42:
OT270-1
OT270-1
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MS-020
Abstract: SDIP42
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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SDIP42:
OT270-1
MS-020
MS-020
SDIP42
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sot273a
Abstract: u21a
Text: PDF: 1999 Oct 07 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions
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OT273A
sot273a
u21a
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SDIP64
Abstract: No abstract text available
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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SDIP64:
OT274-1
MS-021
SDIP64
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Untitled
Abstract: No abstract text available
Text: SOT279A CDFM4; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 16 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning
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OT279A
msc071
OT279A
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Untitled
Abstract: No abstract text available
Text: Package outline SDIP64: plastic shrink dual in-line package; 64 leads 750 mil ; face down SOT274-2 seating plane D ME A2 A L A1 e Z w b1 M c (e1) MH b 1 32 pin 1 index E 64 33 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 min A2
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SDIP64:
OT274-2
MS-021
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Untitled
Abstract: No abstract text available
Text: Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1
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Original
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DIP14:
OT27-1
050G04
MO-001
SC-501-14
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SDIP64
Abstract: 750-mil
Text: Philips Semiconductors Package outlines SDIP64: plastic shrink dual in-line package; 64 leads 750 mil 1995 Feb 04 5-9 SOT274-1
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SDIP64:
OT274-1
SDIP64
750-mil
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FERROXCUBE 4330
Abstract: FERROXCUBE 4330-030 MSM88 uhf amplifier BGY114D BGY114E HB 100B
Text: Product specification Philips Semiconductors UHF amplifier modules BGY114D; BGY114E FEATU RES PINNING - SOT278A • 12.5 V nominal supply voltage PIN DESCRIPTION • 6 W output power 1 RF input • Easy control of output power by DC voltage. 2 Vsi 3 Vc 4 Vs2
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BGY114D;
BGY114E
BGY114D
BGY114E
OT278A
OT278A
MSA488
MBD357
FERROXCUBE 4330
FERROXCUBE 4330-030
MSM88
uhf amplifier
HB 100B
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HEF4069UBP
Abstract: HEF4069UBT HEF4069 7Z84371 BAW62 HEF4069UB HEF4069UBD HEF4069UBPN
Text: HEF4069UB gates HEX INVERTER The HEF4069UB is a general purpose hex inverter. Each o f the six inverters is a single stage. Vdd I b D ii 06 I5 °5 U o4 HEF4069UB 0i I2 O2 I3 O3 Vss 7Z73695 _ Fig. 2 Pinning diagram. HEF4069UBP N : 14-lead DIL; plastic (SOT27-1)
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HEF4069UB
HEF4069UB
HEF4069UBP
14-lead
OT27-1)
HEF4069UBD
HEF4069UBT
HEF4069
7Z84371
BAW62
HEF4069UBPN
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PHILIPS OQ 0501
Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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DIP14
DIP16
DIP18
DIP20
DIP24
DIP28
DIP40
LQFP32
PHILIPS OQ 0501
philips OQ 051
oq 0066
oq 0051
PHILIPS 036
M/HD 780
footprint jedec MS-026 TQFP
mo-001 packages philips
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