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    SOP40 JEDEC Search Results

    SOP40 JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    SOP40 JEDEC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SOP40

    Abstract: No abstract text available
    Text: 40P2M-B EIAJ Package Code SOP40-P-525-1.27 Plastic 40pin 525mil SOP Weight g 1.59 JEDEC Code – Lead Material Alloy 42 e e1 21 Recommended Mount Pad 1 F Symbol L1 E A A1 A2 b c D E e HE L L1 y 20 A2 D e y b A1 L HE 40 I2 A b2 c Detail F b2 e1 I2 Dimension in Millimeters


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    PDF 40P2M-B OP40-P-525-1 40pin 525mil SOP40

    Untitled

    Abstract: No abstract text available
    Text: 40P2M-A EIAJ Package Code SOP40-P-525-1.27 Plastic 40pin 525mil SOP Weight g 1.59 JEDEC Code – Lead Material Alloy 42 e 21 E Recommended Mount Pad Symbol F 20 1 A A2 A1 D L L1 HE e1 I2 40 b2 c e b y Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters


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    PDF 40P2M-A OP40-P-525-1 40pin 525mil

    SOP18 EIAJ

    Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 SOP18 EIAJ QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ

    QFP80

    Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013

    VQFN28

    Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
    Text: パッケージコード一覧 4.パッケージコード一覧(NJRCコード vs. EIAJコード対応) 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 VQFN28 DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420

    DIP18 package

    Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20


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    PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 package SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225

    DIP18

    Abstract: DIP20 DIP40
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40

    QFP80

    Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32

    MS-013

    Abstract: MS013 jedec MS-013 SOP40 jedec DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28
    Text: パッケージコード一覧 4.パッケージコード一覧(NJRCコード vs. EIAJコード対応) 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 MS-013 MS013 jedec MS-013 SOP40 jedec DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 jedec MS-013 SC-43A
    Text: パッケージコード一覧 2.パッケージコード一覧(NJRCコード vs. EIAJコード対応) 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


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    PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 jedec MS-013 SC-43A

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28
    Text: パッケージコード一覧 4.パッケージコード一覧(NJRCコード vs. EIAJコード対応) 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


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    PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28

    RK09J11TO10KB

    Abstract: No abstract text available
    Text: NJM2195 SRS WOW AUDIO PROCESSOR •GENERAL DESCRIPTION The NJM2195 is a SRS WOW audio processor, based on the technology of SRS Labs, Inc. It includes SRS 3D Stereo regenerating 3D surround sound with stereo input, TruBass providing rich bass sound and FOCUS improving sound orientation.


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    PDF NJM2195 NJM2195 NJM2195L NJM2195GK1 NJM2195FJ1 SDIP42, OP40-K1, QFP48-J1, -20dBV RK09J11TO10KB

    Vsp8 Package dimension

    Abstract: PLCC28 layout QFP32-J2 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 JT-100 SSOP20
    Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by


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    PDF OT23-5 OT23-6 SC88A SC82AB Vsp8 Package dimension PLCC28 layout QFP32-J2 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 JT-100 SSOP20

    emp8 Package dimension

    Abstract: TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16
    Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by


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    PDF OT23-5 OT23-6 SC88A SC82AB emp8 Package dimension TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16

    H12 SOT23

    Abstract: TO252 thermal character PAT-1 QFP80-C2 TVSP10 base resistance for SOT23 IC chip 555 SC82AB SC88A SSOP10
    Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by


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    PDF OT23-5 OT23-6 SC88A SC82AB H12 SOT23 TO252 thermal character PAT-1 QFP80-C2 TVSP10 base resistance for SOT23 IC chip 555 SC82AB SC88A SSOP10

    LC322271J

    Abstract: LC322271M LC322271T SOJ40
    Text: Ordering number : EN*5085A CMOS LSI LC322271J, M, T-70/80 2 MEG 131072 words x 16 bits DRAM Fast Page Mode, Byte Write Preliminary Overview The LC322271J, M and T is a CMOS dynamic RAM operating on a single 5 V power source and having a 131072 words × 16 bits configuration. Equipped with


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    PDF LC322271J, T-70/80 40-pin, 44-pin LC322271J LC322271M LC322271T SOJ40

    SOP40 jedec

    Abstract: LC322271J LC322271M LC322271T SOJ40
    Text: Ordering number : EN*5085A CMOS LSI LC322271J, M, T-70/80 2 MEG 131072 words x 16 bits DRAM Fast Page Mode, Byte Write Preliminary Overview The LC322271J, M and T is a CMOS dynamic RAM operating on a single 5 V power source and having a 131072 words × 16 bits configuration. Equipped with


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    PDF LC322271J, T-70/80 40-pin, 44-pin SOP40 jedec LC322271J LC322271M LC322271T SOJ40

    jedec QFP80

    Abstract: SC82AB SC88A TVSP10 VSP10 pat2
    Text: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度(Tj)が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約2倍になるとい


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    PDF 175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) 201ja OT23-5 OT23-6 SC88A SC82AB jedec QFP80 SC82AB SC88A TVSP10 VSP10 pat2

    SC82AB

    Abstract: SC88A TVSP10 VSP10 QFP100-U1 SC82A pat2
    Text: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度(Tj)が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約2倍になるとい


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    PDF 175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) 201ja OT23-5 OT23-6 SC88A SC82AB SC82AB SC88A TVSP10 VSP10 QFP100-U1 SC82A pat2

    Test-Element-Group

    Abstract: PAT-3 SC82AB SC88A SSOP10 SSOP14 SSOP16 TVSP10 VSP10 P-CSP-24
    Text: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度(Tj)が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約2倍になるとい


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    PDF 175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) OT23-5 OT23-6 SC88A SC82AB O-252 Test-Element-Group PAT-3 SC82AB SC88A SSOP10 SSOP14 SSOP16 TVSP10 VSP10 P-CSP-24

    Test-Element-Group

    Abstract: Thermal Test-Element-Group SC82AB SC88A SSOP10 SSOP14 SSOP16 TVSP10 VSP10 JESD51-52
    Text: 熱抵抗について 本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、 測定方法などについて解説いたします。 •背景 一般的に素子のジャンクション温度(Tj)が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約2倍になるとい


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    PDF 175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) 200ja OT23-5 OT23-6 SC88A SC82AB Test-Element-Group Thermal Test-Element-Group SC82AB SC88A SSOP10 SSOP14 SSOP16 TVSP10 VSP10 JESD51-52

    TSSOP54

    Abstract: tssop-54 Test-Element-Group SC82AB SC88A TVSP10 VSP10 TSSOP54-N1 ESON6-H12 JESD51-5
    Text: 关于热阻 本资料,作为客户热量设计时的参考,关于本公司的热阻的各参数定义测量方法等在此进行解说。 •背景 通常,元件的结温 Junction Temperature (Tj)每上升 10℃,器件的寿命就会大约减为一半,故障率也


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    PDF EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 OT23-5 OT23-6 SC88A SC82AB O-252 TSSOP54 tssop-54 Test-Element-Group SC82AB SC88A TVSP10 VSP10 TSSOP54-N1 ESON6-H12 JESD51-5

    T70 No3

    Abstract: AO201 a02909 LC322271J LC322271M SOJ40 101-lo
    Text: Ordering number : EN% 5085A CMOS LSI LC322271J, M, T-70/80 No. * 5085A SAXYO 2 MEG 131072 words x 16 bits DRAM Fast Page Mode, Byte Write Preliminary Overview The LC322271J, M and T is a CMOS dynamic RAM operating on a single S V power source and having a


    OCR Scan
    PDF LC322271 T-70/80 LC322271J, 40-pin, 44-pin T70 No3 AO201 a02909 LC322271J LC322271M SOJ40 101-lo

    Untitled

    Abstract: No abstract text available
    Text: Ordering number : ENÌ&5085A CMOS LSI LC322271J, M, T-70/80 NO.5K5085A SA\YO 2 MEG 131072 words x 16 bits DRAM Fast Page Mode, Byte Write i Preliminary Overview The LC322271J, M and T is a CMOS dynamic RAM operating on a single 5 V power source and having a


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    PDF LC322271J, T-70/80 5K5085A 40-pin, 44-pin. LC322271