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Catalog Datasheet	MFG & Type	PDF	Document Tags
jedec QFP80 Abstract: SC82AB SC88A TVSP10 VSP10 pat2 Text: 熱抵抗について本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、測定方法などについて解説いたします。 •背景一般的に素子のジャンクション温度（Tj）が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約２倍になるとい	Original	PDF	175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) 201ja OT23-5 OT23-6 SC88A SC82AB jedec QFP80 SC82AB SC88A TVSP10 VSP10 pat2
SC82AB Abstract: SC88A TVSP10 VSP10 QFP100-U1 SC82A pat2 Text: 熱抵抗について本書ではお客様におけます熱設計時のご参考のために、弊社での熱抵抗に関する各パラメータの定義、測定方法などについて解説いたします。 •背景一般的に素子のジャンクション温度（Tj）が 10℃上がる毎にデバイスの寿命は約半分になり、故障率は約２倍になるとい	Original	PDF	175Tj EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 2mm35um) 201ja OT23-5 OT23-6 SC88A SC82AB SC82AB SC88A TVSP10 VSP10 QFP100-U1 SC82A pat2
CON-HDR-2X5-050 Abstract: C44-10BSA1-G TSSOP54 HR961160C microSD card adapter circuit diagram K350QVG-V1-F C44-08BSA1-G WM8510 W25X80AVSSIG DS-LM39B92 Text: Stellaris Intelligent Display Module Single-Board Computer IDM-SBC Reference Design Kit User ’s Manual RDK-IDM-SBC-UM-05 Co pyrigh t 2 009– 201 1 Te xas In strumen ts Copyright Copyright © 2009–2011 Texas Instruments, Inc. All rights reserved. Stellaris and StellarisWare are registered trademarks of Texas Instruments.	Original	PDF	RDK-IDM-SBC-UM-05 CON-HDR-2X5-050 C44-10BSA1-G TSSOP54 HR961160C microSD card adapter circuit diagram K350QVG-V1-F C44-08BSA1-G WM8510 W25X80AVSSIG DS-LM39B92
TSSOP54 Abstract: tssop-54 Test-Element-Group SC82AB SC88A TVSP10 VSP10 TSSOP54-N1 ESON6-H12 JESD51-5 Text: 关于热阻本资料，作为客户热量设计时的参考，关于本公司的热阻的各参数定义测量方法等在此进行解说。 •背景通常，元件的结温 Junction Temperature （Tj）每上升 10℃，器件的寿命就会大约减为一半，故障率也	Original	PDF	EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 OT23-5 OT23-6 SC88A SC82AB O-252 TSSOP54 tssop-54 Test-Element-Group SC82AB SC88A TVSP10 VSP10 TSSOP54-N1 ESON6-H12 JESD51-5
TSSOP54 Abstract: emp8 Package EPFFP6-A2 dmp8 Package dimension tssop-54 HSOP-8 SC82AB SC88A SSOP14 TVSP10 Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by	Original	PDF	OT23-5 OT23-6 SC88A SC82AB TSSOP54 emp8 Package EPFFP6-A2 dmp8 Package dimension tssop-54 HSOP-8 SC82AB SC88A SSOP14 TVSP10
EQFN12-E2 Abstract: H12 SOT23 SC82AB SC88A TVSP10 VSP10 JESD51-3 Text: 关于热阻本资料，作为客户热量设计时的参考，关于本公司的热阻的各参数定义测量方法等在此进行解说。 •背景通常，元件的结温 Junction Temperature （Tj）每上升 10℃，器件的寿命就会大约减为一半，故障率也	Original	PDF	EIA/JESD51-3/-5/-7 25mmA0 EIA/JESD51-3/-5/-7 OT23-5 OT23-6 SC88A SC82AB O-252 EQFN12-E2 H12 SOT23 SC82AB SC88A TVSP10 VSP10 JESD51-3
H12 SOT23 Abstract: TO252 thermal character PAT-1 QFP80-C2 TVSP10 base resistance for SOT23 IC chip 555 SC82AB SC88A SSOP10 Text: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by	Original	PDF	OT23-5 OT23-6 SC88A SC82AB H12 SOT23 TO252 thermal character PAT-1 QFP80-C2 TVSP10 base resistance for SOT23 IC chip 555 SC82AB SC88A SSOP10