QFP80
Abstract: QFP80-C2 2394
Text: パッケージ外形図 QFP80-C2 23.9±0.4 0 ~10 ﾟ 20.0±0.3 40 80 25 14.0±0.3 61 1 17.9±0.4 41 60 24 0.12 M +0.1 0.15 - 0.05 2.7±0.1 0.35±0.1 3.0MAX 0.8 0.8±0.2 0.15 0.1±0.1 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP80-C2
QFP80
QFP80-C2
2394
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QFP80
Abstract: QFP80-C2
Text: PACKAGE DIMENSIONS QFP80-C2 23.9±0.4 0 ~ 10º 20.0±0.3 40 80 25 14.0±0.3 61 1 17.9±0.4 41 60 24 0.12 M +0.1 0.15 - 0.05 2.7±0.1 0.35±0.1 3.0MAX 0.8 0.8±0.2 0.15 0.1±0.1 Mold Base UNIT : mm
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QFP80-C2
QFP80
QFP80-C2
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QFP80-G1
Abstract: 17max
Text: パッケージ外形図 QFP80-G1 0 ~10° 16.0±0.4 14.0±0.3 41 40 80 21 14.0±0.3 61 1 16.0±0.4 60 20 0.3±0.1 M 1.7MAX 0.12 1.4±0.1 +0.10 0.15 - 0.05 0.65 0.5 0.10 +0.1 0.1 - 0.05 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP80-G1
QFP80-G1
17max
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Untitled
Abstract: No abstract text available
Text: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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QFP80:
OT496-1
135E06
MS-022
ED-7311EE
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Untitled
Abstract: No abstract text available
Text: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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QFP80:
OT318-2
MO-112
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QFP80
Abstract: QFP80-P
Text: QFP80-P-1414-0.65-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP80-P-1414-0
QFP80
QFP80-P
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MS-022
Abstract: QFP80
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A
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QFP80:
OT310-1
134E14
MS-022
MS-022
QFP80
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ZD 103
Abstract: MS-022 QFP80
Text: PDF: 2002 Oct 09 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A
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QFP80:
OT496-1
135E06
MS-022
ED-7311EE
ZD 103
MS-022
QFP80
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QFP80
Abstract: QFP-80 14X14 QFP80 0.65
Text: SANYO Semiconductor Quad Flat Package 80Pin Plastic QFP80 14X14 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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80Pin
QFP80
14X14)
ED-7303A
QFP80
QFP-80
14X14
QFP80 0.65
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QFP80
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm 1995 Feb 04 5-24 SOT310-1
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QFP80:
OT310-1
QFP80
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jedec QFP80
Abstract: sot496 QFP80 0.65
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads; body 14 x 14 x 2.67 mm SOT496-1 c y X A 60 61 41 40 ZE e E HE A A2 A 3 A1 θ wM pin 1 index Lp bp L 80 21 detail X 20 1 wM bp e ZD v M A D B HD v M B 5 10 mm
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QFP80:
OT496-1
OT496-1
jedec QFP80
sot496
QFP80 0.65
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A
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QFP80:
OT318-2
OT318-2
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80P6S-A
Abstract: PRQP0080JA-A P-QFP80-14X14-0
Text: JEITA Package Code P-QFP80-14x14-0.65 RENESAS Code PRQP0080JA-A Previous Code 80P6S-A MASS[Typ.] 1.1g HD *1 D 60 41 61 40 HE ZE *2 E NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference Symbol
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P-QFP80-14x14-0
PRQP0080JA-A
80P6S-A
80P6S-A
PRQP0080JA-A
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QFP80
Abstract: jedec QFP80 MO-112
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT318-1 c y X 64 A 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 25 80 detail X
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QFP80:
OT318-1
MO-112
QFP80
jedec QFP80
MO-112
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QFP80
Abstract: 14X14
Text: SANYO Semiconductor Quad Flat Package 80Pin Plastic QFP80 14X14 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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80Pin
QFP80
14X14)
ED-7303A)
QFP80
14X14
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QFP80
Abstract: No abstract text available
Text: パッケージ外形図 QFP80-C1 1 25.6±0.4 20.0±0.3 0 ~10 ﾟ 40 80 25 14.0 ±0.3 65 1 19.6 ±0.4 41 64 24 0.12 M +0.1 0.15 - 0.05 2.7 ±0.1 0.35±0.1 3.0MAX 0.8 1.6±0.2 0.15 0.1 ±0.1 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP80-C1
QFP80
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FP 80
Abstract: fp80v PRQP0080GD-A FP-80
Text: JEITA Package Code P-QFP80-14x20-0.80 RENESAS Code PRQP0080GD-A Previous Code FP-80/FP-80V MASS[Typ.] 1.8g HD *1 D 64 41 65 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 40 bp c c1 HE ZE *2 E b1 Terminal cross section
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P-QFP80-14x20-0
PRQP0080GD-A
FP-80/FP-80V
FP 80
fp80v
PRQP0080GD-A
FP-80
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QFP80-P-1420-0
Abstract: No abstract text available
Text: QFP80—P —1420—0.65D Unii;! nn Jan,2007
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QFP80-P-1420-0
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PQFP80
Abstract: P-QFP80-1414-0
Text: Units m P-QFP80-1414-0.65B 17, 2+0, 2 14, 0+0, 1 60 41 filli CL >in oo OJ O 40 O OJ o +1 o Ö -H OJ l< o mm m F 8QC^ i 21 20 O, 825TYP o, 32-8:! » m n ?v r- o, 8±0JL Mar,2001
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P-QFP80-1414-0
825TYP
Ttna40
PQFP80
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QFP80
Abstract: QFP80-P-1420-0
Text: Unii;: nn QFP80— P— 1420— 0,80 in *-*o\ c5o +i in ' O 1 Nov,2006
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QFP80-P-1420-0
QFP80
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QFP40
Abstract: ht 20*20
Text: Overview O rd e rin g C od e_D e s c rip tio n _ IC -B o d y S ize_ IC -D im . total _ P age N o. IC198-044-200x QFP40 0.8 pitch 1 0 x 10 13.2 x 13.2 ht. 2.45 max. 23 IC198-080-100X QFP80 0.8 pitch 14x20 16.8x22 .8
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IC198-044-200x
IC198-080-100X
IC198-080-200x
IC198-080-21
IC198-100-200x
IC198-1001-210x
IC198A-1000-100x
IC198-112-21
IC198-128-200x
IC198-208-210x
QFP40
ht 20*20
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TLCS-90
Abstract: TMP93CU44 TMP93CU44DF 93CU44-8
Text: TO SH IB A TMP93CU44 Low Voltage / Low Power CMOS 16 -b it M icrocontrollers TMP93CU44DF 1. O utline and Device Characteristics The TMP93CU44 are high-speed, advanced 16-bit microcontrollers developed for controlling medium to large-scale equipment. The TMP93CU44DF are housed in 80-pin flat package P-QFP80-1420-0.80B .
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TMP93CU44
16-bit
TMP93CU44DF
TMP93CU44
TMP93CU44DF
80-pin
P-QFP80-1420-0
900/L
TLCS-90
93CU44-8
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QFP80-P-1420-0
Abstract: 80H-F
Text: TOSHIBA 8 0 h f> Q F P Flat Package mm QFP80-P-1420-0.80B (N PKG900-1 TOSHIBA /\"7 > r - v - ! 64 tf > QFP (Flat Package) QFP64-P-1420-1.00A : mm o o o 4. n o (N PKG900-2
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QFP80-P-1420-0
PKG900-1
QFP64-P-1420-1
PKG900-2TOSHIBA
PKG900-2
80H-F
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TB1204N
Abstract: TC9067F SDIP64-P-750
Text: NICAM System Type No. Package Outline Function/Features Operating Voltage QPSK demodulation Deinterleave, parity check Expanded to 14 bits from 10 bits TB1204N/F Broadcast mode display, audio output selector SDIP64-P-750 QFP80-P-1420A 4.5-5.5V Built-in Work F1AM
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TB1204N/F
SDIP64-P-750
QFP80-P-1420A
TB1212N/F
T64-P-750
TC9083N/F
SDIP42-P-600
TB1204N
TC9067F
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