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    SOP PACKAGE TRAY Search Results

    SOP PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOP PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Device Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 PRESSURE SENSORS LEADFORM OPTIONS PACKAGE TYPE CATEGORY M Qualified standard S Custom device P,X Prototype device None A/V AZ Unibody Small outline package SOP Small outline media resistant package


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    PDF MPX10DP MPXA4115A6T1

    Untitled

    Abstract: No abstract text available
    Text: Device Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 PRESSURE SENSORS LEADFORM OPTIONS PACKAGE TYPE CATEGORY M Qualified standard S Custom device P,X Prototype device None A/V AZ Unibody Small outline package SOP Small outline media resistant package


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    PDF MPX10DP MPXA4115A6T1

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor, Inc. Device Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 PRESSURE SENSORS LEADFORM OPTIONS PACKAGE TYPE CATEGORY M Qualified standard S Custom device P,X Prototype device None A/V AZ Unibody Small outline package SOP


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    PDF MPX10DP MPXA4115A6T1

    intel standard marking

    Abstract: No abstract text available
    Text: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED DATA I/O ProMaster 970 • ■ ■ ■ Programs, sorts, and marks up to 110 devices per hour Supports memory, microcontroller, and logic devices Package support: µBGA*, SOP, SSOP, TSOP and others Media supported: tube, tray, and


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    PDF 84PLCC/ 208QFP) intel standard marking

    SSOP12

    Abstract: SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12
    Text: TRAY CONTAINER NEC 119.9 5.86 135° CMAX. 10.90 SSOP12.3 x 6.1A 8.00 135.9 PPE 12 × 20=240 UNIT : mm 12.70 15.50 10.25 294.5 315.0 322.6 SECTION A-A' 5.27 (6.35) 7.62 12.70 Applied Package 38-pin • Plastic Shrink SOP Quantity (pcs) 240 MAX. SSOP12.3 × 6.1A


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    PDF SSOP12 38-pin SSD-A-H7409 SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12

    Untitled

    Abstract: No abstract text available
    Text: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP


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    PDF 9B/18B

    JEDEC TRAY DIMENSIONS ssop

    Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)


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    PDF 375mil48p 48-pin 375mil48pSSOP SSD-A-H6495-1 JEDEC TRAY DIMENSIONS ssop H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard

    JEDEC TRAY DIMENSIONS ssop

    Abstract: SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF 7 PPE NEC 135°C MAX. A' 8.4 12.75 135.9 300mil20p SSOP 10.58 114.75 10x24=240 A 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 6.40 Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (1.2 mm thick)


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    PDF 300mil20p 20-pin 300mil20pSSOP SSD-A-H6455-1 JEDEC TRAY DIMENSIONS ssop SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645

    H7665

    Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490
    Text: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A


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    PDF 10-pin SSD-A-H7665 H7665 SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490

    70-pin

    Abstract: 3521a
    Text: UNIT : mm 335±1.0 23.5±0.5 288±0.5 137.5±0.5 A' A SECTION A – A' 17 12.38 5.1 5.8 8.8 180±1.0 21.25±0.5 27.5±0.1 32±0.1 Applied Package Quantity pcs 70-pin Plastic Shrink SOP (500mil) MAX. 60 Tray LA-3521A-1 Material Carbon PPE Heat Proof Temp.


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    PDF 70-pin 500mil) LA-3521A-1 3521a

    nec 2501

    Abstract: 2501 NEC SSD-A-H7743 LA-3674B-1
    Text: TRAY CONTAINER 25.0±0.1 27.5±0.5 PPE A A' 18.3 175.0±0.5 230.0±1.0 UNIT : mm 276.0±1.0 231.0±0.5 22.5±0.5 16.5±0.1 NEC LA-3674B-1 135°C MAX. 12.0 SECTION A-A' 12.0 7.0 11.25 14.0 10.2 Applied Package Quantity (pcs) 24-pin Plastic Shrink SOP 120 MAX.


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    PDF LA-3674B-1 24-pin SSD-A-H7743 nec 2501 2501 NEC SSD-A-H7743 LA-3674B-1

    70-pin

    Abstract: 3521a
    Text: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 耐 熱 PPE 137.5±0.5 17 A' NEC LA-3521A-1 A HEAT PROOF SECTION A – A' 29.9 17 12.38 5.1 5.8 8.8 180±1.0 21.25±0.5 27.5±0.1 32±0.1 Applied Package 70-pin Plastic Shrink SOP Quantity pcs MAX. 60


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    PDF LA-3521A-1 70-pin SSD-A-H5759-2 3521a

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645
    Text: TRAY CONTAINER UNIT : mm PPE 7 HEAT PROOF 114.75 NEC 135° MAX. A' 8.4 10.58 12.75 SSOP300MIL10 135.9 10x21=210 A 9.6 14.75 10.00 295.0 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 9.60 Applied Package Quantity (pcs) 30-pin • Plastic Shrink SOP (1.2 mm, 1.7 mm thick)


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    PDF SSOP300MIL10 30-pin SSD-A-H6451-2 JEDEC TRAY DIMENSIONS JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645

    SC-82AB

    Abstract: packing packing list
    Text: MITSUMI Packing Packing List of Packing Types Packing types for each package are given in the following table. Package type TO-92 SOP SSOP VSOP TSOP MMP SOT-25 SOT-26 SC-82AB QFP 3 A 7A 8A 8B 8C 8D 8E 14A 14B 16A 16B 18A 20B 22A 24A 28A 28B 16A 20A 24A 8A


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    PDF OT-25 OT-26 SC-82AB SC-82AB packing packing list

    Untitled

    Abstract: No abstract text available
    Text: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 17.0 A NEC LA-3650A-1 135°C MAX. A' 27.8 SECTION A – A' 17.0 5.9 5.8 12.9 8.8 180±1.0 PPE 137.5±0.5 21.25±0.5 32±0.1 Applied Package Quantity (pcs) 44-pin Plastic SOP MAX. 60 Tray LA-3650A-1


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    PDF LA-3650A-1 44-pin SSD-A-H6649-1

    21255

    Abstract: No abstract text available
    Text: Unit : mm 335±1.0 23.5±0.5 288±0.5 21.25±0.5 A A' 137.5±0.5 180±1.0 27.5±0.1 32±0.1 11 HEAT PROOF 20.2 SECTION A – A' 26 20.2 8.8 5.8 5.9 Tray 32P SOP Material Carbon PP Heat Proof Temp. Surface resistance 125°C 6 less than 1x10 Ω/ Applied Package


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    PDF 32pin 525mil) 21255

    SOP 64

    Abstract: No abstract text available
    Text: UNIT : mm 335±1.0 23.5±0.5 288±0.5 137.5±0.5 27.5±0.1 PPE 14.85 A' NEC LA-3516A-1 HEAT PROOF 26.5 A SECTION A – A' 14.85 11.64 5.8 6.3 8.8 180±1.0 21.25±0.5 32±0.1 Applied Package 64-pin Plastic • Shrink SOP Quantity pcs MAX. 60 Tray LA-3516A-1


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    PDF LA-3516A-1 64-pin SOP 64

    Untitled

    Abstract: No abstract text available
    Text: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 21.25±0.5 32±0.1 14.3 A' NEC LA-2524B-1 25.6 HEAT PROOF A SECTION A-A' 14.3 10 5.8 6.2 8.8 180±1.0 137.5±0.5 27.5±0.1 PP Applied Package Quantity pcs 40-Pin Plastic SOP MAX. 60 Tray LA-2524B-1 Material


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    PDF LA-2524B-1 40-Pin SSD-A-H5763-1

    JEDEC TRAY DIMENSIONS ssop

    Abstract: SOP JEDEC tray
    Text: UNIT : mm PPE 7 HEAT PROOF NEC 135°C MAX. 10.3 105.0 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (375mil)(1.7mm thick)


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    PDF 375mil48p 48-pin 375mil) 375mil48pSSOP JEDEC TRAY DIMENSIONS ssop SOP JEDEC tray

    300mil20p

    Abstract: SOP JEDEC tray JEDEC TRAY DIMENSIONS ssop 300mil JEDEC TRAY DIMENSIONS JEDEC tray standard 20pin SOP JEDEC TRAY DIMENSIONS ssop 20
    Text: UNIT : mm 8.4 A' 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 (6.35) 6.4 7.62 135.9 PPE 7 HEAT PROOF NEC 135°C MAX. 12.75 10.58 300mil20p SSOP 114.75 10x24=240 A Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (300mil)(1.2mm thick)


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    PDF 300mil20p 20-pin 300mil) 300mil20pSSOP SOP JEDEC tray JEDEC TRAY DIMENSIONS ssop 300mil JEDEC TRAY DIMENSIONS JEDEC tray standard 20pin SOP JEDEC TRAY DIMENSIONS ssop 20

    ssop300mil10

    Abstract: SSOP-300mil JEDEC TRAY DIMENSIONS SOP JEDEC tray
    Text: UNIT : mm PPE 7 HEAT PROOF 114.75 NEC 135° MAX. A' 8.4 10.58 12.75 SSOP300MIL10 9.6 14.75 10.00 295.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 9.6 7.62 135.9 10x21=210 A Applied Package Quantity (pcs) 30-pin • Plastic Shrink SOP (300mil)(1.2mm thick)


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    PDF SSOP300MIL10 30-pin 300mil) ssop300mil10 SSOP-300mil JEDEC TRAY DIMENSIONS SOP JEDEC tray

    LY621024

    Abstract: LY621024SL LY621024LL 128K X 8 BIT LOW POWER CMOS SRAM
    Text:  LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.6 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Description Initial Issue Revised sym. b of 32 pin 450mil SOP package outline dimension in page 8 Added SL C-grade Spec.


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    PDF LY621024 450mil 32-pin 36-ball LY621024 LY621024SL LY621024LL 128K X 8 BIT LOW POWER CMOS SRAM

    LY621024PL-70LL

    Abstract: LY621024PL
    Text:  LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007


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    PDF LY621024 450mil LY621024GL-70LLE LY621024GL-70LLET LY621024GL-70LLI LY621024GL-70LLIT LY621024PL-70LL LY621024PL

    vqfp100 package

    Abstract: S2P24 BA4558F-T1
    Text: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP


    OCR Scan
    PDF FTR/TO-92/TO-220/TO-220FP vqfp100 package S2P24 BA4558F-T1