Untitled
Abstract: No abstract text available
Text: Surface Mount Resistors Recommended Soldering Conditions • Recommended Soldering Conditions Recommendations and precautions are described below. ● Rectagular Type ● Recommended soldering conditions for reflow • Reflow soldering shall be performed a maximum of
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JEDEC J-STD-020d.1
Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-3
JEDEC J-STD-020d.1
paste profile
J-STD-020d.1
JEDEC SMT reflow profile
Altera ROHS
AN81
J-STD-020D
J-STD-033
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JEDEC J-STD-020d.1
Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow
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AN-353-2
JEDEC J-STD-020d.1
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
pcb warpage in ipc standard
Soldering guidelines
J-STD-020D
pcb warpage* in smt reflow
Lead Free reflow soldering profile BGA
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ISP2100
Abstract: reflow reflow profile
Text: QLogic Corporation Applications Note No. 83210-514-01 A Reflow Soldering Recommendations Products Affected Chip Name Part Number ISP2100 2405088 This applications note describes the reflow soldering recommendations for the ISP2100 chip. The recommended reflow soldering conditions are
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ISP2100
ISP2100
15conds
reflow
reflow profile
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Rosin Flux Type RMA
Abstract: No abstract text available
Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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01-Apr-08
Rosin Flux Type RMA
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vapor condensation cooling
Abstract: 45034
Text: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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03-Sep-09
vapor condensation cooling
45034
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Vitramon
Abstract: vitramon VJ
Text: VJ Soldering Recommendations Vishay Vitramon Multilayer Ceramic Chip Capacitors Speciality Products SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.
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ipc 610 Class 3 pin protrusion
Abstract: flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D
Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection
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IPC-A-610
ipc 610 Class 3 pin protrusion
flux ef 2202
ipc 610D
ipc 610 Class 3
IPC-A-610D
ipc 610 non-wetting
IPCA610D
ipc 610
IPC-A-610-D
IPC-A610D
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flux ef 2202
Abstract: ipc 610D ipc 610 Class 3 pin protrusion ipc 610 non-wetting IPC-A610D ipc 610 Class 3 IPC-A-610D ipc 610 AN017 IPC-A-610-D
Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection
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IPC-A-610
flux ef 2202
ipc 610D
ipc 610 Class 3 pin protrusion
ipc 610 non-wetting
IPC-A610D
ipc 610 Class 3
IPC-A-610D
ipc 610
AN017
IPC-A-610-D
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AN10376
Abstract: Dow Corning 340 AN1037
Text: AN10376 Mounting and soldering recommendations for CATV modules Rev. 01 — 21 April 2005 Document information Info Content Keywords CATV, mounting, soldering, SOT115 Abstract Mounting CATV hybrid modules Application note AN10376 Philips Semiconductors Mounting and soldering recommendations for CATV modules
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AN10376
OT115
AN10376
Dow Corning 340
AN1037
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Soldering Recommendations
Abstract: JEDEC wave J-STD020C HALO SOLDERING REFLOW smt
Text: Pb-Free Soldering Recommendations HALO Electronics recommends the following reflow soldering*, IPC/JEDEC J-STD-020C compatible, and wave soldering profiles for processing its Pb-Free surface mount and through-hole products. HALO SMT products are tested to withstand maximum peak
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J-STD-020C
Soldering Recommendations
JEDEC wave
J-STD020C
HALO
SOLDERING REFLOW smt
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HALO
Abstract: No abstract text available
Text: Soldering Recommendations HALO Electronics recommends the following reflow and wave soldering profiles for processing its surface mount and through-hole products. Reflow Soldering Maximum peak temperature 225°C shall not exceed 10 seconds. Maximum duration of temperature above 183°C shall not exceed 90 seconds.
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STR3234
Abstract: D1268 NL-5700 M130 D-12681 K1306 k1306 datasheet V23814-U1306-M130 V23815-K1306-M230 V23815-N1306-M130
Text: Hot-Bar Soldering and Hot-Air Soldering for PAROLI =Modules Appnote 76 by Arun Agarwal, updated by Elmar Dröge DESCRIPTION OVERVIEW OF SURFACE MOUNT SOLDERING METHODS This technical note provides information on the two soldering methods recommended for Infineon PAROLI Parallel Optical
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D-13623,
STR3234
D1268
NL-5700
M130
D-12681
K1306
k1306 datasheet
V23814-U1306-M130
V23815-K1306-M230
V23815-N1306-M130
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Untitled
Abstract: No abstract text available
Text: AN10376 Philips Semiconductors Mounting and soldering recommendations for CATV modules 1. Introduction This document deals with the mounting and soldering of CATV modules. 2. Mounting and soldering recommendations 2.1 Mounting The heatsink surface must be flat, free of burrs and oxidation and be parallel to the
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AN10376
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Untitled
Abstract: No abstract text available
Text: Recommended Soldering Techniques Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original
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AP02014
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MICRON 63
Abstract: SOLDERING REFLOW smt
Text: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent
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TN-00-15:
09005aef809140c7/Source:
09005aef80914088
MICRON 63
SOLDERING REFLOW smt
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Reflow Soldering Guide
Abstract: berex
Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo
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Reflow61110
B61110
Reflow Soldering Guide
berex
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Untitled
Abstract: No abstract text available
Text: AN11120 Application and soldering information for the PCA2129T automotive TCXO RTC Rev. 2 — 23 January 2013 Application note Document information Info Content Keywords PCA2129T soldering, application, timekeeping, timestamp Abstract This application note gives additional information about soldering and
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AN11120
PCA2129T
PCA2129T
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Untitled
Abstract: No abstract text available
Text: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination
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22-Sep-99
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5
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LL1005-FH
PTL1005-F
LL1608-FH/FS
PTL1608-F
LL2012-FH
PTL2012-F
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Untitled
Abstract: No abstract text available
Text: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering
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LL2012-F
LL1608-F/FH
LL1005-FH
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945801
Abstract: No abstract text available
Text: LEAD FINISH: GDLD BUSHING FINISH: S IL V E R SOLDERING NOTES: 1. SOLDERING TO FILTER TERMINALS: DO NOT EXCEED 2 8 0 ’C IRON TIP TEMP. 2. MACHINE/OVEN SOLDERING: DO NOT EXCEED 210'C MAX. 0.O4OÌ.OO1 3. CONTACT SCI FOR [1 .0 2 Ì.0 2 ] MORE DETAILED SOLDERING
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125pF
MIL--STD--220
150MHz
10GHz
S803-1
945801
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UEI 15 SP 020
Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION
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SAA7140A)
SAA7140B)
16-bit
SAA7140A;
SAA7140B
UEI 15 SP 020
691 OHD 3 - 115 M
VMUX
to3a
SAA7140A
SAA7140B
new 60 ypf
UEI 20 SP 010
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UEI 20 SP 010
Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION
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SAA7140A;
SAA7140B
SAA7140A)
SAA7140B)
711062b
UEI 20 SP 010
bord
SAA7140A
SAA7140B
FEY G4
LQFP128
VR029
SAA7196
t3044
UL705
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