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    REFLOW Search Results

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    Part ECAD Model Manufacturer Description Download Buy
    LUSB3193002 Amphenol Communications Solutions Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste Visit Amphenol Communications Solutions
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    Panasonic Electronic Components EEE-FTH101XAP

    Aluminum Electrolytic Capacitors - SMD 100uF 50volts 6.3x7.7mm SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EEE-FTH101XAP Reel 296,100 900
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    • 1000 $0.219
    • 10000 $0.219
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    Panasonic Electronic Components EEE-HD1V220AP

    Aluminum Electrolytic Capacitors - SMD 22UF 35V ELECT HD SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EEE-HD1V220AP Reel 125,000 1,000
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    • 10 -
    • 100 -
    • 1000 $0.109
    • 10000 $0.101
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    Panasonic Electronic Components EEE-FT1V101AP

    Aluminum Electrolytic Capacitors - SMD 100uF 35volts 6.3x5.8mm SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EEE-FT1V101AP Reel 111,000 1,000
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    • 1000 $0.156
    • 10000 $0.156
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    Panasonic Electronic Components EEE-FT1H221AP

    Aluminum Electrolytic Capacitors - SMD 220uF 50volts 8x10.2mm SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EEE-FT1H221AP Reel 87,000 500
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    • 1000 $0.317
    • 10000 $0.293
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    Panasonic Electronic Components EEE-FTE221XAP

    Aluminum Electrolytic Capacitors - SMD 220uF 25volts 6.3x7.7mm SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EEE-FTE221XAP Reel 70,200 900
    • 1 -
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    • 1000 $0.214
    • 10000 $0.214
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    REFLOW Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Reflow Soldering Altera Reflow Soldering Guidelines for Surface-Mount Devices Application Note 81 Original PDF

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    Catalog Datasheet MFG & Type Document Tags PDF

    TOSHIBA ADDC

    Abstract: No abstract text available
    Text: TL19W01-D T32 TOSHIBA LED lamps TL19W01-D(T32 ○ Surface-mount devices Unit: mm 3.1 (L mm x 3.8 (W) mm × 0.65 (H) mm size • High luminous flux LED : 110 lm(typ.) @ IF=300 mA • Color: white (6500K)Reflow-soldering is available • Applications : general lighting and etc.


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    TL19W01-D 6500K) TOSHIBA ADDC PDF

    SMD 0402

    Abstract: No abstract text available
    Text: 2381 553 2.6/MLV0402E3.3T Vishay BCcomponents SMD 0402 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC


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    6/MLV0402E3. 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12 SMD 0402 PDF

    9940

    Abstract: mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215
    Text: 150 CRZ www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , Very Low Z FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Very low impedance, very high ripple current


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    J-STD-020 AEC-Q200 MAL215099. 9991trademarks 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 9940 mal215099xxxe3 MAL215099 99101E3 99804E3 150631-2 99103E3 99515E3 99603E3 MAL215 PDF

    Asp1251

    Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
    Text: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .


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    100nF, TD431111615116 Asp1251 J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter PDF

    DSE12*101

    Abstract: No abstract text available
    Text: Technical Data Sheet Chip LED with Right Angle Lens 12-21UBC/C430/TR8 Features ԦPackage in 8mm tape on 7ϛdiameter reel. ԦCompatible with automatic placement equipment. ԦCompatible with infrared and vapor phase reflow solder process. ԦMono-color type.!!


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    12-21UBC/C430/TR8 DSE-121-011 6-Apr-2009 DSE12*101 PDF

    SOD523 footprint

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 2.15 1.4 0.5 0.6 2x (2×) 1.2 0.4 (2×) 0.5 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area


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    OD523 sod523 SOD523 footprint PDF

    HVQFN24

    Abstract: HVQFN-24 sot616
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN24 package SOT616-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    HVQFN24 OT616-1 OT616-1 HVQFN-24 sot616 PDF

    marking code 8A

    Abstract: marking WM EN6100-4
    Text: LESHAN RADIO COMPANY, LTD. LGSMF05CT1G Thyristor Surge Protective Devices MECHANICAL CHARACTERISTICS Features z z z z z z z Molded JEDEC SOT-563 Package Weight 3 milligrams Availble in Lead-Free Nickel-Paladium-Gold Plating Solder Reflow Temperature: Nicker-Paladium-Gold


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    LGSMF05CT1G OT-563 40kilovolts EIA-481. SESMF05C-T7 Suffix-T13 SESMF05C-T13. SESMF05C-P-T-7. Rev1-9/05 marking code 8A marking WM EN6100-4 PDF

    2D 1002

    Abstract: RH 2D 1002 2D 1406 RN41 RN412E RN412
    Text: 1733 Reader's Spreads pg1-203:document 1/27/09 4:08 PM Page 87 fixed metal film melf resistors EU features • • • • • Suitable for reflow and wave soldering Higher stability in short and long term tests Meets or exceeds IEC 60115-8, EIAJ RC-2132A


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    pg1-203 RC-2132A C/-55 2D 1002 RH 2D 1002 2D 1406 RN41 RN412E RN412 PDF

    pms 1-7-7

    Abstract: CCF1N8 CCF1N6.3 CCF1N10 CCF1N5 CCF1N4 CCF1N15 ccf1n7 CCF1N0.4 CCF1N0.5
    Text: 1733 Reader's Spreads pg1-203:document 1/27/09 4:14 PM Page 175 CCF chip fuse EU features circuit protection • Surface mount fuse suitable for primary and secondary circuits • Ceramic case provides excellent mechanical strength • Suitable for flow and reflow soldering


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    pg1-203 pms 1-7-7 CCF1N8 CCF1N6.3 CCF1N10 CCF1N5 CCF1N4 CCF1N15 ccf1n7 CCF1N0.4 CCF1N0.5 PDF

    M705-GRN360-MZ

    Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
    Text: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),


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    AN11046 DSN0603-2 OD962) M705-GRN360-MZ M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design PDF

    2N06L35

    Abstract: 2N06L v5856 GS6010 PCB REV 3.5 IPD26N06S2L-35 2N06L3
    Text: IPD26N06S2L-35 OptiMOS Power-Transistor Product Summary Features • N-channel Logic Level - Enhancement mode • Automotive AEC Q101 qualified V DS 55 V R DS on ,max (SMD version) 35 mΩ ID 30 A • MSL1 up to 260°C peak reflow • 175°C operating temperature


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    IPD26N06S2L-35 PG-TO252-3-11 2N06L35 726-IPD26N06S2L-35 2N06L35 2N06L v5856 GS6010 PCB REV 3.5 IPD26N06S2L-35 2N06L3 PDF

    2n0404

    Abstract: No abstract text available
    Text: IPB80N04S2-04 IPP80N04S2-04, IPI80N04S2-04 OptiMOS Power-Transistor Product Summary Features • N-channel - Enhancement mode • Automotive AEC Q101 qualified V DS 40 V R DS on ,max (SMD version) 3.4 mΩ ID 80 A • MSL1 up to 260°C peak reflow • 175°C operating temperature


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    IPB80N04S2-04 IPP80N04S2-04, IPI80N04S2-04 PG-TO263-3-2 PG-TO220-3-1 PG-TO262-3-1 IPP80N04S2-04 PG-TO263-3-2 2n0404 PDF

    MLV-0603

    Abstract: No abstract text available
    Text: 2381 553 3.6/MLV0603E3.3T Vishay BCcomponents SMD 0603 Multilayer Varistor FEATURES • Surface mount multilayer surge suppressor  Inherent bidirectional clamping  Excellent energy/volume ratio  Suitable for reflow soldering  Compliant to RoHS directive 2002/95/EC and in


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    6/MLV0603E3. 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12 MLV-0603 PDF

    NCB1206B102TR030F

    Abstract: NCB1206B121TR090F 0201 land pattern NCB1206B601TR040F NCB0603R600TR NCB0402P600TR030F NCB0805A152TR
    Text: Ferrite Chip Beads NCB Series FEATURES • RUGGED CONSTRUCTION IN STANDARD EIA SIZES • EFFECTIVE EM/RFI SUPPRESSION UP TO 1 Ghz • CURRENT RATINGS UP TO 5 AMPS STYLE 2 • 100% CLOSED MAGNETIC CIRCUIT, AVOIDS CROSSTALK • BOTH FLOW AND REFLOW SOLDERING APPLICABLE


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    -40OC 125OC NCB0201N100TR050F NCB0201N330TR030F NCB0201N560TR030F NCB0201N800TR050F NCB0201N121TR030F NCB0201N241TR020F NCB0402P300TR030F NCB0402P600TR030F NCB1206B102TR030F NCB1206B121TR090F 0201 land pattern NCB1206B601TR040F NCB0603R600TR NCB0805A152TR PDF

    NTCS0805E3.....T

    Abstract: NTCS0805E4474JXT NTCS0805E3T
    Text: 2381 615 1./NTCS0805E4. Vishay BCcomponents Surface Mount, NTC Thermistors FEATURES • TCR from 6 to 2 %/K even at high temperatures • Tolerance on B25/85 down to 1 % • AgPd terminations • Suitable for wave or reflow soldering • Old part number was 2322 615 1.


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    /NTCS0805E4. B25/85 2002/95/EC 2002/96/EC /NTCS0805E3. 08-Apr-05 NTCS0805E3.....T NTCS0805E4474JXT NTCS0805E3T PDF

    Untitled

    Abstract: No abstract text available
    Text: Type FCP Surface Mount Film Capacitors Stable Stacked Metallized Film PPS Chips for Reflow Soldering The Type FCP’s combination of high capacitance density and excellent high frequency response makes it a great choice for wireless and instrumentation applications.


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    PDF

    LTST-C930KRKT

    Abstract: No abstract text available
    Text: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Meet ROHS, Green Product. * Dome lens Chip LED. * Ultra bright AlInGaP Chip LED. * Package in 8mm tape on 7" diameter reels. * Compatible with automatic placement equipment. * Compatible with infrared and vapor phase reflow solder process.


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    LTST-C930KRKT BNS-OD-C131/A4 EIA-471 859-LTST-C930KRKT LTST-C930KRKT PDF

    MAL2140

    Abstract: 99113E3 99111E3 MAL214099
    Text: 140 CRH www.vishay.com Vishay BCcomponents Aluminum Capacitors SMD Chip , High Temperature FEATURES • Extended useful life for MAL214099.E3 parts to 6000 h at 125 °C • Parts for advanced high temperature reflow soldering according to JEDEC J-STD-020


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    MAL214099. J-STD-020 AEC-Q200 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 MAL2140 99113E3 99111E3 MAL214099 PDF

    OVSRRGBCC3

    Abstract: smd rgb led
    Text: Full-Color 1204 SMD 150° Viewing Angle OVSRRGBCC3 • • • • Full-color RGB Top-view or side-view mounting options Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder process The OVSRRGBCC3 is a compact full-color (RGB) in a miniature surface mount package with a 150° viewing


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    smd diode code met

    Abstract: VLMV3100
    Text: VLMV3100 Vishay Semiconductors Bicolor SMD LED PLCC-3 FEATURES • SMD LED with exceptional brightness • Multicolored • Luminous intensity categorized • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase


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    VLMV3100 J-STD-020 2002/95/EC 2002/96/EC JESD22-A114-B AEC-Q101 2011/65/EU 2002/95/EC. 2011/65/EU. smd diode code met VLMV3100 PDF

    BZG03C18

    Abstract: BZG03C24
    Text: BZG03C-Series www.vishay.com Vishay Semiconductors Zener Diodes FEATURES • High reliability • Voltage range 10 V to 270 V • Fits onto 5 mm SMD footpads • Wave and reflow solderable • AEC-Q101 qualified • Compliant to RoHS Directive 2002/95/EC and in


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    BZG03C-Series AEC-Q101 2002/95/EC 2002/96/EC BZG03C-series BZG03C-series-TR BZG03C-series-TR3 6000/box DO-214AC BZG03C18 BZG03C24 PDF

    Untitled

    Abstract: No abstract text available
    Text: Technical Data Sheet Reverse Package Chip LED 24-21/BHC-AP1Q2/2A Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type.


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    24-21/BHC-AP1Q2/2A DSE-0006428 6-Jan-2012 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4. Solder-mounting Flat Package ICs 1. Soldering conditions a. Soldering iron Solder a t lead tem p eratu re of 2 6 0 t for no m ore than 10 seconds or a t 350°C fo r no m ore th a n 3 seconds. b. Infrared reflow 1 W e recom m end heating m ethods in far-interm ediate infrared shown a t the top and bottom of


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