CuCrSiTi
Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Text: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds
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06-June-03
16H150
10mN/mm
10seconds
06-Junitial
CuCrSiTi
k75 leadframe
"leadframe material" DIP 20
INFINEON cross reference
FeNi42
solderability
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PDF
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Solderability Tests
Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free
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AN2036
2002/95/EU,
Solderability Tests
AN2036
AN-2036
an2036 st
joint interfacial
JESD22-B102
J-STD-002
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PDF
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alcohol isopropylic
Abstract: No abstract text available
Text: Cermet Potentiometer Specifications TESTS Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) Resistance to soldering heat < ±1% < ± 2% Solderability 95% of treated surface covered with solder Temperature cycling < ±2% Temperature coeficient
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Untitled
Abstract: No abstract text available
Text: EMI Filters 4.1 to 4.7 4.1 - Production process flowchart 4.3 - Tests conducted during batch manufacture Standard products Multilayer ceramic part manufacture discoidal or planar array Solderability ● Voltage proof test DWV / Flash Solder assembly Cleaning process
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50Vdc
100Vdc
200Vdc
300Vdc
500Vdc
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WIRE JUMPER
Abstract: No abstract text available
Text: 2306 101 90. Vishay BCcomponents Wire Jumper FEATURES ∑ Available in two diameters. ∑ Excellent solderability characteristics. ∑ Different types of packaging and taping configurations available. APPLICATIONS ∑ General industrial applications. ∑ General equipments.
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2306rements.
250mm
26-Jul-04
WIRE JUMPER
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Untitled
Abstract: No abstract text available
Text: Testing and termination types Tests conducted during batch manufacture Technical Summary Syfer reliability SM product group Standard SM capacitors IECQ-CECC / MIL grade AEC-Q200 S space grade High Rel S05 S02A Solderability l l l l l Resistance to soldering heat
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AEC-Q200
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Trichloroethane
Abstract: No abstract text available
Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS • MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability Maximum Soldering Temp. All units 100% leak tested.
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41450
Abstract: No abstract text available
Text: TESTS Carbon Potentiometer Specifications TESTS Resistance to soldering heat Solderability Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) < ±1% < ± 2% TEST METHOD (DIN STD 41450) a) Subject component to a temperature of 55º C and 20% RH for
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WIRE0580000000A500
Abstract: 12NC ordering code vishay RESISTOR AMMO PACKING
Text: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
WIRE0580000000A500
12NC ordering code vishay
RESISTOR AMMO PACKING
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PDF
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Untitled
Abstract: No abstract text available
Text: CLOCK OSCILLATOR GENERAL CHARACTERISTICS MECHANICAL SPECIFICATIONS Gross Leak Test Hermetically Sealed Package Seal Strength Thru-Hole Bend Test (Pin Material) Solvent Resistance Marking Ink Solderability OSCILLATORS Maximum Soldering Temp. 44 All units 100% leak tested.
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STATEK
Abstract: No abstract text available
Text: TECHNICAL NOTE 27 Soldering Considerations for Statek Leaded Crystals Statek’s CX-1 and CX-2 leaded miniature crystals pass most standard solderability tests, such as those described in MIL-STD-883 and MILSTD-202 i.e., 240ºC to 260ºC Solder Dip Pot without adverse electrical
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MIL-STD-883
MILSTD-202
STATEK
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WIRE JUMPER
Abstract: No abstract text available
Text: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
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2002/95/EC
11-Mar-11
WIRE JUMPER
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PDF
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Untitled
Abstract: No abstract text available
Text: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
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2002/95/EC
18-Jul-08
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PDF
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Untitled
Abstract: No abstract text available
Text: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
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2002/95/EC
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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PDF
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TMK105CH
Abstract: 104Z capacitor M05 SMD 131-GW CODE PJ 62-00 m1-0620 821GQ smd m0.5
Text: Pd ELECTRODE MULTILAYER CERAMIC CAPACITORS CLASS1 : TEMPERATURE COMPENSATING DIELECTRIC TYPE OPERATING TEMP. K55VJ125C FEATURES YNickel barrier end terminations to improve solderability. YMultilayer block structure provides higher reliability YA wide range of capacitance values available in standard case sizes.
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K55VJ125C
TMK105CH
104Z capacitor
M05 SMD
131-GW
CODE PJ 62-00
m1-0620
821GQ
smd m0.5
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PDF
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JRC-23FHS
Abstract: JRC-23F E158859 IEC255 relay 24VDC JRC 7200 IEC255-5 IEC255-7 relay 24VDC, IEC255 JRC23FHS IEC255-19-1
Text: JRC-23F JRC-23F Operation condition Insulation Resistance Dielectric Strength Between contacts Between contact and coil 1000M 50Hz 400V 50Hz 1000V Item 6 of IEC255-5 Item 6 of IEC255-5 Shock resistance Vibration resistance Terminals strength Solderability
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JRC-23F
1000M
IEC255-5
100m/s2
IEC68-2-27
IEC68-2-6
IEC68-2-21
IEC68-2-20
JRC-23FHS
JRC-23F
E158859
IEC255 relay 24VDC
JRC 7200
IEC255-5
IEC255-7
relay 24VDC, IEC255
JRC23FHS
IEC255-19-1
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PDF
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F0402FA0500V024T
Abstract: E232 F0402FA0750V024T F0402FA1000V024T F0402FA1500V024T F0402FA2000V024T V024 0603FA 4532 fuse EIAJ1005
Text: Rev. Jun. 09 SolidMatrix 0402 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability
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EIA0402/EIAJ1005
-55oC
125oC
F0402FA0500V024T
E232
F0402FA0750V024T
F0402FA1000V024T
F0402FA1500V024T
F0402FA2000V024T
V024
0603FA
4532 fuse
EIAJ1005
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PDF
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alcohol isopropylic
Abstract: piher 10 k 41450
Text: Carbon Potentiometer Specifications TESTS Resistance to soldering heat Solderability Piher typical test results 95% LOTS R % Value DIN std 41450 R(%) < ±1% < ± 2% 95% of treated surface covered with solder TEST METHOD (DIN STD 41450) a) Subject component to a temperature of 55º C and 20% RH for
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Microspire transformer
Abstract: No abstract text available
Text: CCM Technology • • • • • • • Applied standards : MIL-STD202, ECSS-Q-70, D0-160D, Pick and place compatible Materials meet UL94-V0 rating Temperature range : -55°C – + 125°C ROHS by default, non ROHS upon request Meets solderability tests per MIL-STD 202-Method 208
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MIL-STD202,
ECSS-Q-70,
D0-160D,
UL94-V0
202-Method
H/25A
200kHz
CCM25
CCM20
Microspire transformer
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PDF
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F0603FA
Abstract: F0603FA3000V032T F0603FA1500V032T F0603FA1000V032T F0603FA2000V032T F0603FA2500V032T F0603FA0750V032T F0603FA4000V032T F0603FA1000 F0603FA0500V032T
Text: Rev. Jun. 09 SolidMatrix 0603 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability
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EIA0603/EIAJ1608
-55oC
125oC
F0603FA
F0603FA3000V032T
F0603FA1500V032T
F0603FA1000V032T
F0603FA2000V032T
F0603FA2500V032T
F0603FA0750V032T
F0603FA4000V032T
F0603FA1000
F0603FA0500V032T
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PDF
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EIA-96
Abstract: ACR0603 CR0603 CR0805 CR1206
Text: Products number on the back cover. Features • ■ ■ ■ Very high quality and stability Power rating at 70°C: CR0603 - 0.10W, CR0805 - 0.125W, CR1206 - 0.25W Three layer contacting process with nickel barrier prevents leaching and provides excellent solderability
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CR0603
CR0805
CR1206
CR0603/CR0805/CR1206
CR0603
CR0805
CR1206
1/10W
1000Hr
CR0805-JW-LAB2
EIA-96
ACR0603
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PDF
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sn-pb-ag solder paste
Abstract: 62Sn36Pb2Ag IPC-A-610C
Text: Application Report SZZA035 - October 2002 Board-Mount Evaluation of Tin-Plated Component Leads Douglas W. Romm, Donald C. Abbott, Bernhard Lange, and Muhammad Khan Standard Linear & Logic ABSTRACT The solderability performance of tin Sn -plated integrated circuit (IC) component leads is
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SZZA035
sn-pb-ag solder paste
62Sn36Pb2Ag
IPC-A-610C
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MIL-R-55342D
Abstract: MIL-R-55342-D RS-396 E-48 Multiplier Code RS 396 CR0603 CR0805 CR1206 CR1206 array 103M 500v
Text: Features • ■ ■ ■ Very high quality and stability Power rating at 70°C: CR0603 - 0.10W, CR0805 - 0.125W, CR1206 - 0.25W Three layer contacting process with nickel barrier prevents leaching and provides excellent solderability ■ ■ Tight tolerances of bottom electrode
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CR0603
CR0805
CR1206
CR0603/CR0805/CR1206
CR0603
CR0805
CR1206
1/10W
1000Hr
CR0805-JW-LAB2
MIL-R-55342D
MIL-R-55342-D
RS-396
E-48 Multiplier Code
RS 396
CR1206 array
103M 500v
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PDF
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Untitled
Abstract: No abstract text available
Text: JUMPER Vishay BCcomponents Wire Jumper FEATURES • Available in two diameters • Excellent solderability characteristics • Different types of packaging and taping configurations available • Lead Pb -free solder contacts • Pure tin plating provides compatibility with lead (Pb)-free
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2002/95/EC
08-Apr-05
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