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    SOLDER BALL PLACEMENT Search Results

    SOLDER BALL PLACEMENT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDER BALL PLACEMENT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    WLCSP flip chip

    Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
    Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters


    Original     		PDF

    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga
    Text: Ceramic Ball Grid Array Surface Mount Assembly Application Note 1298 1. Package Description Ceramic Ball Grid Array CBGA is a custom platform supporting a wide variety of performance applications. This package uses flip chip as the first level interconnection and solder ball as the second level


    Original     		PDF 5988-6603EN solder paste alpha WS609 WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga

    BGA PROFILING

    Abstract: hot air bga bga rework fine BGA thermal profile reflow hot air BGA
    Text: 2xxxx-APP-002-A September 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for Ball Grid Array (BGA) packages. The BGA packages that can


    Original     		PDF 2xxxx-APP-002-A BGA PROFILING hot air bga bga rework fine BGA thermal profile reflow hot air BGA

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5139XZ SMM5139XZ

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5139XZ SMM5139XZ

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		PDF AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U

    Untitled

    Abstract: No abstract text available
    Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc


    Original     		PDF SMM5138XZ -13dB 22dBm 30dBc SMM5138XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc


    Original     		PDF SMM5138XZ -13dB 22dBm 30dBc SMM5138XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm


    Original     		PDF ES/SMM5141XZ -12dB 22dBm 30dBc ES/SMM5141XZ

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm


    Original     		PDF ES/SMM5141XZ -12dB 22dBm 30dBc ES/SMM5141XZ

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5143XZ Preliminary 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm


    Original     		PDF ES/SMM5143XZ 30GHz -12dB 24dBm ES/SMM5143XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5143XZ 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm


    Original     		PDF ES/SMM5143XZ 30GHz -12dB 24dBm ES/SMM5143XZ

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5724XZ 30GHz 50ohm ES/SMM5724XZ

    UA42

    Abstract: VFBGA-48 bga rework aa56 yamaichi socket
    Text: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm


    Original     		PDF 56GQL 56-pin 65-mm SCET004 UA42 VFBGA-48 bga rework aa56 yamaichi socket

    Untitled

    Abstract: No abstract text available
    Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB


    Original     		PDF SMM5145XZ -12dB 22dBm 10dBm SMM5145XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5723XZ 24GHz 50ohm ES/SMM5723XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB


    Original     		PDF SMM5145XZ -12dB 22dBm 10dBm SMM5145XZ

    JEP95 MS-028

    Abstract: No abstract text available
    Text: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5723XZ 24GHz 50ohm ES/SMM5723XZ JEP95 MS-028

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm


    Original     		PDF ES/SMM5144XZ 30GHz ES/SMM5144XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5144XZ 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm


    Original     		PDF ES/SMM5144XZ 30GHz ES/SMM5144XZ

    BGA PROFILING

    Abstract: fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V
    Text: 211xx-APP-002-A April 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Products Affected: M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, M21161G5 Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to


    Original     		PDF 211xx-APP-002-A M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, BGA PROFILING fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V