CBGA Search Results

CBGA Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
DAC5670MGEM/EM		Texas Instruments	14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA 25 Only
5962-0724701VXA		Texas Instruments	14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA -55 to 125

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KEMET Corporation C0805C100CBGACTU CAP CER 10PF 630V C0G/NP0 0805
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	C0805C100CBGACTU	Digi-Reel	3,053		1	1 $0.83 10 $0.525 100 $0.3676 1000 $0.28568 10000 $0.28568	Buy Now
	C0805C100CBGACTU	Cut Tape	3,053		1	1 $0.83 10 $0.525 100 $0.3676 1000 $0.28568 10000 $0.28568	Buy Now
	C0805C100CBGACTU	Reel	2,500		2,500	1 - 10 - 100 - 1000 - 10000 $0.23789	Buy Now
Newark	C0805C100CBGACTU	Reel			2,500	1 $0.289 10 $0.289 100 $0.289 1000 $0.289 10000 $0.261	Buy Now
Renesas Electronics Corporation R7S721010VCBG-AC0 IC MPU RZ/A1M 400MHZ 256LFBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	R7S721010VCBG-AC0	Tray	201		1	1 $22.51 10 $18.158 100 $17.1248 1000 $17.1248 10000 $17.1248	Buy Now
Renesas Electronics Corporation R7S921056VCBG-AC0 IC MPU RZ/A2M 528MHZ 256LFBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	R7S921056VCBG-AC0	Tray	198		1	1 $20.22 10 $16.258 100 $15.2684 1000 $15.23747 10000 $15.23747	Buy Now
Renesas Electronics Corporation R7S921042VCBG-AC0 IC MPU RZ/A2M 528MHZ 272FBGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	R7S921042VCBG-AC0	Tray	180		1	1 $18.85 10 $15.121 100 $14.11244 1000 $14.11244 10000 $14.11244	Buy Now
Renesas Electronics Corporation R7FS5D97C3A01CBG-AC0 SYNERGY MCU PLATFORM S5D9 640K 1
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	R7FS5D97C3A01CBG-AC0	Tray	152		1	1 $17.49 10 $16.207 100 $15.43675 1000 $14.12193 10000 $14.12193	Buy Now

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CBGA Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
CBGA		Amkor Technology	From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.		Original	PDF

CBGA Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
61995AB124D1 Abstract: No abstract text available Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm	Original	609-50AB 609-100AB 609-50AB) 609-100AB) 61995AB124D1	PDF
N429 Abstract: S-CBGA-N429 Text: MECHANICAL DATA MCBG004 – SEPTEMBER 1998 GLP S-CBGA-N429 CERAMIC BALL GRID ARRAY 27,20 SQ 26,80 25,40 TYP 1,27 1,27 AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 1,22 1,00 5 4 9 7 6 8 10 11 13 15 17 19 21 12 14 16 18 20 3,30 MAX Seating Plane 0,90 0,60	Original	MCBG004 S-CBGA-N429) 4164732/A MO-156 N429 S-CBGA-N429	PDF
Untitled Abstract: No abstract text available Text: MECHANICAL DATA MCBG005 – NOVEMBER 1998 GLK S-CBGA-N567 CERAMIC BALL GRID ARRAY 31,20 SQ 30,80 29,21 TYP 1,27 0,635 0,635 1,27 AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 7 5 4 6 9 8 10 11 13 15 17 19 21 23 12 14 16 18 20 22 24 3,30 MAX Seating Plane	Original	MCBG005 S-CBGA-N567) 4164730/A MO-156	PDF
FXBI04 Abstract: CY7C965 Signal Path Designer CY7C96 Text: ADVANCED INFORMATION CY7C965 Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Fault tolerant systems may require the implementation of mul tiple redundant paths between nodes in the fabric. Time-critical elements in the fabric may require interrupt support, low	OCR Scan	CY7C965 361-pin FXBI04 CY7C965 Signal Path Designer CY7C96	PDF
reliability data Abstract: MOS13 XPC7410 XPC7410RX Text: M XPC7410RX RELIABILITY DATA SUMMARY XPC7410 Fab: Mask: Process: Package: Assy: - Nitro - Information MOS13, Austin, TX K65D HiP6L 25 x 25 mm CBGA, 360 Pin BAT-1, Austin, Tx XPC7410 - Nitro - TECHNOLOGY: MOS13 on the 0.15µm Nominal HiP6L process DYNAMIC LIFETEST (2.35V, 90°C)	Original	XPC7410RX XPC7410 MOS13, XPC7410 MOS13 reliability data	PDF
120C Abstract: 140C 210C Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using	Original	N130MZ327 N163MZ163 N169MZ365 N161MZ612 N169MZ641 120C 140C 210C	PDF
16M Flash Memory Abstract: AT49BV163D Text: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •	Original	16-Mbit 66-ball 3618B 16M Flash Memory AT49BV163D	PDF
3466A Abstract: AT52BC3221A AT52BC3221AT SA70 Text: Features • 32-Mbit Flash and 4-Mbit/8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • • • • • • • • • • • • • • 32-megabit (2M x 16) 2.7V to 3.3V Read/Write Access Time – 70 ns	Original	32-Mbit 66-ball 32-megabit 3466A AT52BC3221A AT52BC3221AT SA70	PDF
CBGA Abstract: No abstract text available Text: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top	OCR Scan	PID9q-604e CBGA	PDF
Untitled Abstract: No abstract text available Text: data sheet CERAMIC / HERMETIC CMCM Ceramic Multi-Chip Module Package CMCM The MCM/CBGA and MCM/PBGA by Amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package	Original	DS804	PDF
DH11 Abstract: DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29 Text: OFFICIAL - 9/17/97 CBGA Footprints Rev. F 603 Family CBGA C16 E04 D13 F02 D14 G01 D15 E02 D16 D04 E13 G02 E15 H01 E16 H02 F13 J01 F14 J02 F15 H03 F16 F04 G13 K01 G15 K02 H16 M01 J15 P01 L02 K04 C01 B04 B03 B02 A04 B07 J04 A10 L01 B06 E01 D08 A06 D07 B01 B05	Original	604ev 603ev. 604ev. 604ev DH11 DH21 DH23 b09 n03 DH19 dh17 A09 N03 Dh14 dh28 Dh29	PDF
FCS 1861 Abstract: wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER Text: 1.6 Pinout Listings Table 10 provides the pinout listing for the 604e CBGA package. Table 10. Pinout Listing for the CBGA Package Pin Number Signal Name Active I/O A [0-31 C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G 0 2 , E15, H01, E16, H02, F13, J01, F14, J02, F15, H03,	OCR Scan	T02otorola PID9q-604e FCS 1861 wakefield compound 2333B b09 n03 SIGNAL PATH DESIGNER	PDF
12-Bit Parallel-IN Serial-OUT Shift Register Abstract: cypress IM103 adaptive cruise control cruise control CYIA2SC0300AA-BQE Glass Seal Cmos imager sensor Text: CYIA2SC0300AA-BQE 1/3” VGA-Format CMOS Image Sensor Features • • • • • • 1 VGA Resolution 1/3” Optical Format Automotive Grade device 120 db Dynamic Range 60 PIN CBGA Low power dissipation Functional Description Cypress IM103 is Automotive grade CMOS Image Sensor with	Original	CYIA2SC0300AA-BQE IM103 12-Bit Parallel-IN Serial-OUT Shift Register cypress IM103 adaptive cruise control cruise control CYIA2SC0300AA-BQE Glass Seal Cmos imager sensor	PDF
intercom phone system block diagram Abstract: audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller Text: ZL38003 AEC with Noise Reduction & Codecs for Digital Hands-Free Communication Data Sheet Zarlink has introduced a new generation family of AEC ZL38002 and ZL38004 . Zarlink recommends these products for new designs. May 2007 Ordering Information ZL38003GMG 81 Ball CBGA Trays, Bake & Drypack	Original	ZL38003 ZL38002 ZL38004) ZL38003GMG ZL38003GMG2 intercom phone system block diagram audio howling INTERCOM FULL-duplex Automatic Gain Control AGC Algorithm Users mic preamp with echo adaptive filter micro electret echo mic preamp c code for microphone noise canceller	PDF

BGA reflow guide Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using	Original	N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile	PDF
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles	PDF
AT52BR1672 Abstract: AT52BR1674 Text: Features • 16-Mbit Flash and 2-Mbit/4-Mbit SRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • •	Original	16-Mbit 66-ball 2604B AT52BR1672 AT52BR1674	PDF
LC2D Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting Text: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned	Original	AD14160/ AD14160L AD14160/AD14160L AD14060 ADSP-21060 AD14x60 C3255 LC2D SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L socket am3 mounting	PDF
SA8 357 Abstract: AT52BR3244 AT52BR3244T SA10 SA11 SA70 Text: Features • 32-Mbit Flash and 4-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • • • • • •	Original	32-Mbit 66-ball 07/01/xM SA8 357 AT52BR3244 AT52BR3244T SA10 SA11 SA70	PDF
PC755BM8 Abstract: MCP 67 MV PC745 PC755M8 PCX755B Text: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz	Original	PC755BM8 PC755BM8 2164C MCP 67 MV PC745 PC755M8 PCX755B	PDF
Untitled Abstract: No abstract text available Text: CYPRESS ADVANCED INFORMATION Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Building Block for Scaleable Networks Preemptable prioritized transactions Adaptive Routing support	OCR Scan	361-pin CY7C965	PDF
3618A Abstract: No abstract text available Text: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •	Original	16-Mbit 66-ball 3618A	PDF
66c4 Abstract: No abstract text available Text: Features • 32-Mbit Flash and 4-Mbit/8-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85, 90, 110 ns • Sector Erase Architecture • • • • • • •	Original	32-Mbit 66-ball 2471D 66c4	PDF
AT52BC6402DT-70CU Abstract: 3619a AT49BV640D AT52BC6402D AT52BC6402DT 66C7 Text: Features • 64-Mbit Flash and 16-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.1V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •	Original	64-Mbit 16-Mbit 66-ball AT52BC6402DT-70CU 3619a AT49BV640D AT52BC6402D AT52BC6402DT 66C7	PDF

CBGA Search Results

CBGA Result Highlights (2)

CBGA Price and Stock

KEMET Corporation C0805C100CBGACTU

Renesas Electronics Corporation R7S721010VCBG-AC0

Renesas Electronics Corporation R7S921056VCBG-AC0

Renesas Electronics Corporation R7S921042VCBG-AC0

Renesas Electronics Corporation R7FS5D97C3A01CBG-AC0

CBGA Datasheets (1)

CBGA Datasheets Context Search

61995AB124D1

N429

Untitled

FXBI04

reliability data

120C

16M Flash Memory

3466A

CBGA

Untitled

DH11

FCS 1861

12-Bit Parallel-IN Serial-OUT Shift Register

intercom phone system block diagram

BGA reflow guide

ceramic rework

AT52BR1672

LC2D

SA8 357

PC755BM8

Untitled

3618A

66c4

AT52BC6402DT-70CU