Untitled
Abstract: No abstract text available
Text: SOJ26-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.83 TYP. 1/Mar. 21, 2000
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SOJ26-P-300-1
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Untitled
Abstract: No abstract text available
Text: 26P0J-B Weight g Lead Material Alloy 42 e b2 14 e1 19 HE 21 E 26 e1 c D Recommended Mount Pad Symbol 1 6 13 8 L A A1 b1 e y I2 JEDEC Code – I1 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2
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26P0J-B
SOJ26/24-P-300-1
26pin
300mil
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27-3 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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SOJ26/24-P-300-1
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Untitled
Abstract: No abstract text available
Text: 26P0D-B JEDEC Code – Weight g Lead Material Alloy 42 b2 I1 e e1 HE 14 19 21 E 26 e1 c D Recommended Mount Pad Symbol 1 8 6 13 L A A1 b1 e y I2 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ(LOC) b SEATING PLANE A A1 b b1 c D E e e1 HE L
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26P0D-B
SOJ26/24-P-300-1
26pin
300mil
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SOJ26
Abstract: No abstract text available
Text: SOJ26/20-P-350-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.01 TYP. 5 版/96.12.5
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SOJ26/20-P-350-1
SOJ26
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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SOJ26/24-P-300-1
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Untitled
Abstract: No abstract text available
Text: SOJ26-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数／改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 0.83 TYP. 1 版/00.3.21
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SOJ26-P-300-1
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Untitled
Abstract: No abstract text available
Text: SOJ26/20-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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SOJ26/20-P-300-1
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ26/24-P-300-1
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SOJ26
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27-3 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ26/24-P-300-1
SOJ26
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20-P-350
Abstract: No abstract text available
Text: SOJ26/20-P-350-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ26/20-P-350-1
20-P-350
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26P0J
Abstract: No abstract text available
Text: 26P0J Plastic 26pin 300mil SOJ EIAJ Package Code SOJ26/20-P-300-1.27 JEDEC Code – Weight g 0.75 Lead Material Alloy 42 e b2 c e1 HE 14 18 22 E 26 e1 I1 I2 D Recommended Mount Pad Symbol 1 9 5 13 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y
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26P0J
26pin
300mil
SOJ26/20-P-300-1
26P0J
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PDF
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SOJ26
Abstract: No abstract text available
Text: SOJ26/20-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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Original
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SOJ26/20-P-300-1
SOJ26
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26/20-P-350-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.01 TYP. 5/Dec. 5, 1996
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Original
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SOJ26/20-P-350-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.80 TYP. 5/Dec. 5, 1996
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Original
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SOJ26/24-P-300-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26/20-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.80 TYP. 5/Dec. 5, 1996
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SOJ26/20-P-300-1
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4A04I
Abstract: tc514100a
Text: TC51441OAP/AJ/ASJ/AZ—70, TC51441OAP/AJ/ASJ/AZ-80 TC51441OAP/AJ/ASJ/AZ-10 PRELIMINARY 1,048,576 W ORD x 4 BIT DYNAMIC RAM DESCRIPTION The TC51441 OAP/AJ/ASJ/AZ is the new generation dynamic RAM organized 1,048,576 words by 4 bits. The TC514410AP/AJ/ASJ/AZ utilizes TOSHIBA’S CMOS Silicon gate process technology as well as
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TC51441OAP/AJ/ASJ/AZ--
TC51441OAP/AJ/ASJ/AZ-80
TC51441OAP/AJ/ASJ/AZ-10
TC51441
TC514410AP/AJ/ASJ/AZ
350mil)
TC514100AP/AJ/ASJ/AZ.
TC5141OOAP/AJ/ASJ/AZ-60
4A04I
tc514100a
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PDF
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY 4,194,304 WORD x 1 BIT DYNAMIC RAM DESCRIPTION The TC514101AP/AJ/ASJ/AZ is the new generation dynamic RAM organized 4,194,304 words by 1 bit. The TC514101AP/AJ/ASJ/AZ utilizes TOSHIBA’S CMOS Silicon gate process technology as well as advanced circuit techniques to provide wide operating m argins, both internally and to the system user.
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TC514101AP/AJ/ASJ/AZ
300/350mil)
TC514101AP/ASJ/AZ.
TC514101AP/AJ/ASJ/A2-70,
TC514101AP/AJ/ASJ/AZ-80
TC514101AP/AJ/ASJ/AZ-10
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TC5116400
Abstract: tc5116400csj 300D1 toshiba RAS-25
Text: INTEGRATED TOSHIBA TO SH IBA M O S DIGITAL NTEGRATED CIRCUIT CIRCUIT TECHNICAL T C 5 1 16 4 0 0 C S J / C S T - 4 0 T C 5 1 1 6 4 0 0 C S J / C S T - 50 T C 5 1 1 6 4 0 0 CSJ / C S T * 60 DATA SILICON GATE C M O S TENTATIVE D ATA 4,194,304 W O R D x 4 BIT D Y N A M IC R A M
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TC5116400CSJ/CST
300mil)
400CSJ/C
TC5116400
CSJ/CST-40
CSJ/CST-50
tc5116400csj
300D1
toshiba RAS-25
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PDF
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TC51V16405
Abstract: TC51V16405c
Text: INTEGRATED TOSHIBA " O S H I B A MOS DIGITAL I NT EGR AT ED CIRCUIT ” 51 V 16405 C5JS CST5 - SO TCS1V1c405 CSJ S/CSTS- 60 CIRCUIT TECHNICAL DATA SILICON GATE CMOS TENTATIVE DATA 4,194,304 W O RD x 4 BIT FAST PAGE DYNAM IC RAM DESCRIPTION The TC51V16405CSJS/CSTS is fast page dynamic RAM organized 4,194,304 words by 4 bits. The
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OCR Scan
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TCS1V1c405
TC51V16405CSJS/CSTS
300mil)
TCS1V16405
TC51V16405
SOJ26
TSOP26
TC51V16405c
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PDF
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A100COLUMN
Abstract: No abstract text available
Text: 4 ,1 9 4 ,3 0 4 W ORD x 1 BIT D Y N A M IC R A M * This is advanced information and specifica tions are subject to change without notice. DESCRIPTION The TC514101AP/AJ/ASJ/AZ is the new generation dynamic RAM organized 4,194,304 words by 1 bit. The TC514101AP/AJ/ASJ/AZ utilizes TOSHIBA’S CMOS Silicon gate process technology as well as
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OCR Scan
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TC514101AP/AJ/ASJ/AZ
300/350mil)
TC514101AP/ASJ/AZ.
TC514101AP/AJ/ASJ/AZ-60
A100COLUMN
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PDF
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tc51100ap
Abstract: DIP18-P-300E TC514100
Text: 4,1 94 ,3 0 4 W O R D X PRELIMINARY 1 BIT D Y N A M IC RAM DESCRIPTION The TC514100AF/AJ/ASJ/AZ is the new generation dynamic RAM organized 4,194,304 words by 1 bit. The TC514100AP/AJ/ASJ/AZ utilizes TOSHIBA’S CMOS Silicon gate process technology as well as
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OCR Scan
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TC514100AF/AJ/ASJ/AZ
TC514100AP/AJ/ASJ/AZ
300/350mil)
TC514100AP/AJ/ASJ/AZ.
TC5141
TC514100AP/AJ/ASJ/AZ-80
tc51100ap
DIP18-P-300E
TC514100
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PDF
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TC514100
Abstract: 514100A
Text: 4,194,304 WORD X 1 BIT DYNAMIC RAM DESCRIPTION THE TC514100A is the new generation dynamic RAM organized 4,194,304 word by 1 bit. The TC514410ASJ/AZ/AFT utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit
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OCR Scan
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--------------TC514100ASJ/AZ/AFT-60/70/80
TC514100A
TC514410ASJ/AZ/AFT
300mil)
TC51400/ASJ/A27AFT.
TC514100
514100A
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PDF
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KSR128
Abstract: a95x A348 20 pin
Text: TC514400ÂPL/ÂJL/ASJL/AZL-60 * This is advanced information and specifica tions are subject to change without notice. 1,048,576 W ORD x 4 BIT D YN A M IC RAM DESCRIPTION The TC514400APL/AJL/ASJL/AZL is the new generation dynamic RAM organized 1,048,576 words by
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OCR Scan
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TC514400
JL/ASJL/AZL-60
TC514400APL/AJL/ASJL/AZL
300/350mil)
TC514400APL/AJL/ASJL/AZL.
a512K
TC514400APL/AJL/ASJL/AZL-60
KSR128
a95x
A348 20 pin
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PDF
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