Untitled
Abstract: No abstract text available
Text: SOJ26-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.83 TYP. 1/Mar. 21, 2000
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Original
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SOJ26-P-300-1
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PDF
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SOJ-24
Abstract: SOJ24-P-300-1 HE1324
Text: 24P0J Plastic 24pin 300mil SOJ EIAJ Package Code SOJ24-P-300-1.27 Weight g 0.68 JEDEC Code – Lead Material Alloy 42 e b2 e1 e1 E HE 13 24 I1 I2 c D Recommended Mount Pad 1 Symbol 12 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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Original
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24P0J
24pin
300mil
SOJ24-P-300-1
SOJ-24
HE1324
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PDF
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SOJ28-P-400-1
Abstract: No abstract text available
Text: 28P0N-A Plastic 28pin 400mil SOJ LOC EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code – Weight(g) Lead Material Alloy 42 e D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e b2 y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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Original
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28P0N-A
28pin
400mil
SOJ28-P-400-1
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PDF
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Untitled
Abstract: No abstract text available
Text: 28P0K Plastic 28pin 400mil SOJ EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code MO-061AA Weight g 1.08 Lead Material Alloy 42 e D b2 28 I1 I2 c e1 E HE e1 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2
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Original
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28P0K
28pin
400mil
SOJ28-P-400-1
MO-061AA
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PDF
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Untitled
Abstract: No abstract text available
Text: 26P0J-B Weight g Lead Material Alloy 42 e b2 14 e1 19 HE 21 E 26 e1 c D Recommended Mount Pad Symbol 1 6 13 8 L A A1 b1 e y I2 JEDEC Code – I1 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2
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Original
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26P0J-B
SOJ26/24-P-300-1
26pin
300mil
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PDF
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SOJ28-P
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 5/Dec. 5, 1996
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Original
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SOJ28-P-400-1
SOJ28-P
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PDF
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SOJ28
Abstract: No abstract text available
Text: SOJ28/24-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 5/Dec. 5, 1996
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Original
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SOJ28/24-P-400-1
SOJ28
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27-3 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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Original
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SOJ26/24-P-300-1
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PDF
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soj28
Abstract: No abstract text available
Text: SOJ28/24-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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Original
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SOJ28/24-P-400-1
soj28
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PDF
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SOJ28-P-300-1
Abstract: No abstract text available
Text: SOJ28-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 0.80 TYP. 3 版/96.12.5
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Original
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SOJ28-P-300-1
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PDF
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SOJ28-P
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.30 TYP. 5 版/96.12.5
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Original
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SOJ28-P-400-1
SOJ28-P
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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Original
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SOJ28-P-400-1
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PDF
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SOJ28-P-300-1
Abstract: MAR 749
Text: 28P0D-A EIAJ Package Code SOJ28-P-300-1.27 Plastic 28pin 300mil SOJ LOC Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 Under Development D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad 14 1 L A A1 b1 e y b SEATING PLANE Symbol A A1 b b1 c D E e e1
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Original
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28P0D-A
SOJ28-P-300-1
28pin
300mil
MAR 749
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PDF
|
Untitled
Abstract: No abstract text available
Text: 26P0D-B JEDEC Code – Weight g Lead Material Alloy 42 b2 I1 e e1 HE 14 19 21 E 26 e1 c D Recommended Mount Pad Symbol 1 8 6 13 L A A1 b1 e y I2 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ(LOC) b SEATING PLANE A A1 b b1 c D E e e1 HE L
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Original
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26P0D-B
SOJ26/24-P-300-1
26pin
300mil
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PDF
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|
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SOJ28
Abstract: No abstract text available
Text: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E) 400 mils DESCRIPTION
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Original
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M624256
SOJ28
M624256
SOJ28
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PDF
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SOJ26
Abstract: No abstract text available
Text: SOJ26/20-P-350-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.01 TYP. 5 版/96.12.5
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Original
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SOJ26/20-P-350-1
SOJ26
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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Original
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SOJ26/24-P-300-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOJ26-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数／改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 0.83 TYP. 1 版/00.3.21
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Original
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SOJ26-P-300-1
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PDF
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Untitled
Abstract: No abstract text available
Text: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE DATA BRIEFING 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E)
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Original
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M624256
SOJ28
M624256
A0-A17
AI00811
SOJ28
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PDF
|
Untitled
Abstract: No abstract text available
Text: SOJ26/20-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.80 TYP. 5 版/96.12.5
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Original
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SOJ26/20-P-300-1
|
PDF
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SOJ28-P-300-1
Abstract: No abstract text available
Text: SOJ28-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.80 TYP. 3/Dec. 5, 1996
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Original
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SOJ28-P-300-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SOJ26/24-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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Original
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SOJ26/24-P-300-1
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PDF
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SOJ28-P-300-1
Abstract: No abstract text available
Text: 28P0J Plastic 28pin 300mil SOJ EIAJ Package Code SOJ28-P-300-1.27 JEDEC Code – Weight g 0.81 Lead Material Alloy 42 e b2 D e1 28 e1 HE E 15 Recommended Mount Pad Symbol 14 1 L A A1 b1 e I1 I2 c y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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Original
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28P0J
28pin
300mil
SOJ28-P-300-1
|
PDF
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Untitled
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Unit nn Sep.2000
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OCR Scan
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SDJ28-P-400-1
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PDF
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