SN96AG4
Abstract: SF-SO28A-J-01F Sn96Ag4 solder
Text: 17.78mm [0.700"] RoHS COMPLIANT 11.20mm [0.441"] 2.54mm [0.100"] Top View 0.43mm dia. typ. [0.017"] 2 3 1 9.50mm [0.374"] 5.25mm [0.207"] 0.43mm typ. [0.017"] 9.93mm [0.391"] 1.27mm typ. [0.050"] End View Side View Compatible target board land pattern not to scale
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Original
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Sn96Ag4
SF-SO28A-J-01F
Sn96Ag4 solder
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PDF
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IS410 brass
Abstract: IS410 SF-SO20A-J-03F IS410 IPC
Text: 13.08mm [0.515"] RoHS COMPLIANT 11.20mm [0.441"] 5.08mm [0.200"] Top View 0.46mm dia. typ. [0.018"] 2 9.49mm [0.374"] 1 3 9.93mm [0.391"] 0.43mm typ. [0.017"] Side View 1.27mm typ. [0.050"] End View Compatible target board land pattern not to scale 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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Original
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IS410
Sn96Ag4
SF-SO20A-J-03F
IS410 brass
IS410 IPC
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PDF
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Sn96Ag4 solder
Abstract: SN96AG4
Text: RoHS COMPLIANT 35.56mm [1.400"] 17.78mm [0.700"] 2.54mm [0.100"] typ. Top View 15.2mm [0.600"] 3 1 10.0mm ±0.38mm [0.392"±0.015"] 2 6.2mm ±0.38mm [0.244"±0.015"] 4 1.27mm [0.050"] typ. 0.43mm [0.017"] typ. 3.2mm [0.125"] 9.93mm [0.391"] End View Side View
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Original
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finish10µ
Sn96Ag4
PC-DIP/SOIC28-02F
SOIC28-02F
Sn96Ag4 solder
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PDF
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Sn96Ag4 0.6
Abstract: RPIP-696-00
Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. FERRULE: Copper alloy with a suitable plating see below for plating information . 3. SOLDERSHIELD DEVICE:
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Original
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Sn96Ag4
HET-A-02X
D060000
D050290
13-Jan-06
Sn96Ag4 0.6
RPIP-696-00
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PDF
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Sn96Ag4 0.6
Abstract: soic-28
Text: 35.6mm [1.400"] RoHS COMPLIANT 1 17.8mm [0.700"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, RoHS compliant plating. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . 3 2.5mm typ. Top View
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Original
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Sn96Ag4
PC-DIP/SOIC28-01F
Sn96Ag4 0.6
soic-28
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PDF
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Sn96Ag4
Abstract: Sn96Ag4 solder SN96 SOIC20 P6755
Text: RoHS COMPLIANT 10.16mm [0.400"] P6755 25.40mm [1.000"] 7.62mm [0.300"] 2.54mm typ. [0.100"] Top View 3 1 8.15mm [0.321"] 13.92mm ± 0.381mm [0.548" ± 0.015"] assembled 2 12.40mm[0.488"] assembled 4 9.42mm [0.371"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"]
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Original
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P6755
381mm
Sn96Ag4
PC-DIP/SOIC20-02F
Sn96Ag4 solder
SN96
SOIC20
P6755
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PDF
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Untitled
Abstract: No abstract text available
Text: 35.56mm [1.400"] RoHS COMPLIANT 11.25mm 10.16mm [0.443"] [0.400"] 7.62mm [0.300"] 2.54mm typ. [0.100"] Top View 3 1 8.15mm [0.321"] 14.29mm ±.38mm [0.563"±0.015"] 3 2 10.46mm[0.412] 4 9.93mm [0.391"] 0.43mm typ. [0.017"] Side View 1.27mm typ. [0.050"] End View
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Original
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FR4/G10
Sn96Ag4
PC-DIP/SOIC28-07F
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PDF
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Untitled
Abstract: No abstract text available
Text: RoHS COMPLIANT 22.86mm [0.900"] 10.16mm [0.400"] 7.62mm [0.300"] 2.54mm typ. [0.100"] Top View 3 1 8.15mm [0.321"] 13.95mm ±.38mm assembled [0.549" ±0.015"] 10.11mm ±.38mm assembled [0.398" ±0.015"] 2 4 9.93mm [0.391"] 0.43mm typ. [0.017"] Side View 1.27mm typ. [0.050"]
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Original
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Sn96Ag4
PC-DIP/SOIC18-04F
SOIC18-04F
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PDF
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Sn96Ag4
Abstract: SAE-AMS-QQ-P-416 raychem solder sleeve hexashield RPIP-696-00 Sn96Ag4 solder D050290 rpip 696-00 SAE-AMS-C-26074 TE CONNECTIVITY
Text: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. FERRULE: Copper alloy with a suitable plating see below for plating information . 3. SOLDERSHIELD DEVICE:
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Original
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Sn96Ag4
HET-A-02X
16-Apr-11
D060000
D050290
9-May-11
SAE-AMS-QQ-P-416
raychem solder sleeve
hexashield
RPIP-696-00
Sn96Ag4 solder
rpip 696-00
SAE-AMS-C-26074
TE CONNECTIVITY
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PDF
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Sn96Ag4 0.6
Abstract: Sn96Ag4 solder Sn96Ag4 62Sn36Pb2Ag 107B SN62 PB36 ag2 Copper SN62 PB36 ag2 heat conductivity Automotive Power Electronics
Text: Thermal Solutions Insulated Aluminum Substrates Thermal Solutions for Power Applications T.T. Electronics is a leading designer and manufacturer of electronic components. As a result of our experience with power components, Anotherm substrates, an innovative method of addressing thermal
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Original
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Mil-Std-202
Sn62/Pb36/Ag2)
Sn96Ag4 0.6
Sn96Ag4 solder
Sn96Ag4
62Sn36Pb2Ag
107B
SN62 PB36 ag2 Copper
SN62 PB36 ag2 heat conductivity
Automotive Power Electronics
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PDF
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SF-SO20C-J-01F
Abstract: No abstract text available
Text: RoHS COMPLIANT 12.70mm [0.500"] 7.26mm [0.286"] Top View 0.46mm dia. typ. [0.018"] 2 1 9.49mm ±.38mm [0.373" ±0.015"] 5.25mm [0.207"] 3 5.99mm [0.236"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] End View Side View Compatible target board land pattern not to scale
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Original
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Sn96Ag4
SF-SO20C-J-01F
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PDF
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IS410
Abstract: IS410 brass IS410 IPC SF-SO16A-J-01F
Text: 10.16mm [0.400"] 7.26mm [0.286"] RoHS COMPLIANT 2.54mm [0.100"] Top View 1.27mm typ. [0.050"] 0.46mm dia. typ. [0.018"] 2 1 9.49mm [0.374"] 5.25mm [0.207"] 3 5.99mm [0.236"] 0.43mm typ. [0.017"] Side View End View Compatible Target Board Land Pattern A < 3.45mm
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Original
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IS410
Sn96Ag4
SF-SO16A-J-01F
IS410 brass
IS410 IPC
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PDF
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SF-SO28A-J-02F
Abstract: No abstract text available
Text: 19.05mm [0.750"] RoHS COMPLIANT 5.08mm [0.200"] 11.20mm [0.441"] 0.46mm dia. typ. [0.018"] 2 Top View 9.49mm [0.374"] 3 1 5.25mm [0.207"] 9.93mm [0.391"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] Side View Compatible target board land pattern not to scale
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Original
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FR4/G10
Sn96Ag4
SF-SO28A-J-02F
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PDF
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Sn96Ag4
Abstract: Sn96Ag4 solder SN-99
Text: September 20, 2006 SMD INDUCTOR DR365-2 SERIES Features z z z z z Low Profile Surface Mount Design Inductance Range from 3.3 µH to 47.0 µH Materials meet UL94V-0 Temperature Range -40°C to +85°C Tinned Leads with Leaded Solder is Available note 4 ELECTRICAL SPECIFICATION AT 25°C
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Original
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DR365-2
UL94V-0
100kHz,
DR365-2-332
DR365-2-472
DR365-2-682
DR365-2-103
DR365-2-153
DR365-2-223
DR365-2-333
Sn96Ag4
Sn96Ag4 solder
SN-99
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PDF
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Sn63pB37
Abstract: Sn62Pb36Ag2 Sn60Pb40 Sn96Ag4 Sn99Cu1 SN63-PB37 F60U15FP4 f63010fp3 F60007E23 F60U10D23
Text: Сравнительная таблица припоев RADIEL. Обозначение сплава Sn60Pb40 Состав сплава олово 59,5% - 60,5 %; свинец - остальное Температура оплавления, °C 183 - 188
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Sn60Pb40
Sn63Pb37
Sn62Pb36Ag2
Sn60Pb38Cu2
Sn96Ag4
Sn99Cu1)
F96AU10B13
F96AU07B13
F96AU05B13
R1632
Sn63pB37
Sn62Pb36Ag2
Sn60Pb40
Sn96Ag4
Sn99Cu1
SN63-PB37
F60U15FP4
f63010fp3
F60007E23
F60U10D23
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PDF
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RPIP-696-00
Abstract: No abstract text available
Text: CUSTOMER DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified fluoropolymer. 2. FERRULE: Copper alloy with electroless nickel plating conforming to SAE-AMS-C-26074 Class 3, Grade B. 3. SOLDERSHIELD DEVICE:
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Original
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SAE-AMS-C-26074
Sn96Ag4
HET-A-06C
-N/A-08-029380
RPIP-696-00
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PDF
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Sn96Ag4
Abstract: SN96 Sn96Ag4 solder SF-SO28A-J-03F
Text: RoHS COMPLIANT 17.78mm [0.700"] 6.35mm [0.250"] 11.20mm [0.441"] 1 Top View 0.46mm dia. typ. [0.018"] 2 9.49mm [0.374"] 5.25mm [0.207"] 3 1.27mm typ. [0.050"] Side View 9.93mm [0.391"] 3 0.43mm typ. [0.017"] End View Compatible target board land pattern not to scale
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Original
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Sn96Ag4
SF-SO28A-J-03F
SN96
Sn96Ag4 solder
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PDF
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Sn96Ag4 solder
Abstract: No abstract text available
Text: 25.40mm [1.000"] RoHS COMPLIANT 10.16mm [0.400"] 7.62mm [0.300"] 2.54mm typ. [0.100"] Top View 3 1 13.82mm ±.38mm assembled [0.544" ±0.015"] 2 9.98mm[0.393"] assembled 4 5.99mm [0.236"] 0.43mm typ. [0.017"] Side View 1.27mm typ. [0.050"] End View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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Original
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Sn96Ag4
PC-DIP/SOIC20-01F
Sn96Ag4 solder
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PDF
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Sn96Ag4 solder
Abstract: No abstract text available
Text: RoHS COMPLIANT 18.16mm [0.715"] 7.62mm [0.300"] 10.16mm [0.400"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, RoHS compliant plating. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . 3
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Original
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Sn96Ag4
PC-DIP/SOIC14-01F
SOIC14-01F
Sn96Ag4 solder
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PDF
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IS410 brass
Abstract: Sn96Ag4 solder IS410 SF-SO44A-J-01F
Text: 29.21mm [1.150"] 44 23 44 23 RoHS COMPLIANT 7.62mm [0.300"] 16.28mm [0.641"] Pin 1 22 22 Pin 1 0.46mm dia. typ. [0.018"] Top View 2 9.49mm [0.374"] 5.25mm [0.207"] 1 3 0.43mm typ. [0.017"] 15.01mm [0.591"] 1.27mm typ. [0.050"] End View Side View Compatible target board
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Original
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IS410
Sn96Ag4
SF-SO44A-J-01F
IS410 brass
Sn96Ag4 solder
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PDF
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Sn96Ag4 solder
Abstract: SN96AG4
Text: CUSTOMER DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. FERRULE: Copper alloy with a suitable plating see below for plating information . 3. SOLDERSHIELD DEVICE: - Heat-shrinkable insulation sleeve, transparent blue, radiation cross-linked modified polyvinylidene fluoride.
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Original
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Sn96Ag4
D030535
HET-A-04X
11-May-07
Sn96Ag4 solder
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PDF
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PL-PLCC32-S-02
Abstract: Sn96Ag4 solder PL-PLCC32-S-01F
Text: RoHS COMPLIANT 13.34mm [0.525"] Ø 3.18mm [Ø 0.125"] 8.23mm [0.324"] 1 14.88mm [0.586"] 0.050" typ. 15.88mm 12.12mm [0.625"] [0.477"] 0.61mm [0.024"] 12.34mm [0.486"] 11.07mm [0.436"] Recommended PCB layout J-lead SMT interface 2 5.25mm [0.207"] Plug interface
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Original
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Sn96Ag4
PL-PLCC32-S-02)
PL-PLCC32-S-01F
PL-PLCC032-S-01F
PL-PLCC32-S-02
Sn96Ag4 solder
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PDF
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Mini-Systems
Abstract: palladium resistor MSR10
Text: PRECISION THICK FILM RESISTOR CHIPS Cpp TOP TERM INATIONS FOR SOLDER OR CONDUCTIVE EPOXY WRAP AROUND TERM INATIONS FOR SOLDER OR CONDUCTIVE EPOXY MINI-SYSTEMS SERIES WA56 WA47 WA4 WA13 W A62 WA53 WA5 WA64 WA9 WA7 WA57 WA24 WA43 WA49 WA50 WA17 WA32 WA30 WA28
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OCR Scan
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100mW
400mW
300mW
750map
TWX/710-348-0564
FAX/508-695-6076
TMC/7/89/10M
Mini-Systems
palladium resistor
MSR10
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 /2 TECHNICAL DATA SHEET R401.410.102 SMT TERMINATION ALN Series : DC - 4.4GHZ 30-60W ( TRUE SURFACE MOUNT) TERMINATION SOLDERING PATTERN 6,35 dimensions are in mm. Issue : 0520 A In the effort to improve our products, we reserve the right to make changes judged to be
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OCR Scan
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0-60W
Sn96Ag4
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PDF
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