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    SHIPPING TRAY Search Results

    SHIPPING TRAY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    BQ21062YFPR Texas Instruments 500-mA 1-cell linear charger with 10-nA ship mode, power-path, regulated system voltage and LDO Visit Texas Instruments Buy
    BQ21061YFPT Texas Instruments 500-mA 1-cell linear charger with 10-nA ship mode, power-path, regulated system voltage and LDO Visit Texas Instruments
    BQ21061YFPR Texas Instruments 500-mA 1-cell linear charger with 10-nA ship mode, power-path, regulated system voltage and LDO Visit Texas Instruments Buy
    UE36C1620005011 Amphenol Communications Solutions 1x1 QSFP-DD cage with the clip ship loose, no heat sink Visit Amphenol Communications Solutions
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation

    SHIPPING TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    intel 04195

    Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
    Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel


    Original     		PDF paC/85 intel 04195 BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3

    Kostat tray

    Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
    Text: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by


    Original     		PDF 14x20mm 28x28mm 32x32mm ND-1420-2 ND-2828-3 ND-3232-3 KS-8202* KS-8201* Kostat tray Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201

    28 TSSOP JEDEC Thin Matrix Tray outlines

    Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		PDF 0637D 09/99/xM 28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x

    ATMEL 234

    Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		PDF 0637B 10/98/xM ATMEL 234 ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC

    Date Code wolfson

    Abstract: WM8725ED MH1082 WOLFSON date code Date Code format wolfson EH11 MH10 WOLFSON MICROELECTRONICS WM8199SCDS ti packing label
    Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications –


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    Ion Chromatography

    Abstract: No abstract text available
    Text: Application Report SZZA042 - November 2003 Use of Polystyrene for Bare-Die Carrier-Tape Shipping Applications Michael Hayden, Lee Lewis, and Lance Wright Standard Linear & Logic ABSTRACT The packing and shipping of bare-die product is relatively new, especially in the tape-and-reel


    Original     		PDF SZZA042 Ion Chromatography

    Date Code wolfson

    Abstract: MH1082 EH11 MH10 ti packing label INNER CARTON LABEL inner product
    Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications – differences may occur due to manufacturing route variations.


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    JEDEC Matrix Tray outlines

    Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF EIA-481-x, JEDEC Matrix Tray outlines ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label

    tsop tray matrix outline

    Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


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    bga 0,8 mm

    Abstract: tray matrix bga AN-1126 MO-151 fine BGA thermal profile an1126
    Text: National Semiconductor Application Note 1126 December 2000 CONTENTS Introduction Package Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations Solder Pad Geometry Escape Routing Guidlines Via Density Assembly Recommendations


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    Binning and Labeling

    Abstract: No abstract text available
    Text: SST-90 Binning and Labeling SST-90 LEDs Table of Contents Table of Products. . . . . . . . . . . 2 Shipping and Labeling Nomenclature . . . . . . . . . . . . . 3 Bin Kit Ordering Nomenclature . . . . . . . . . . . . . 4 White Flux Binning Structure . . . . . . . . . . . . . . . . . . 5


    Original     		PDF SST-90 PDS-001692 Binning and Labeling

    Untitled

    Abstract: No abstract text available
    Text: SST-90 Binning and Labeling SST-90 LEDs Table of Contents Table of Products . . . . . . . . . . .2 Shipping and Labeling Nomenclature . . . . . . . . . . . . .3 Bin Kit Ordering Nomenclature . . . . . . . . . . . . .4 White Flux Binning Structure . . . . . . . . . . . . . . . . . .5


    Original     		PDF SST-90 PDS-001692

    1GW NPN

    Abstract: SANMOTION R error code PB3A003R200 Sanyo Denki servo motor alarm code 41 SANMOTION ALARM CODE pb1d00 100m Sanyo Denki servo drive error codes sanyo denki stepping motor D866 Sanyo Denki encoder
    Text: M0007302 SANMOTION CLOSED LOOP STEPPING SYSTEM PB Type R（AC Power Input） PB3A003R200 <RS485 ＋PIO Interface> Instruction Manual E ENGLISH Preface ÌShipping the product This product in this instruction manual corresponds with the shipping regulations given in the


    Original     		PDF M0007302 PB3A003R200 RS485 D86609-Donauworth 1GW NPN SANMOTION R error code PB3A003R200 Sanyo Denki servo motor alarm code 41 SANMOTION ALARM CODE pb1d00 100m Sanyo Denki servo drive error codes sanyo denki stepping motor D866 Sanyo Denki encoder

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK

    Sanyo Denki servo motor alarm code 41

    Abstract: PB3A003P200 Sanyo Denki servo motor P5 series Sanyo Denki servo motor alarm code 85 SANMOTION R error code Sanyo Denki servo motor LVB V 2.22 SANMOTION ALARM CODE Sanyo Denki servo motor p series Sanyo Denki encoder
    Text: M0007234 SANMOTION CLOSED LOOP STEPPING SYSTEM PB Type P（AC Power Input） PB3A003P200 <Pulse Train Interface> Instruction Manual E ENGLISH Preface ÌShipping the product This product in this instruction manual corresponds with the shipping regulations given in the


    Original     		PDF M0007234 PB3A003P200 D86609-Donauworth Sanyo Denki servo motor alarm code 41 PB3A003P200 Sanyo Denki servo motor P5 series Sanyo Denki servo motor alarm code 85 SANMOTION R error code Sanyo Denki servo motor LVB V 2.22 SANMOTION ALARM CODE Sanyo Denki servo motor p series Sanyo Denki encoder

    QFN Shipping Trays

    Abstract: No abstract text available
    Text: Nomenclature Guide ZL Types ZL BBBBB P T S L F -CC ZL = ZILKER LABS DESIGNATOR CUSTOM CODE Any alphanumeric character BASE PART NUMBER 5 Character Max. ZL90XXM - Power Modules ZL91XXM - Power Modules ZLS4XXM - Module Component SHIPPING OPTION J: Trays T1 or TK: (Tape and Reel - 1000 piece)


    Original     		PDF ZL90XXM ZL91XXM 1-888-INTERSIL QFN Shipping Trays

    Shipping Trays

    Abstract: 7563 TRAY
    Text: CUSTOMER ADVISORY CHANGE IN TRAY TEMPERATURE TOLERANCE Altera will be switching to a lower temperature shipping tray. The new tray’s critical dimensions are identical to the existing trays. Altera has evaluated and approved the new trays for mechanical integrity by performing industry standard drop tests. The new trays


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    LMV240

    Abstract: national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A
    Text: Surface Mount - Tape & Reel General Description Tape-and-Reel is one of the primary methods for shipping surface mount devices. This system simplifies the handling of semiconductors for automated circuit board assembly systems. Tape-and-Reel holds hundreds-to-thousands of


    Original     		PDF EIA-481-1-A EIA-481-2-A CSP-9-111S2) CSP-9-111S2. LMV240 national semiconductor pb-free suffix DS90C2501SLB LM431ACM3X DSP-92 TS5B-24 LM3351MM LM3351MMX M08A M14A

    Untitled

    Abstract: No abstract text available
    Text: Leshan Radio Co.Ltd General Purpose Transistors PNP Silicon ƽ Pb-Free Package is available. LBC807-16WT1G DEVICE MARKING AND ORDERING INFORMATION Device Marking Package Shipping LBC807-16WT1G 5A Pb-Free SOT-323 3000/Tape&Reel LBC807-25WT1G 5B (Pb-Free)


    Original     		PDF LBC807-16WT1G OT-323 3000/Tape LBC807-25WT1G LBC807-40WT1G

    4x13

    Abstract: No abstract text available
    Text: DEVICE PACKING 1. SHIPPING CONTAINERS AND HANDLING 1.1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


    OCR Scan     		PDF J4444444444444444444444444444

    CP-52

    Abstract: No abstract text available
    Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain


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    FLC301XP

    Abstract: FLC301XP equivalent FLK052XP Fujitsu GaAs FET application note ISS1B1 CS98E1V6R800-K41D CS98E1V6R000-K41B fujitsu "application notes" FJS-DS-158 fll171
    Text: APPLICATION NOTES II. FET CHIPS A. REMOVAL OF GaAs FET AND HEMT CHIPS FROM SHIPPING CONTAINERS 1 REQUIREMENTS Anti-static work surface Grounding cable and wrist Metal tweezers or vacuum Clean container to receive Binocular microscope with strap probe transferred chips


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