BGA Solder Ball compressive force
Abstract: bga solder ball shear
Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA
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10067807-101LF
10076728-101LF
10067811-101LF
ELXAIRMXBGA0109ELT
BGA Solder Ball compressive force
bga solder ball shear
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pcr 406 f
Abstract: PCR 406 G
Text: 1 2 2 1.6 Copyright FCI. - The "LF" product meet european union Directives and other country regulations asdescibed in GS-22-008. - The housing will whistand exposure to 260º peak temperature for 30 seconds in a convection , infra-red or vapor reflow oven.
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GS-22-008.
I10-0197
C01-8646-0877
pcr 406 f
PCR 406 G
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GS12
Abstract: FCI tape card C0186
Text: 1 2 2.90 2.4 Copyright FCI. - The "LF" product meet european union Directives and other country regulations asdescibed in GS-22-008. - The housing will whistand exposure to 260º peak temperature for 30 seconds in a convection , infra-red or vapor reflow oven.
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GS-22-008.
I10-0197
C01-8646-0886
GS12
FCI tape card
C0186
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PDF
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Untitled
Abstract: No abstract text available
Text: INHALT PRODUCT PORTFOLIO SUMIDA FLEXIBLE CONNECTIONS GMBH FLEXIBLE FLAT CABLES FLEXIBLE BOARD CONNECTIONS FLEXIBLE MODULES THT – THROUGH HOLE TECHNOLOGY PANTA FFC PANTA FIX JUMPER PANTA MODULES SMT – SURFACE MOUNT TECHNOLOGY PANTA SMD PANTA FLL REFLOW
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D-01454
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7434L0425F01
Abstract: repco 7434L0422F01
Text: SmartCard Connectors L04 Series Low Profile SmartCard Connectors Features • Compliance on the electrical connection according to ISO 7816 • 30% GF UL-94V-0 high temperature • Thermoplastic material to withstand IR reflow Benefits • Low cost version.
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UL-94V-0
suitabl100
7434L0425F01
7434L0422F01
52436-25f
52436-22f
repco
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PDF
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DIN41652
Abstract: pcr 406 application note MIL-DTL-24308C
Text: 1 2 3 4 REQUIREMENTS 53.11 0.13 Technical characteristics: Shell:steel ZnCr3 plated Insulators:self-extinguishing thermoplastic,ULclass94V0 reflow process compatible A SCALE A Peak 260º C during 10 to 30s STD values Contacts size 20:phosphor bronze,0.76µgold on mating end,
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ULclass94V0
I10-0197
GS-14-920
C01-8646-0872
DIN41652
pcr 406 application note
MIL-DTL-24308C
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10064582-201LF
Abstract: No abstract text available
Text: 1 2 3 4 1. PCB Shielding Cover + Springs Performace level 2. 24 POS RA HDR to be wave soldered 10064582-101LF TELCORDIA CO. 10064582-201LF Customer Special A A 55 MIN. 3. PCB Contact Strip to be solderd by reflow B B Printed board 52 PRODUCT SPECIFICATION: GS-12-307
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10064582-101LF
10064582-201LF
GS-12-307
EUR-14-010
GS-20-049
94-V0
72800-211LF
10064582-201LF
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PDF
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ls07
Abstract: GS SH 2 12 D 10022805-201LF 72800-211LF
Text: 1 2 3 4 Performace level 1. PCB Shielding Cover A 10022805-101LF TELCORDIA CO. 10022805-201LF Customer Special A 2. 24 POS RA HDR to be wave soldered 55 MIN. 3. PCB Contact Strip to be solderd by reflow B B Printed board 52 PRODUCT SPECIFICATION: GS-12-307
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10022805-101LF
10022805-201LF
GS-12-307
EUR-14-010
GS-20-049
94-V0
72800-211LF
LS07-0195
N09-0394
LS07-0310
ls07
GS SH 2 12 D
72800-211LF
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 1. PCB SHIELDING COVER WITH SPRING 55 MIN. A A 2. 24 POS RA HDR TO BE WAVE SOLDERED 3. PCB CONTACT STRIP TO BE SOLDERED BY REFLOW SEE NOTE 3 B B 52 PRINTED BOARD PRODUCT SPECIFICATION: GS-12-307 PACKAGING SPECIFICATION: EUR-14-010 APPLICATION SPECIFICATION: GS-20-049
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GS-12-307
EUR-14-010
GS-20-049
94-V0
72850-211LF
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PDF
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pa 66 gf
Abstract: idc shrouded header LR46923 98464 TA-959 DPS-12-011 GS-12-415
Text: S TIME adtimes D LEA basicsle T OR .com/ H S .fci w ww W E N Product Catalog 2.00 mm SECTION www.fci.com/basics 1 MinitekTM UNSHROUDED VERTICAL HEADERS TECHNICAL DATA PHYSICAL Housing: High-temperature, black thermoplastic Flammability rating: UL 94 V-0 Pin: Phosphor-bronze
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Sofix
Abstract: Machine Vision Hardware pin in paste rectangular connector sofix connector
Text: COMMUNICATION, DATA AND CONSUMER DIVISION Pin-in-Paste Application Guide www.fciconnect.com CDC-PIPGUIDE-02/07-E FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI ia a leading manufacturer of connectors. Our 13.500 employees are committed to providing
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CDC-PIPGUIDE-02/07-E
Sofix
Machine Vision Hardware
pin in paste
rectangular connector
sofix connector
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PDF
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FCI Connector
Abstract: D-SUB 9 PIN MALE CONNECTOR erni D-SUB 9 PIN angle erni
Text: D-sub Pin-in-Paste Series D-sub Introduction FCI's D-SUBminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These D-SUBminiature connectors are one of the most popular Input - Output interconnects, adressing a wide variety of applications
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863005ATLF
863001TLF
863001060TLF
863001061TLF
FCI Connector
D-SUB 9 PIN MALE CONNECTOR erni
D-SUB 9 PIN angle erni
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PDF
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Soldering guidelines pin in paste
Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
Text: Products for solder-to-board applications MINITEK Headers for Pin-in-Paste Processes MINITEK™ Pin-in-Paste DESCRIPTION Minitek is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. The Minitek product range includes PCB Card Connectors,
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Original
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CDC-MINIPIP-02/07-E
Soldering guidelines pin in paste
TA-895
idc shrouded header
minitek
pin in paste
LR46923
right angle 5 pin pcb connector
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PDF
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toolings
Abstract: leaf spring design Double Row, 40 Positions, 2.54 mm 0.1 in., Right Angle Header TA-895 76347-403LF 7731-1 Series HT-0095 FCI 69168 semi catalog 47439-002
Text: S TIME adtimes D LEA basicsle T OR .com/ H S .fci w ww W E N Product Catalog www.fci.com/basics 1 FCI: SETTING THE STANDARD FOR CONNECTORS MO With operations in 30 countries and sales of 1.3 billion euros in 2007, FCI is a leading manufacturer of connectors.
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ELXBASICS0711EA4
toolings
leaf spring design
Double Row, 40 Positions, 2.54 mm 0.1 in., Right Angle Header
TA-895
76347-403LF
7731-1 Series
HT-0095
FCI 69168
semi catalog
47439-002
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Untitled
Abstract: No abstract text available
Text: PGA Sockets FCI basics 4 ^ Very low or ultra low insertion force, screw machine contacts Molded high temperature insulators are compatible with IR reflow assembly processes Technical Data Processing Information Physical Operating Temperature Range Insulator material: High temperature
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E113847
-168-H
-1706-R
-1709-R
-180-H
-1806-R
1-888-499-4FCI
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Untitled
Abstract: No abstract text available
Text: PLCC Sockets FCI basics4 • Conform to EIA JEDEC outlines for 1.27 mm .050" plastic leaded chip carriers ■ High temperature, IR reflow compatible plastic is STANDARD ■ Automation compatible • Center pad for pick and place • Tape-and-reel packaging
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OCR Scan
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1-888-499-4FCI
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PDF
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UEI 20 SP 010
Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION
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SAA7140A;
SAA7140B
SAA7140A)
SAA7140B)
711062b
UEI 20 SP 010
bord
SAA7140A
SAA7140B
FEY G4
LQFP128
VR029
SAA7196
t3044
UL705
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PDF
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Untitled
Abstract: No abstract text available
Text: MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS 105°C -i > t f — £ ' s Z m 105°C Ultra Low Impedance. FEATURES T 7 fci 7 7 7. ±teM£ j£o m • Extrem ely reduced im pedance at high frequency range. • U7 it /u P - If JfoJ f£ 0 Reflow soldering is available.
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100kHz)
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Untitled
Abstract: No abstract text available
Text: 0603 SMD TYPE LED o p to e le ctro n ic s VAOL-S6SB4 lightingrtheway Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • • • For higher packing density .
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Untitled
Abstract: No abstract text available
Text: CHIP PHOTO-TRANSISTOR CmSENSOR mum • Features 1. Developed as a chip type SMD photo-transistor for both right-angle and upright uses 2. Small and square size, dimensions : 3.2 L x 2.4(W)x2.4(H)mm 3. Automatic mounting by chip mounter avail able 4. Reflow soldering available
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CPT-181
950nmlR3tCttSSSHSH
CL-200IRt
CL-200IR
L-2001R
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PDF
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680 ohms resistor 5 watt
Abstract: 4300R 4306R-102-RC MIL-R-83401 resistor 56 ohm 8 watt 50Q2 resistor RC-9
Text: BOURNS I NC b3E D 1 5S L j S 7 3 GDGCH? IBOUR CHI THICK FILM MOLDED SIPs, LOW PROFILE 6, 8, 9, 10, AND 11 PIN • Low profile provides c o m p a tib ility w ith DIPs ■ C om patible w ith a utom atic insertion equipm ent ■ High tem perature lead atta chm en t to w ithstand reflow
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15SLjS73
4300R
100ppm/Â
250ppm/Â
680 ohms resistor 5 watt
4306R-102-RC
MIL-R-83401
resistor 56 ohm 8 watt
50Q2
resistor RC-9
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PDF
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reflow FCI
Abstract: No abstract text available
Text: STENCIL MATED CONNECTOR OUTLINE ONTO BOARD. POS. ct •ÿ * PCB PLUG ASSY P /N 7 4 2 1 3 8.0 - - ì s u « a ♦* g i 3 .4 REF SEE NOTE 3. I MATED HGT. AFTER REFLOW . sìa Im h “m h RECPT. ASSY. P /N 7 4 2 1 5 i. I li * * •“ Ift M - ‘Ï 3 0 .0 i J O
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Untitled
Abstract: No abstract text available
Text: High Density Receptacles 1.00 mm .039" FCI basics ^ Various header heights + standard receptacle = Choice of 4.15 mm, 4.50 mm, 5.00 mm, 5.50 mm, 6.00 mm, or 7.00 mm mated heights Blade-on-beam contacts are not susceptible to “peeling” damage Audible click during mating signals
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1-888-499-4FCI
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PDF
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Untitled
Abstract: No abstract text available
Text: High Density Headers 1.00 mm .039" FCI basics u Various header heights + standard • ■ ■ ■ receptacle = Choice of 4.15 mm, 4.50 mm, 5.00 mm, 5.50 mm, 6.00 mm, or 7.00 mm mated heights Blade-on-beam contacts are not susceptible to “peeling” damage
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1-888-499-4FCI
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PDF
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