BK-4

Abstract: qfp304 QFP304-P-4040-0
Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996

QFP304

Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 12.37 TYP. 2 版/96.11.28

4040

Abstract: QFP304 4040 datasheet QFP304-P-4040-0
Contextual Info: QFP304-P-4040-0.50-BK4 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

qfp144p

Abstract: 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80
Contextual Info: J2N0016-38-81 作成：1998年 8月 前回作成：1996年10月 パッケージ l n パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI／Oピン数等からお客様の 要求に合ったパッケージをお選びください。

2035 zilog

Abstract: zilog 2035 TC81221F set top box block diagram TX3904 QFP304 LSI ASIC MIPS R3000A toshiba semiconductor catalog TX39
Contextual Info: SYSTEM CATALOG FOR DIGITAL SET TOP BOXES Set Top Box Block Diagram Example of Digital Satellite Broadcast Set Top Box for Japanese Systems Tuner TD7627FN TA1248F F-Syn. I/Q Demo. Modem Codec TC90A48F TC90A32F QPSK System MPU TX39 Software Modem Video Encoder

PBGA352 35

Abstract: QFP44-P-910-0 QFP64-P-1414-0 QFP80-P-1420-0 SSOP32-P-430-1 mirror P-LFBGA224-1515-0 160-28X
Contextual Info: FJXLSC-PKG-04 作成：2000 年 9 月 前回作成：1998 年 8 月 パッケージ ● • パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI ／O ピン数等からお客様の御要求に合ったパ

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

425M

Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3

Contextual Info: G—QFP304—4040—0.50 Uniti nn 42, 6±0. 2 39, 2±0, 4 228 153 ?!?!?!?!?!?!?!?!?! !?!?!?!?!?!?!?!?!?!?!?!?!?!? 229 152 31013101310131013101310131013101310131

QSJ-50074

Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4

Contextual Info: HCT-900 HCT-900 Hand Held Convection Tool SMT Component Rework A Versatile Hot Air Tool for SMT Soldering and De-soldering The OK International HCT-900 Hand Held Convection Tool offers a low cost versatile rework solution for a wide variety of production and rework

IC 50061

Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing

QSJ52627

Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 7 章 包装 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 7 章部分とな ります。

R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

3360D

Abstract: 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP18 DIP20 DIP28 DIP32 SDIP30
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4

TSOP 173 g

Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
Contextual Info: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

sac 326

Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要

Contextual Info: G—QFP304—4040—0.50 Uniti nn Nov.2003

koki solder paste

Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY

QFP160-P-2828-0

Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE

oki qfp tray

Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40