A141
Abstract: A143 DPV3232V
Text: PV3232V 32K X 32 UVEPROM VERSAPAC Dense-Pac Microsystems. Inc. O DESCRIPTION: The D PV3232V is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V EPR O M devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal coefficients.
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OCR Scan
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DPV3232V
DPV3232V
66-pin
250ns
128KX8,
64KX16
32KX32
30A014-30
A141
A143
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12 SQ 045 JF
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM PV3232VA DESCRIPTION; The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPV3232VA
DPV3232VA
66-pin
250ns
128KX8,
64KX16
32KX32
E75R415
12 SQ 045 JF
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM PV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPV3232VA
DPV3232VA
66-pin
250ns
128KXS,
64KX16
32KX32
30A014-60
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM * r ~ T PV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The PV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPV3232VA
DPV3232VA
66-pin
120ns
150ns
170ns
200ns
250ns
DPV12832V
128KX8,
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