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    DPV3232VA Search Results

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    DPV3232VA Price and Stock

    Dense-Pac Microsystems DPV3232VA-70M

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPV3232VA-70M 16
    • 1 $574.4792
    • 10 $492.4107
    • 100 $492.4107
    • 1000 $492.4107
    • 10000 $492.4107
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    WSI DPV3232VA-55C

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components DPV3232VA-55C 1
    • 1 $12.2454
    • 10 $12.2454
    • 100 $12.2454
    • 1000 $12.2454
    • 10000 $12.2454
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    DPV3232VA Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA DPV3232VA 66-pin 32Kx32 250ns 128KX8, 64KX16 275R41S

    12 SQ 045 JF

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA DPV3232VA 66-pin 250ns 128KX8, 64KX16 32KX32 E75R415 12 SQ 045 JF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPV3232VA Dense-Pac Microsystems. Inc. 32K X 3 2 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA DPV3232VA 66-pin 250ns 128KXS, 64KX16 32KX32 30A014-60

    Untitled

    Abstract: No abstract text available
    Text: DPV3232VA Dense-Pac Microsystems. Inc. ^ 32K X 32 UVEPROM VERSAPAC DESCRIPTION: The D P V 3 2 3 2 V A is a 66-pin Pin Grid Array PG A consisting of four 32K X 8 U V E P R O M devices in ceramic L C C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA 66-pin 250ns I/O20

    Untitled

    Abstract: No abstract text available
    Text: □PM * r ~ T DPV3232VA Dense-Pac Microsystems. Inc. 32K X 32 UVEPROM VERSAPAC O DESCRIPTION: The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA DPV3232VA 66-pin 120ns 150ns 170ns 200ns 250ns DPV12832V 128KX8,

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV3232VA 66-pin 250ns 170ns 200ns 250ns 30A014-60

    48-PIN

    Abstract: No abstract text available
    Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead


    OCR Scan     		PDF PS128M PS3232V DPS128X16CJ3/BJ3 PS128X16CH DPS128X16Y3 PS128X16H PS128X24BH PS512S8BN PS512S8N 48-PIN