AN3687
Abstract: APP3687 MAX4299 MAX4410 MAX9750 MAX9760
Text: Maxim > App Notes > AMPLIFIER AND COMPARATOR CIRCUITS AUDIO CIRCUITS Keywords: Click-and-Pop, Click and Pop, Click, Pop, Pop Noise, Measurement, Quantify, Maxim Nov 29, 2005 APPLICATION NOTE 3687 Quantitative Analysis Yields Objective Measurement for Audio
|
Original
|
subject87
MAX4299:
MAX4410:
MAX9750:
MAX9760:
AN3687,
APP3687,
Appnote3687,
AN3687
APP3687
MAX4299
MAX4410
MAX9750
MAX9760
|
PDF
|
NS6040
Abstract: amkor DS814A pop sheet DS814 PoP PACKAGE TESTING contactor
Text: data sheet TEST CONTACTOR PoP Dual Sided Test Contactor Features: • • • • • Benefits: • Single socketing for testing both sides of package • Improved test coverage Stacked Package Amkor PoP Package on Package Dual Sided Test Contactor: Amkor Technology is now offering the PoP
|
Original
|
DS814A
NS6040
amkor
DS814A
pop sheet
DS814
PoP PACKAGE TESTING
contactor
|
PDF
|
MT29C2G24MAKLAJG-75 IT
Abstract: MT29C2G24MAKLAjg JW256
Text: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components
|
Original
|
168-Ball
MT29CxGxxMAxxxxx
09005aef83070ff3
168ball
MT29C2G24MAKLAJG-75 IT
MT29C2G24MAKLAjg
JW256
|
PDF
|
MT29F2G16AB
Abstract: MT29C2G24MAKLAJG-6 MT29C4G48 JW256 MT29C2G48MAKLCJI-6 mt29f4g16ab MT29F4G16A MT29F2G16ABDHC mt29c MT29F2G16ABDHC-ET
Text: Preliminary‡ 168-Ball NAND Flash and LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29CxGxxMAxxxxx Features Figure 1: PoP Block Diagram Micron NAND Flash and LPDRAM components
|
Original
|
168-Ball
MT29CxGxxMAxxxxx
09005aef83070ff3
168ball
MT29F2G16AB
MT29C2G24MAKLAJG-6
MT29C4G48
JW256
MT29C2G48MAKLCJI-6
mt29f4g16ab
MT29F4G16A
MT29F2G16ABDHC
mt29c
MT29F2G16ABDHC-ET
|
PDF
|
TU12
Abstract: No abstract text available
Text: POP-3 Device STM-1/STS-3/STS-3c SDH/SONET POH Terminator with Telecom Bus Interface TXC-06303 TECHNICAL OVERVIEW PRODUCT PREVIEW DESCRIPTION The TranSwitch POP-3 TXC-06303 is an STM-1/STS3/STS-3c path overhead processing device that provides a Telecom Bus interface for downstream devices. The POP-3
|
Original
|
TXC-06303
TXC-06303)
TXC-06303-MA
TU12
|
PDF
|
LA-1901
Abstract: EPCOS R800 rg82855 rg82855pm LR431 c2t225 dell 90W ac adapter schematic SN7002 ddq12 1203P1
Text: 5 4 3 2 1 D D LKB-ADDs, Plus Schematic REV : A02 C C @ 1@ 2@ 3@ 4@ : : : : : Depop Component for All Pop Component for Lindbergh Series Pop Component for Kapalua series Depop Component for Lindbergh Plus series Pop Component for Lindbergh Plus series B B DDQ12/LA1901 Schematic with Capture CIS and Function field
|
Original
|
DDQ12/LA1901
DDQ12/11/01
LA-1901
ADM1032
PL120
PL126
LA-1901
EPCOS R800
rg82855
rg82855pm
LR431
c2t225
dell 90W ac adapter schematic
SN7002
ddq12
1203P1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Smart in Technic and Detail Technical Data Sheet “smartflower POP“ As of: September 2014 Typing and printing errors reserved. Technical Data POWER OUTPUT Nominal output Output through 2-axle tracking POP 2,31 kWp 3.500 – 5.700 kWp* Installation
|
Original
|
ENEL2010,
C10/11,
G83/1,
AS4777,
CEI-021
AS3100
|
PDF
|
UPA Audio Analyzer
Abstract: transformer t0045 B0028 jensen audio transformer T0045-02 SLEA044 TAS5026 Jensen Transformers TAS5036 TAS5066
Text: Application Report SLEA044 – April 2005 Click and Pop Measurement Technique Tomas Soerensen . Digital Audio and Video Division ABSTRACT During various occasions a digital amplifier can generate a click or a pop. The click is
|
Original
|
SLEA044
UPA Audio Analyzer
transformer t0045
B0028
jensen audio transformer
T0045-02
SLEA044
TAS5026
Jensen Transformers
TAS5036
TAS5066
|
PDF
|
JEDEC Jc-11 free
Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new
|
Original
|
wirebon00
JEDEC Jc-11 free
PSVFBGA
FCCSP
0.3mm pitch csp package
Amkor Technology
amkor flip
Amkor CSP mold compound
Amkor Wafer level mold compound
0.65mm pitch BGA
mold cap
|
PDF
|
ISD4000
Abstract: chipcorder
Text: Application Information for ChipCorder Products APPLICATIONS BRIEF 39A — RECORDED POP ELIMINATION IN THE ISD4000 SERIES Some customers have experienced a problem with a “pop” sound recorded into the memory of the ISD4000 ChipCORDER series. The pop occurs
|
Original
|
ISD4000
chipcorder
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DRV602 www.ti.com SLOS572D – DECEMBER 2008 – REVISED OCTOBER 2010 DirectPath , Pop-Free 3Vrms Line Driver with Adjustable Gain Check for Samples: DRV602 FEATURES 1 • DirectPath™ – Eliminates Pop/Clicks – Eliminates Output DC-Blocking Capacitors
|
Original
|
DRV602
SLOS572D
20kHz
DRV602
|
PDF
|
APP4449
Abstract: Datasheet 4449 MAX9890 analog switch pop and click 4449
Text: Maxim > App Notes > Audio Circuits Keywords: click-and-pop, MAX9890, MAX9892 Jun 30, 2009 APPLICATION NOTE 4449 How to Pick a Click-and-Pop Suppressor Abstract: This application note presents the MAX9890 and MAX9892 which use different approaches to remove
|
Original
|
MAX9890,
MAX9892
MAX9890
MAX9892
MAX9892,
com/an4449
MAX9890:
MAX9892:
APP4449
Datasheet 4449
analog switch pop and click
4449
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DRV602 www.ti.com SLOS572D – DECEMBER 2008 – REVISED OCTOBER 2010 DirectPath , Pop-Free 3Vrms Line Driver with Adjustable Gain Check for Samples: DRV602 FEATURES 1 • DirectPath™ – Eliminates Pop/Clicks – Eliminates Output DC-Blocking Capacitors
|
Original
|
DRV602
SLOS572D
20kHz
DRV60
|
PDF
|
JEDEC Jc-11 free
Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw
|
Original
|
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: EVALUATION KIT AVAILABLE MAX9890 Audio Click-Pop Suppressor General Description The MAX9890 provides click-and-pop suppression for devices such as CODECs with integrated headphone amplifiers that lack a clickless/popless startup/powerup or shutdown/power-down. The device controls the
|
Original
|
MAX9890
MAX9890
MAX9890A
200ms
MAX9890B
330ms
|
PDF
|
DRV602EVM
Abstract: DRV602PW IEC6100-4-2 DVR602
Text: DRV602 www.ti.com SLOS572D – DECEMBER 2008 – REVISED OCTOBER 2010 DirectPath , Pop-Free 3Vrms Line Driver with Adjustable Gain Check for Samples: DRV602 FEATURES 1 • DirectPath™ – Eliminates Pop/Clicks – Eliminates Output DC-Blocking Capacitors
|
Original
|
DRV602
SLOS572D
20kHz
DRV602
DRV602EVM
DRV602PW
IEC6100-4-2
DVR602
|
PDF
|
DRV602EVM
Abstract: DRV602PW IEC6100-4-2 DVR602
Text: DRV602 www.ti.com SLOS572D – DECEMBER 2008 – REVISED OCTOBER 2010 DirectPath , Pop-Free 3Vrms Line Driver with Adjustable Gain Check for Samples: DRV602 FEATURES 1 • DirectPath™ – Eliminates Pop/Clicks – Eliminates Output DC-Blocking Capacitors
|
Original
|
DRV602
SLOS572D
20kHz
DRV602
DRV602EVM
DRV602PW
IEC6100-4-2
DVR602
|
PDF
|
S72WS512PFFJF9GH
Abstract: BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information
|
Original
|
S72WS-P
S72WS512PFFJF9GH
BGA 15X15
BGA 130 MCP NAND DDR
12X12 POP PACKAGE
TRAY 15x15
bta 137
S72WS512PFFKFKGH
N-ADQ14
NAND01
|
PDF
|
smd marking K23
Abstract: lpddr SMD transistor MARKING CODE g23 marking k22 SMD 168-ball LPDDR sac105 LPDDR Pop smd transistor ab2 MT46H64M32 SMD transistor k23
Text: Preliminary‡ 168-Ball x16, x32 Mobile LPDDR PoP TI OMAP Mobile DDR SDRAM Addendum Mobile LPDDR 168-Ball Package-on-Package (PoP) TI OMAP MT46HxxxMxxLxJG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS)
|
Original
|
168-Ball
MT46HxxxMxxLxJG
09005aef833508fb/Source:
09005aef83350d72
smd marking K23
lpddr
SMD transistor MARKING CODE g23
marking k22 SMD
168-ball LPDDR
sac105
LPDDR Pop
smd transistor ab2
MT46H64M32
SMD transistor k23
|
PDF
|
Untitled
Abstract: No abstract text available
Text: EVALUATION KIT AVAILABLE MAX9890 Audio Click-Pop Suppressor General Description The MAX9890 provides click-and-pop suppression for devices such as CODECs with integrated headphone amplifiers that lack a clickless/popless startup/powerup or shutdown/power-down. The device controls the
|
Original
|
MAX9890
MAX9890
MAX9890A
200ms
MAX9890B
330ms
|
PDF
|
BGA 130 MCP NAND DDR
Abstract: JEP95 137-Ball DSA00272754 Flash MCp nand DRAM 137-ball S72WS512PEF N-ADQ12 130 MCP NAND DDR NAND FLASH BGA Flash MCp nand DRAM 107-ball
Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information
|
Original
|
S72WS-P
BGA 130 MCP NAND DDR
JEP95
137-Ball
DSA00272754
Flash MCp nand DRAM 137-ball
S72WS512PEF
N-ADQ12
130 MCP NAND DDR
NAND FLASH BGA
Flash MCp nand DRAM 107-ball
|
PDF
|
Untitled
Abstract: No abstract text available
Text: EVALUATION KIT AVAILABLE MAX9890 Audio Click-Pop Suppressor General Description The MAX9890 provides click-and-pop suppression for devices such as CODECs with integrated headphone amplifiers that lack a clickless/popless startup/powerup or shutdown/power-down. The device controls the
|
Original
|
MAX9890
MAX9890
MAX9890A
200ms
MAX9890B
330ms
|
PDF
|
S30MS-P
Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
Text: S75WS-P based MCP/POP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash NOR Interface S30MS-P (NAND Interface) ORNAND Flash pSRAM Type 2 S75WS-P based MCP/POP Products Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion
|
Original
|
S75WS-P
S30MS-P
S30MS-P
AMB128
S29WS-P
S75WS256PEFJF5
S75WS256PEFKFF
UtRAM Density
Spansion NAND Flash DIE
MS512P
|
PDF
|
MT29F4G08ABA
Abstract: MT29F4G08A MT29F8G08A MT29F4G08AB MT29F4G08ABAD MT29C MT29F16G08A Micron MT29F8G08
Text: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,
|
Original
|
168-Ball
MT29C4G48MAYBAAKQ-5
MT29C4G48MAZBAAKQ-5
MT29C4G96MAYBACJG-5
MT29C4G96MAZBACJG-5
MT29C8G96MAYBADJV-5
MT29C8G96MAZBADJV-5
MT29F4G08ABA
MT29F4G08A
MT29F8G08A
MT29F4G08AB
MT29F4G08ABAD
MT29C
MT29F16G08A
Micron MT29F8G08
|
PDF
|
