Untitled
Abstract: No abstract text available
Text: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G
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MS512PYA
MS800-2
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TRAY FBGA 11X13
Abstract: S72MS512PE0HF94V MCP NAND sDR S72MS-P BGA 15X15 137-Ball MCP NAND DDR S30MS-P Spansion NAND Flash Spansion NAND Flash DIE
Text: S72MS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 Data Sheet Advance Information S72MS-P based MCP/PoP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S72MS-P
TRAY FBGA 11X13
S72MS512PE0HF94V
MCP NAND sDR
BGA 15X15
137-Ball
MCP NAND DDR
S30MS-P
Spansion NAND Flash
Spansion NAND Flash DIE
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S30MS-P
Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
Text: S75WS-P based MCP/POP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash NOR Interface S30MS-P (NAND Interface) ORNAND Flash pSRAM Type 2 S75WS-P based MCP/POP Products Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion
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S75WS-P
S30MS-P
S30MS-P
AMB128
S29WS-P
S75WS256PEFJF5
S75WS256PEFKFF
UtRAM Density
Spansion NAND Flash DIE
MS512P
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Untitled
Abstract: No abstract text available
Text: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board
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MS512PJB
MS587-1â
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Untitled
Abstract: No abstract text available
Text: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board
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Original
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PDF
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MS512PJB
MS587-1â
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Untitled
Abstract: No abstract text available
Text: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G
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Original
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PDF
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MS512PYA
MS800-3â
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N1056
Abstract: 2g nand mcp bsc nm 1st year S30MS-P 3g hsdpa signal Schematic Diagram S30MS01GP spansion ms nand flash format h.264
Text: S30MS-P ORNANDTM Flash Family S30MS01GP, MS512P 1 Gb/512 Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBit Technology Data Sheet Preliminary S30MS-P ORNANDTM Flash Family Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S30MS-P
S30MS01GP,
S30MS512P
Gb/512
x8/x16,
N1056
2g nand mcp
bsc nm 1st year
3g hsdpa signal Schematic Diagram
S30MS01GP
spansion ms nand flash
format h.264
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137-Ball
Abstract: S30MS-P N1056 MS512P
Text: S30MS-P ORNANDTMFlash Family S30MS01GP, MS512P 1Gb/512Mb, x8/x16, 1.8 Volt NAND Interface Memory Based on MirrorBit Technology S30MS-P ORNANDTMFlash Family Cover Sheet Data Sheet Preliminary Notice to Readers: This document states the current technical specifications regarding the Spansion
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PDF
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S30MS-P
S30MS01GP,
S30MS512P
1Gb/512Mb,
x8/x16,
137-Ball
N1056
MS512P
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Untitled
Abstract: No abstract text available
Text: 6030 POWER INDUCTORS High Reliability Power Inductors MS512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Tin-lead Sn-Pb termination for the best possible board adhesion ■ Passes vibration testing to 80 G and shock testing to 1000 G
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Original
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PDF
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MS512PYA
MS800-3â
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S72WS512PFFJF9GH
Abstract: BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information
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S72WS-P
S72WS512PFFJF9GH
BGA 15X15
BGA 130 MCP NAND DDR
12X12 POP PACKAGE
TRAY 15x15
bta 137
S72WS512PFFKFKGH
N-ADQ14
NAND01
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BGA 130 MCP NAND DDR
Abstract: JEP95 137-Ball DSA00272754 Flash MCp nand DRAM 137-ball S72WS512PEF N-ADQ12 130 MCP NAND DDR NAND FLASH BGA Flash MCp nand DRAM 107-ball
Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information
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S72WS-P
BGA 130 MCP NAND DDR
JEP95
137-Ball
DSA00272754
Flash MCp nand DRAM 137-ball
S72WS512PEF
N-ADQ12
130 MCP NAND DDR
NAND FLASH BGA
Flash MCp nand DRAM 107-ball
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Untitled
Abstract: No abstract text available
Text: 6235 POWER INDUCTORS High-Reliability Power Inductors MS512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Special construction allows it to pass vibration testing to 80 G and shock testing to 1000 G. ■ Tin-lead Sn-Pb termination for the best possible board
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InductorsMS512PJB
MS587-2
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