JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
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PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
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JEDEC TRAY PLCC
Abstract: PLCC JEDEC tray PLCC 84 tray Carbon PPO
Text: UNIT : mm A' 30.94 30.61 37.01 74.02 135.9 A 30.61 27.95 37.01 259.07 315 322.6 84 LEAD PLCC <SECTION A - A'> 30.61 7.77 7.79 12.19 25.78 Applied Package 84-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C
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84-pin
UNT-AMC-002
JEDEC TRAY PLCC
PLCC JEDEC tray
PLCC 84
tray Carbon PPO
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PLCC JEDEC tray
Abstract: JEDEC TRAY PLCC 7402 tray Carbon PPO plcc 68
Text: UNIT : mm A' 30.94 30.10 37.01 74.02 135.9 A 30.10 27.95 37.01 259.07 315 322.6 68 LEAD PLCC <SECTION A - A'> 30.10 7.77 5.25 12.19 20.57 Applied Package 68-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C
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68-pin
UNT-AMC-002
PLCC JEDEC tray
JEDEC TRAY PLCC
7402
tray Carbon PPO
plcc 68
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Untitled
Abstract: No abstract text available
Text: www.we-online.com PLCC Socket WR-PLCC 10 09/08 10-1 www.we-online.com PLCC Socket WR-PLCC In the past IC socket were normally mounted on a PCB but upgrade and replacements were not so easy to make, that’s why PLCC socket became so popular. PLCC sockets are soldered to the plated through holes or to the SMT layout on a PCB,
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UL94-V0
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JEDEC Matrix Tray outlines
Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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EIA-481-x,
JEDEC Matrix Tray outlines
ATMEL EIA-481-x Packing
JEDEC tray standard for PLCC
ATMEL Packing Methods and Quantities
EIA-481-x
JEDEC TRAY PLCC
ATMEL Tape and Reel
tsop Shipping Trays
JEDEC tray standard 13
ATMEL shipping label
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tsop tray matrix outline
Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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CT2102
Abstract: CT2101 CT-2101 MIL-STD-810C method 513.2 m431
Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead
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M43X-XX-XX
MIL-P-81728,
MIL-C-14550
MIL-G-45204,
CT2102
CT2101
CT-2101
MIL-STD-810C method 513.2
m431
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footprint plcc 32
Abstract: No abstract text available
Text: Issue 5.0 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined
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PUMA68
PUMA68FV16006X
512Kx32
120ns
2Mx32
120ns.
200pcs
183OC
225OC
footprint plcc 32
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Untitled
Abstract: No abstract text available
Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade
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PUMA68FV16006X
PUMA68
512Kx32
120ns
2Mx32
JED-STD-020.
200pcs
183OC
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CT2102
Abstract: No abstract text available
Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead
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M43X-XX-XX
MIL-P-81728,
MIL-C-14550
MIL-G-45204,
CT2102
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JED-STD-020
Abstract: No abstract text available
Text: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined
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PUMA68F32006X
PUMA68
1Mx32
150ns
JED-STD-020.
200pcs
183OC
225OC
JED-STD-020
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Untitled
Abstract: No abstract text available
Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined
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PUMA68
PUMA68FV32006X
1Mx32
150ns
150ns.
3-STD-020.
200pcs
183OC
225OC
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Untitled
Abstract: No abstract text available
Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade
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PUMA68
PUMA68FV4006X
128Kx32
120ns
2Mx32
PUMA68
7STD-020.
200pcs
183OC
225OC
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J-STD-001B
Abstract: D1225
Text: TRAILING EDGE PRODUCT - MINIMUM ORDER APPLIES Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and
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PUMA68
PUMA68F4006X
128Kx32
120ns
2Mx32
PUMA68
upgra-STD-020.
200pcs
183OC
225OC
J-STD-001B
D1225
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125OC
Abstract: No abstract text available
Text: Issue 5.1 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined
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PUMA68
PUMA68F16006X
512Kx32
120ns
2Mx32
120ns.
200pcs
183OC
225OC
125OC
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Untitled
Abstract: No abstract text available
Text: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined
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PUMA68F16006X
PUMA68
512Kx32
120ns
2Mx32
JED-STD-020.
200pcs
183OC
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Untitled
Abstract: No abstract text available
Text: PLCC SOCKETS ADAM TECH PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE ADAM TECHNOLOGIES INC. PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards In registration M 0-047, AA through AH. They convert the .050" chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design
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0DDD127
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Untitled
Abstract: No abstract text available
Text: ADAM TECH ADAM TECHNOLOGIES INC. PLCC SOCKETS PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards in registration MO-047, AA through AH. They convert the .050“ chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design
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MO-047,
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Untitled
Abstract: No abstract text available
Text: PLCC 1.27mm SMT Sockets IC160 Series ORDERING INFORMATION P/N: IC160-0*4-*0* * Blank: Tray I 1: Tape & Reel 2: Tube 1: With Locator Pin _ 0: Without Locator Pin 1. 2: SMT Terminals See "Contact Area" Drawing Below Pin Count CHARACTERISTICS Insulation Resistance
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IC160
IC160-0*
500MQ
UL94V-0
019ixt0
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