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    PLCC JEDEC TRAY Search Results

    PLCC JEDEC TRAY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0 Visit Texas Instruments Buy

    PLCC JEDEC TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    JEDEC TRAY PLCC

    Abstract: PLCC JEDEC tray PLCC 84 tray Carbon PPO
    Text: UNIT : mm A' 30.94 30.61 37.01 74.02 135.9 A 30.61 27.95 37.01 259.07 315 322.6 84 LEAD PLCC <SECTION A - A'> 30.61 7.77 7.79 12.19 25.78 Applied Package 84-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C


    Original     		PDF 84-pin UNT-AMC-002 JEDEC TRAY PLCC PLCC JEDEC tray PLCC 84 tray Carbon PPO

    PLCC JEDEC tray

    Abstract: JEDEC TRAY PLCC 7402 tray Carbon PPO plcc 68
    Text: UNIT : mm A' 30.94 30.10 37.01 74.02 135.9 A 30.10 27.95 37.01 259.07 315 322.6 68 LEAD PLCC <SECTION A - A'> 30.10 7.77 5.25 12.19 20.57 Applied Package 68-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C


    Original     		PDF 68-pin UNT-AMC-002 PLCC JEDEC tray JEDEC TRAY PLCC 7402 tray Carbon PPO plcc 68

    Untitled

    Abstract: No abstract text available
    Text: www.we-online.com PLCC Socket WR-PLCC 10 09/08 10-1 www.we-online.com PLCC Socket WR-PLCC In the past IC socket were normally mounted on a PCB but upgrade and replacements were not so easy to make, that’s why PLCC socket became so popular. PLCC sockets are soldered to the plated through holes or to the SMT layout on a PCB,


    Original     		PDF UL94-V0

    JEDEC Matrix Tray outlines

    Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF EIA-481-x, JEDEC Matrix Tray outlines ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label

    tsop tray matrix outline

    Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF

    CT2102

    Abstract: CT2101 CT-2101 MIL-STD-810C method 513.2 m431
    Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead


    Original     		PDF M43X-XX-XX MIL-P-81728, MIL-C-14550 MIL-G-45204, CT2102 CT2101 CT-2101 MIL-STD-810C method 513.2 m431

    footprint plcc 32

    Abstract: No abstract text available
    Text: Issue 5.0 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined


    Original     		PDF PUMA68 PUMA68FV16006X 512Kx32 120ns 2Mx32 120ns. 200pcs 183OC 225OC footprint plcc 32

    Untitled

    Abstract: No abstract text available
    Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade


    Original     		PDF PUMA68FV16006X PUMA68 512Kx32 120ns 2Mx32 JED-STD-020. 200pcs 183OC

    CT2102

    Abstract: No abstract text available
    Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead


    Original     		PDF M43X-XX-XX MIL-P-81728, MIL-C-14550 MIL-G-45204, CT2102

    JED-STD-020

    Abstract: No abstract text available
    Text: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined


    Original     		PDF PUMA68F32006X PUMA68 1Mx32 150ns JED-STD-020. 200pcs 183OC 225OC JED-STD-020

    Untitled

    Abstract: No abstract text available
    Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined


    Original     		PDF PUMA68 PUMA68FV32006X 1Mx32 150ns 150ns. 3-STD-020. 200pcs 183OC 225OC

    Untitled

    Abstract: No abstract text available
    Text: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade


    Original     		PDF PUMA68 PUMA68FV4006X 128Kx32 120ns 2Mx32 PUMA68 7STD-020. 200pcs 183OC 225OC

    J-STD-001B

    Abstract: D1225
    Text: TRAILING EDGE PRODUCT - MINIMUM ORDER APPLIES Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and


    Original     		PDF PUMA68 PUMA68F4006X 128Kx32 120ns 2Mx32 PUMA68 upgra-STD-020. 200pcs 183OC 225OC J-STD-001B D1225

    125OC

    Abstract: No abstract text available
    Text: Issue 5.1 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined


    Original     		PDF PUMA68 PUMA68F16006X 512Kx32 120ns 2Mx32 120ns. 200pcs 183OC 225OC 125OC

    Untitled

    Abstract: No abstract text available
    Text: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined


    Original     		PDF PUMA68F16006X PUMA68 512Kx32 120ns 2Mx32 JED-STD-020. 200pcs 183OC

    Untitled

    Abstract: No abstract text available
    Text: PLCC SOCKETS ADAM TECH PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE ADAM TECHNOLOGIES INC. PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards In registration M 0-047, AA through AH. They convert the .050" chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design


    OCR Scan     		PDF 0DDD127

    Untitled

    Abstract: No abstract text available
    Text: ADAM TECH ADAM TECHNOLOGIES INC. PLCC SOCKETS PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards in registration MO-047, AA through AH. They convert the .050“ chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design


    OCR Scan     		PDF MO-047,

    Untitled

    Abstract: No abstract text available
    Text: PLCC 1.27mm SMT Sockets IC160 Series ORDERING INFORMATION P/N: IC160-0*4-*0* * Blank: Tray I 1: Tape & Reel 2: Tube 1: With Locator Pin _ 0: Without Locator Pin 1. 2: SMT Terminals See "Contact Area" Drawing Below Pin Count CHARACTERISTICS Insulation Resistance


    OCR Scan     		PDF IC160 IC160-0* 500MQ UL94V-0 019ixt0