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    CT2102 Price and Stock

    Samtec Inc PCT2-102-03-L-D-02

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    Samtec Inc PCT2-102-03-L-D-03

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    Master Electronics PCT2-102-03-L-D-03
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    Samtec Inc PCT2-102-03-F-D-04

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    DigiKey PCT2-102-03-F-D-04 Bulk 1
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    Master Electronics PCT2-102-03-F-D-04
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    Samtec Inc PCT2-102-03-L-D-04

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    DigiKey PCT2-102-03-L-D-04 Bulk 1
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    Mouser Electronics PCT2-102-03-L-D-04
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    Master Electronics PCT2-102-03-L-D-04
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    Sager PCT2-102-03-L-D-04 1
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    Samtec Inc PCT2-102-03-L-D-03-RA

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    DigiKey PCT2-102-03-L-D-03-RA Bulk 1
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    Master Electronics PCT2-102-03-L-D-03-RA
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    Find more CT2102 price and stock on Findchips.com

    CT2102 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CT2102

    Abstract: CT2101 CT-2101 MIL-STD-810C method 513.2 m431
    Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead


    Original     		PDF M43X-XX-XX MIL-P-81728, MIL-C-14550 MIL-G-45204, CT2102 CT2101 CT-2101 MIL-STD-810C method 513.2 m431

    CT-2101

    Abstract: CT2102 MIL-STD-810C Method 514.2 ct2101 MIL-STD-810C PLCC 44 socket layout plcc-68-at MO-052 ME-PLCC-44-AT
    Text: Through Board Chip Carrier Socket Specifications Materials Contact Material: Phosphor Bronze Contact Plating: Tin/Lead over Nickel Insulator Material: PBT Operating Temperature: -65°C to +105°C Electrical Performance Contact Resistance: 20 milliohms maximum


    Original     		PDF MO-052 213-020-60X 213-028-60X 213-128-60X 213-032-60X 213-044-60X 213-052-60X 213-068-60X 213-084-60X CT-2101 CT2102 MIL-STD-810C Method 514.2 ct2101 MIL-STD-810C PLCC 44 socket layout plcc-68-at ME-PLCC-44-AT

    CT2102

    Abstract: No abstract text available
    Text: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead


    Original     		PDF M43X-XX-XX MIL-P-81728, MIL-C-14550 MIL-G-45204, CT2102

    Untitled

    Abstract: No abstract text available
    Text: Low P rofile/S urface M ount C hip C arrier S ocket patented Features Methode has designed this PLCC socket to take full advantage of surface mount technology. The exclusive visible internal solder tails along with the use of quality high temperature materials assure compatibility with all


    OCR Scan     		PDF 213-0XX-601 213-0XX-602 213-128-60X)

    CT2102

    Abstract: No abstract text available
    Text: Low Profile/Surface Mount Chip Carrier Socket patented Features Materials Contact Material: Beryllium Copper Contact Plating: Tin/Lead over Nickel Insulator Material: Polyphenylene Sulfide, UL 94V-0 Operating Temperature: -50°C to +125°C


    OCR Scan     		PDF MIL-STD-1344, MIL-STD-810C, 104megohms CT2102