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    PLASTICS CARD MATERIAL Search Results

    PLASTICS CARD MATERIAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    IN80C188-12 Rochester Electronics LLC Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    N80C188-25 Rochester Electronics LLC Microprocessor, 16-Bit, 25MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    P8085AH-1 Rochester Electronics LLC Microprocessor, 8-Bit, 6MHz, NMOS, PDIP40, PLASTIC, DIP-40 Visit Rochester Electronics LLC Buy
    TCM3105NL Rochester Electronics LLC Modem, PDIP16, 0.300 INCH, PLASTIC, DIP-16 Visit Rochester Electronics LLC Buy
    EP610SC-20 Rochester Electronics LLC OT PLD, 22ns, CMOS, PDSO24, PLASTIC, SO-24 Visit Rochester Electronics LLC Buy

    PLASTICS CARD MATERIAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CAD-0601-262

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601262 CAD-0601-262 amphenol sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06WM242

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601242 amphenol sim block

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601282 amphenol sim block SIM BLOCK

    sim block

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601222 sim block amphenol sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06WS322

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06WM312

    CAD-0601-302

    Abstract: CAD0601302 amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601302 CAD-0601-302 amphenol sim block

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601402 amphenol sim block

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601382 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601342 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601322 amphenol sim block sim block

    SIM BLOCK amphenol

    Abstract: amphenol sim block SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601362 SIM BLOCK amphenol amphenol sim block SIM BLOCK

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06W7262

    CAD06W1292

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06W1292

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06L1272

    CAD06W2272

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 micron matte tin at solder tail, 1.27-2.54 micronnickel under plated.


    Original     		PDF UL94V0, CAD06W2272

    corrugated carton

    Abstract: corrugated SHEET carton box 0805-T
    Text: Formosa MS Case No. 0805 Device Case No. 0805 Order code 0805-T 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 0.3 8 5.6 0.1 2.75 3.5 Dimensions 0.22 0.1 1.1 4.0 0.1 0.1 Material : Plastics Standard capacity : 3,000pcs / reel Quantity 13 o 0.5 12 0.5 Dimensions


    Original     		PDF 0805-T 000pcs corrugated carton corrugated SHEET carton box 0805-T

    corrugated carton

    Abstract: corrugated
    Text: Formosa MS Case No. SMA Device SMA Case No. SMA-W SMA-T 0.1 1.5 2 2 0.1 4.0 1.75 Index hole 4.85 5.5 Dimensions 0.23 0.1 Taping 12 9.5 0.1 0.3 Order code 2.0 4.0 0.1 0.1 Material : Plastics Standard capacity : 5,000pcs / reel 13 o 0.5 12 0.5 75 2 Standard capacity : 2,000pcs / reel


    Original     		PDF 000pcs corrugated carton corrugated

    MELF

    Abstract: MELF dimensions melf diode MELF Package plastics material datasheet PLASTICS CARD MATERIAL
    Text: Formosa MS Case No. MELF Device Case No. MELF Order code MELF 0.1 2 2 0.1 1.5 1.75 4.0 Index hole Taping 12 9.5 0.1 0.3 4.85 5.5 Dimensions 0.2 0.1 2.7 4.0 0.1 0.1 Material : Plastics Quantity 12 13 o 2 0.5 Dimensions 330 80 2 0.5 Standard capacity : 5,000pcs / reel


    Original     		PDF 000pcs MELF MELF dimensions melf diode MELF Package plastics material datasheet PLASTICS CARD MATERIAL

    Untitled

    Abstract: No abstract text available
    Text: • E A ’ -y ?3 Ü 4 - - X < 7 X T - ’ -y ? C ase No. E-pack S tic k Packag e ^ - X No. Case No. E -j V E-pack type it f ê u - K Order code 4 10 1 rSA^hy/TR ubber end cap ■JXT'f 7 ? Ui *JpD = Dimensions D e vice Stick 6.0 3.0 0.6 "3 31 t i ft Material


    OCR Scan     		PDF 80pcs/each 100pcs/each 60pcs/each 000pcs/carton

    Untitled

    Abstract: No abstract text available
    Text: tam m m y — Standard Package for Automated Assembly Tape and Reeled Package E /\°'y 7,0 91^4 7. Case No. E-pack Device V R33 ¿250) / U - ; u R33 (¿330) Reel size ¿250(EIAJ R 33)/R eel size ¿330(EIAJ R33) ^ - X No. Case No. E '* 'y 7 E-pack type Ü 3 - K


    OCR Scan     		PDF 16mmfë 500pcs/reel 000pcs/reel 100pcs/each 50pcs/each 000pcs/carton

    shindengen m

    Abstract: N39N ba41-01 shindengen 2f 45 2SB 407
    Text: « m 15. 1— m ta m m m b f ^ •y Stan d ard Pa ck a g e fo r A u to m ated A sse m b ly Tape and Reeled Package A xial Taping Radial Taping 64 SHINDENGEN S tR R H M FS t ' r - Z i D T - ’s H X ' -;UR15 t 178) /') -;UR25( f 330) Reel size i 178{EIAJ R15) /Reel size i 330(E1AJ R25)


    OCR Scan     		PDF 500pcs STO-220 shindengen m N39N ba41-01 shindengen 2f 45 2SB 407

    JIS C 0806-1

    Abstract: No abstract text available
    Text: mmmm Standard Package for Automated Assembly 'J - l R33 ¿250) / ' J - J l r R33 (¿330) Case No. E-pack Device Reel size ¿250 (El A J R 3 3 )/R e e l size ¿330 (El A J R33) y - X No. C ase No. E '* 7 9 E-pack type ft« 3 - K O rd e r code 4 0 7 1 4 0 6 1


    OCR Scan     		PDF 000pcs/reel 50pcs/each 000pcs/carton JIS C 0806-1