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    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.


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    PDF UL94V0, CAD06WS322

    Untitled

    Abstract: No abstract text available
    Text: Jz_ T h is d o c u m e n t is the p ro p e rty o f A m p h e n o l C o rp o ra tio n a n d is d e liv e re d on ih e e x p r e s s c o n d itio n ihai It Is no t 1o be d is c lo s e d , re p ro d u c e d o r u s e d , in w h o le o r in p a r t, fo r m a n u fa c t u r e o r s a le by a n y o n e o th e r th a n A m p h e n o l


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    PDF HK3606 CAD-06WS-302 CAD-06WS--XX2 -06WS-XX2