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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.	Original	PDF	UL94V0, CAD06WM312

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Copper Alloy Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,gold flash at solder tail and 1.27-2.54 micronnickel under plated.

Original

PDF

UL94V0, CAD06WM312