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    PG68 Search Results

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    PG68 Price and Stock

    Panasonic Electronic Components 16SVPG680M

    CAP ALUM POLY 680UF 20% 16V SMD
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    DigiKey 16SVPG680M Reel 400 400
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    16SVPG680M Cut Tape 364 1
    • 1 $3.33
    • 10 $2.556
    • 100 $1.9466
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    16SVPG680M Digi-Reel 1
    • 1 $3.33
    • 10 $2.556
    • 100 $1.9466
    • 1000 $1.9466
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    Mouser Electronics 16SVPG680M 1,855
    • 1 $3.3
    • 10 $2.54
    • 100 $1.79
    • 1000 $1.4
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    TTI 16SVPG680M Reel 400
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    Master Electronics 16SVPG680M
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    Panasonic Electronic Components ELL-6PG680M

    FIXED IND 68UH 500MA 700MOHM SMD
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    DigiKey ELL-6PG680M Reel
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    Bristol Electronics ELL-6PG680M 100 8
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    ELL-6PG680M 1,704
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    VENKEL LTD NTC04024PG683HT

    NTC Chip Thermsistor;0402;4P;�2% Beta;68K;�3%
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    Venkel Ltd. NTC04024PG683HT Reel 15 Weeks 10,000
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    VENKEL LTD NTC04024PG683JT

    NTC Chip Thermsistor;0402;4P;�2% Beta;68K;�5%
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    Venkel Ltd. NTC04024PG683JT Reel 15 Weeks 10,000
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    VENKEL LTD NTC06034PG683JT

    NTC Chip Thermsistor;0603;4P;�2% Beta;68K;�5%
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    Venkel Ltd. NTC06034PG683JT Reel 15 Weeks 4,000
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    PG68 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PG68

    Abstract: No abstract text available
    Text: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic PGA Packages - PG68, PG84 10-36 November 13, 1997 (Version 1.2)


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    PG68

    Abstract: PK022
    Text: R Ceramic PGA PG68, PG84 Package PK022 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    PDF PK022 PG68 PK022

    PG68

    Abstract: No abstract text available
    Text: R Ceramic PGA PG68, PG84 Packages PK022 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    PDF PK022 PG68

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XC4010-5PG191M

    Abstract: XC4005-5PG156M PA44-48U adapter datasheet pa44-48u SDP72 xilinx 1736a 5962-9230503MXC XC4010-5CB196B SDP-UNIV-44 XC4010-5CB196M
    Text: XCELL THE QUARTERLY Issue 19 Fourth Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: 100,000+ Gates . 2 Guest Editorial . 3


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    SDP-UNIV-44

    Abstract: sdp72 PA44-48U adapter datasheet XC6200 ALL-07 guide pa44-48u allpro 88 PLCC44 pinout design book Micromaster
    Text: XCELL THE QUARTERLY Issue 18 Third Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PCI Compliance . 2 Guest Editorial: Chuck Fox on Developing New PLD Solutions . 3


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    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


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    PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    XC5200

    Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF XC5200 16-Bit 24-Bit 16-to-1 XC5210-5 XC5210-3 XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100

    LM7805

    Abstract: elna 50v, 1uF LM7805 voltage regulator d 1879 TRANSISTOR BCP56 PTFA181001GL ELNA capacitor 100 uf 50v
    Text: Preliminary PTFA181001GL PTFA181001HL Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FETs 100 W, 1805 – 1880 MHz Description The PTFA181001GL and PTFA181001GL are 100-watt LDMOS FETs designed for EDGE and WCDMA power amplifier applications in the


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    PDF PTFA181001GL PTFA181001HL PTFA181001GL 100-watt LM7805 elna 50v, 1uF LM7805 voltage regulator d 1879 TRANSISTOR BCP56 ELNA capacitor 100 uf 50v

    TPS5117

    Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
    Text: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation


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    PDF BCM5761E BCM5756M ISL6260 EMC4002 SLG8LP554Vscription PC100706) PR8140 PC9410 PR81411 TPS5117 SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell

    SN0608098-GP

    Abstract: BQ24745RHDR-GP lcd 15.4 inverter EPSON C691 MAIN AMD RS780 tps51125 MEC5035 foxconn TPS51117PWR-GP BCM5761
    Text: 5 4 3 2 1 FOOSE UMA Schematics Document AMD 15.4" D D AMD Giffin CPU S1G2 AMD RS780 +SB700 C C 2008-01-04 REV : SB B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM <Variant Name> A A Wistron Corporation


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    PDF RS780 SB700 BCM5761E BCM5756M ICS9LPRS474AKLFT 4X801 07237-SB BQ24745RHDR-GP SN0608098-GP BQ24745RHDR-GP lcd 15.4 inverter EPSON C691 MAIN AMD RS780 tps51125 MEC5035 foxconn TPS51117PWR-GP BCM5761

    PG560

    Abstract: No abstract text available
    Text: PG SERIES The PG series fixed, chip inductor provides a rectangular shape which is easily handled by automatic equipment for assembly into thick or thin film circuitry. An edge plating is provided for forming a solder fillet. The special metallization on the contact


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    PDF MIL-C-83446/14. PG560

    CC44

    Abstract: packages
    Text: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8


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    PDF CB164 XC3000) CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG680 CC44 packages

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


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    PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package

    40605

    Abstract: 40605-004 1224
    Text: Section 1_68: Miscellaneous Screws Combination Pan Head, Pilot Point, Mounting Screws The #12-24 Combination Pan Head, Pilot Point Mounting Screws attach equipment to racks and cabinets. A cutting notch in the thread removes paint in threaded holes to improve


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    PDF com/catalog/section1/pg68 40605 40605-004 1224

    OSC52

    Abstract: XC3000 XC3100A XC4000A XC4000E XC4025 XC5200 vq100 xilinx xc3000 xact reference guide
    Text: book : cover 1 Wed Jul 3 10:08:16 1996 R Release Document XACTstep Version 5.2/6.0 Synopsys October 1995 Read This Before Installation book : cover 2 Wed Jul 3 10:08:16 1996 Synopsys Xilinx Development System book : online i Wed Jul 3 10:08:16 1996 Installing Online Documentation


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    XC3030A

    Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF PQ100 TQ100 VQ100 CB100 PG120 PP132 PG132 TQ144 PG144 PG156 XC3030A XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


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    PDF TQ144 PG144 PG156 PQ160 CQ164 CB164 PP175 PG175 TQ176 PG184 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    XC2064

    Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
    Text: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP


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    PDF XC2064 XC2018 XC2064L XC2018L XC4002A XC4003A XC4004A XC4005A XC4003H XC4005H XC2064 XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204

    hp laptop inverter board schematic

    Abstract: XC5000 Smart Tuner nu-horizons LEAP-U1 echo delay reverb ic xilinx 1736a ALPS tv tuner hp laptop battery pinout schematic diagram of laptop inverter working of ic 7493
    Text: XCELL Issue 20 First Quarter 1996 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PLDs, Pins, PCBs . 2 Guest Editorial . 3


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    XC2064

    Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
    Text: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓


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    PDF XC2064 XC2O10 XC2064L XC2O10L XC3020 XC3030 XC3042 XC3064 XC3090 XC3020A XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008

    RUB25

    Abstract: IDT7133SA7LA
    Text: INTEGRATED 3ÛE DEVICE D • 4Û25771 DGQbbS7 1 ■ IDT PRELIMINARY IDT7133SA7LA IDT7143SA/LA CMOS DUAL-PORT RAMS 3 2 K 2 Kx 16-BIT Integrated Device Technology, Inc. RAMs. The IDT7133 is designed to be used as a stand-alone 16-bit dual-port RAM or as a "MASTER" dual-port RAM


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    PDF 16-BIT) IDT7133SA7LA IDT7143SA/LA 35/45/55/70ns 25/35/45/55/70/ns IDT7133/43SA IDT7133/43LA 500mW IDT7133 IDT7143 RUB25

    kb3940

    Abstract: XC2064-70PC44C
    Text: £X1L1N X XC2000 Logic Cell Array Families Product Description Features • Fully Field-Programmable: - I/O functions - Digital logic functions - Interconnections • General-purpose array architecture • Complete user control of design cycle • Compatible arrays with logic cell complexity equiva­


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    PDF XC2000 XC2064 XC2064L XC2018 XC2018L XC2000L TQ100 VQ100 XC2064 kb3940 XC2064-70PC44C

    j001 1003

    Abstract: 74LS00 TTL Signetics 2650 VCU 2136 j001 1003 ic signetics hand book signetics 2650 8k ram ic j001 1003 strz 2026 pss 3056
    Text: > l b l IC I I V » 2650 flllCROPROCEftOR CONTENTS I IN T R O D U C T IO N IN T R O D U C IN G T H E 26 50 F A M I L Y . 3 F E A T U R E S OF T H E 26 50 F A M IL Y 4 4 Microprocessor F e a tu re s .


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