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    PBGA 288 Search Results

    PBGA 288 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    89KTP0504P-BGA Renesas Electronics Corporation Evaluation Board for 89HP0504P BGA Repeater, 16-lane, 5Gbps, PCIe2 Visit Renesas Electronics Corporation
    IWR2243APBGABLR Texas Instruments 76-GHz to 81-GHz industrial high-performance MMIC 161-FCCSP -40 to 105 Visit Texas Instruments
    IWR2243APBGABL Texas Instruments 76-GHz to 81-GHz industrial high-performance MMIC 161-FCCSP -40 to 105 Visit Texas Instruments
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    PBGA 288 Price and Stock

    Hirose Electric Co Ltd IT8D-288P-BGA-0H

    Board to Board & Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IT8D-288P-BGA-0H
    • 1 $47.89
    • 10 $43.95
    • 100 $40.85
    • 1000 $38.59
    • 10000 $38.59
    		Get Quote

    Hirose Electric Co Ltd IT8M-288P-BGA-1H

    Board to Board & Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IT8M-288P-BGA-1H
    • 1 $47.89
    • 10 $43.95
    • 100 $40.85
    • 1000 $38.59
    • 10000 $38.59
    		Get Quote

    Hirose Electric Co Ltd IT8D-288P-BGA-1H

    Board to Board & Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IT8D-288P-BGA-1H
    • 1 $47.89
    • 10 $43.95
    • 100 $40.85
    • 1000 $38.59
    • 10000 $38.59
    		Get Quote

    Hirose Electric Co Ltd IT8M-288P-BGA-0H

    Board to Board & Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IT8M-288P-BGA-0H
    • 1 $47.89
    • 10 $43.95
    • 100 $40.85
    • 1000 $38.59
    • 10000 $38.59
    		Get Quote

    PBGA 288 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


    Original     		PDF

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


    Original     		PDF

    WEDPS512K32V-XBX

    Abstract: Theta JB bga thermal resistance max2014
    Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16 WEDPS512K32V-XBX Theta JB bga thermal resistance max2014

    WEDPS512K32V-XBX

    Abstract: No abstract text available
    Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16 WEDPS512K32V-XBX

    HALL SENSOR SS 94 A2

    Abstract: hvr 1X 3 diode 4 pin hall sensor hvr 1X 7 diode h2f regulator HALL SS 94 A2 diode hvr 1x hall effect sensor 720 HIGH-VOLTAGE HALF BRIDGE DRIVER MC33980
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document from Analog Marketing: MC33980/D Rev 0, 10/2002 SEMICONDUCTOR TECHNICAL DATA Market Assessment Freescale Semiconductor, Inc. Multipurpose Mechatronics PBGA Substrate Module for Intelligent LIN Distributed Systems


    Original     		PDF MC33980/D HC08d HALL SENSOR SS 94 A2 hvr 1X 3 diode 4 pin hall sensor hvr 1X 7 diode h2f regulator HALL SS 94 A2 diode hvr 1x hall effect sensor 720 HIGH-VOLTAGE HALF BRIDGE DRIVER MC33980

    RadTol Eclipse FPGA

    Abstract: f1 j39 CERAMIC QUAD FLATPACK CQFP F1 J37 transistor f1 j39 UT6325 J42-J45 ioa18 j78 transistor IOG10
    Text: Standard Products UT8RHEEB-288PC RadTol Eclipse FPGA UT6325 Evaluation Board Advanced Data Sheet September 2008 www.aeroflex.com/FPGA INTRODUCTION FEATURES ‰ User configurable evaluation board for the UT6325 RadTol Eclipse FPGA ‰ Available with both 280-plastic ball grid array PBGA and


    Original     		PDF UT8RHEEB-288PC UT6325 280-plastic 288-ceramic 10K-ohm 10K-ohm RadTol Eclipse FPGA f1 j39 CERAMIC QUAD FLATPACK CQFP F1 J37 transistor f1 j39 J42-J45 ioa18 j78 transistor IOG10

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm2 512Kx32; 1Mx16

    Untitled

    Abstract: No abstract text available
    Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Low Power Data Retention 'L' Option Access Times of 12, 15, 17, 20ns TTL Compatible Inputs and Outputs Packaging Fully Static Operation: 2 • 143 PBGA, 16mm x 18mm, 288mm


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16

    Untitled

    Abstract: No abstract text available
    Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging 2 • No clock or refresh required. • 143 PBGA, 16mm x 18mm, 288mm


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16 512Kx32

    AN1232

    Abstract: QFP PACKAGE thermal resistance micromechanical
    Text: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)


    Original     		PDF AN1232/D AN1232 AN1232/D* AN1232 QFP PACKAGE thermal resistance micromechanical

    WEDPS512K32V-XBX

    Abstract: No abstract text available
    Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging • 143 PBGA, 16mm x 18mm, 288mm 2 • No clock or refresh required.


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16 512Kx32 WEDPS512K32V-XBX

    transistor nec 8772

    Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005


    Original     		PDF AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912

    Untitled

    Abstract: No abstract text available
    Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE ADVANCED* FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging • 143 PBGA, 16mm x 18mm, 288mm 2 • No clock or refresh required.


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16 512Kx32

    p 602

    Abstract: WEDPS512K32-XBX bga thermal resistance
    Text: White Electronic Designs WEDPS512K32-XBX 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 12, 15, 17, 20, ns Packaging TTL Compatible Inputs and Outputs • 16mm x 18mm, 143 PBGA 5V Power Supply


    Original     		PDF WEDPS512K32-XBX 512Kx32 512Kx32, 1Mx16 25-55ns p 602 WEDPS512K32-XBX bga thermal resistance

    D 602

    Abstract: WEDPS512K32V-XBX
    Text: WEDPS512K32V-XBX White Electronic Designs 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES n Low Power CMOS n Access Times of 12, 15, 17, 20ns n TTL Compatible Inputs and Outputs n Fully Static Operation: n Packaging • 143 PBGA, 16mm x 18mm, 288mm 2 • No clock or refresh required.


    Original     		PDF WEDPS512K32V-XBX 512Kx32 288mm 512Kx32; 1Mx16 2K32V-XBX D 602 WEDPS512K32V-XBX

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M72K-XPBX W3J512M72K-XLBX 1600Mb/s W3J512M72K-XLBX

    Untitled

    Abstract: No abstract text available
    Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M72G-XPBX W3J512M72G-XLBX 1600Mb/s W3J512M72G-XLBX

    w3j128m72

    Abstract: w3j512m72
    Text: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included


    Original     		PDF W3J512M72G-XPBX W3J512M72G-XLBX 1600Mb/s w3j128m72 w3j512m72

    W78M32V-XBX

    Abstract: No abstract text available
    Text: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing


    Original     		PDF W78M32V-XBX 8Mx32 120ns 13x22mm W78M32V-XBX

    UT6325

    Abstract: 484-CLGA CL484 CQFP 208 datasheet PBGA 484P UT-SG-CQ208 CQ208 QT-SG-PS484
    Text: RadHard Eclipse Devices UT6325-W* 208-PQFP 9 N/A UT8RHEEB-208PC UT8RHE-SKT208P N/A N/A QT-SG-PQ208 9 UT6325-X* 208-CQFP 9 9 UT8RHEEB-208PC UT8RHE-SKT208C UT8RHE-SKT208P with proper land pads 9 UT-SG-CQ208 9 UT6325-P* 280-PBGA 9 N/A UT8RHEEB-288PC UT8RHE-SKT280P


    Original     		PDF UT6325-W* 208-PQFP UT8RHEEB-208PC UT8RHE-SKT208P UT8RHE-SKT208C UT8RHEEB-288PC UT8RHE-SKT280P UT6325 484-CLGA CL484 CQFP 208 datasheet PBGA 484P UT-SG-CQ208 CQ208 QT-SG-PS484

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W78M64V-XSBX ADVANCED 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing


    Original     		PDF W78M64V-XSBX 8Mx64 120ns 13x22mm

    W78M64V-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W78M64V-XSBX 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing


    Original     		PDF W78M64V-XSBX 8Mx64 120ns 13x22mm W78M64V-XSBX