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    PASSIVE HEATSINK FCBGA Search Results

    PASSIVE HEATSINK FCBGA Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    NFM15PC755R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFM15PC435R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    NFMJMPC226R0G3D Murata Manufacturing Co Ltd Data Line Filter, Visit Murata Manufacturing Co Ltd
    NFM15PC915R0G3D Murata Manufacturing Co Ltd Feed Through Capacitor, Visit Murata Manufacturing Co Ltd
    GCM033C70J104KE02J Murata Manufacturing Co Ltd 0201 (0603M) X7S (EIA) 6.3Vdc 0.1μF±10% Visit Murata Manufacturing Co Ltd
    GRT155R61A106ME13J Murata Manufacturing Co Ltd 0402 (1005M) X5R (EIA) 10Vdc 10μF±20% Visit Murata Manufacturing Co Ltd

    PASSIVE HEATSINK FCBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CP307-V

    Abstract: CP307V 945GM SCH3112I-NU DVI-D connector CompactPCI Express specification 4558 L ddr2 8gb mobile memory crt connection ICH7R
    Text: » CP307-V « 3U Intel Celeron® M Value Line CPU » Performance / Cost optimized Intel® Celeron® M processor 1.86 GHz 440 » Industry tailored Passive heatsink, robust formfactor » Comprehensive I/O capabilities GigEthernet, USB, VGA, DVI, SATA, CompactFlash.


    Original     		PDF CP307-V -703PC» CP307-V. CP307-V 945GM CP307V SCH3112I-NU DVI-D connector CompactPCI Express specification 4558 L ddr2 8gb mobile memory crt connection ICH7R

    FCBGA 956 pin

    Abstract: heatsink ECC-00178-01-GP ECC-00177-01-GP Instrumentation Amplifier IC with tl084 C1100 G751 PCM45F mobile processors 956-ball
    Text: Intel Core 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 Order Number: 320028-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND


    Original     		PDF 45-nm FCBGA 956 pin heatsink ECC-00178-01-GP ECC-00177-01-GP Instrumentation Amplifier IC with tl084 C1100 G751 PCM45F mobile processors 956-ball

    EP80579

    Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
    Text: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile


    Original     		PDF EP805799 L5408, EP80579 loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard

    intel MOTHERBOARD pcb design in

    Abstract: L7500 Intel Centrino Duo Mobile "September 2007" T7500 C1100 ECC-00177-01-GP PCM45F T7400 intel mechanical drawings intel MOTHERBOARD pcb design
    Text: Intel Core 2 Duo processor on 65 nm process for Embedded Applications Thermal Design Guide August 2007 Order Number: 315345-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED


    Original     		PDF 315345-003US intel MOTHERBOARD pcb design in L7500 Intel Centrino Duo Mobile "September 2007" T7500 C1100 ECC-00177-01-GP PCM45F T7400 intel mechanical drawings intel MOTHERBOARD pcb design

    intel mch 945gc

    Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
    Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR


    Original     		PDF E20724-001 E40825-001 945GC E37585-001 intel mch 945gc bga dye pry UL1439 PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet

    Loctite 7452

    Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


    Original     		PDF 631xESB/632xESB Loctite 7452 PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001

    honeywell pcm45

    Abstract: mpga479 pcm45 ECC-00177-01-GP L2400 PCM45F T2500 INTEL embedded processors Core 2 duo socket 478 motherboard manual cpu socket mPGA479m
    Text: Intel CoreTM Duo processor on 65 nm process for Embedded Applications Thermal Design Guide February 2006 Order Number: 311161-001 February 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF

    Intel A80856 Socket 478 Cooling Fan

    Abstract: a80856-002 intel a80856 a57855-001 Nidec A80856 a38001-003 a57855 Nidec a38001-003 a80856 a38001
    Text: Intel Pentium® 4 Processor and Intel® Celeron® Processor in the 478-Pin Package Thermal Design Guide for Embedded Applications January 2004 Order Number: 273704-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF 478-Pin 886-2-29952666ext. Intel A80856 Socket 478 Cooling Fan a80856-002 intel a80856 a57855-001 Nidec A80856 a38001-003 a57855 Nidec a38001-003 a80856 a38001

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		PDF AN-659-1 FC-BGA T0812012 daewon tray

    82801BA

    Abstract: 82801DB ATA-33 E7205 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
    Text: R Intel E7205 Chipset Thermal Design Guide Intel® E7205 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 251940-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF E7205 82801BA 82801DB ATA-33 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel

    Loctite 7452

    Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
    Text: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		PDF 315344-001US Loctite 7452 TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor

    hall 503

    Abstract: AH 503 hall 82801CA 82870P2 ATA-33 E7500 P64H2 T-710 foxconn motherboard
    Text: R Intel E7500 Chipset Design Guide E7500 Memory Controller Hub MCH Thermal and Mechanical Design Guidelines February 2002 Document Number: 298647-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF E7500 hall 503 AH 503 hall 82801CA 82870P2 ATA-33 P64H2 T-710 foxconn motherboard

    thermal test vehicle -intel

    Abstract: PCM45F honeywell thermocouple
    Text: Intel 3100 Chipset Thermal Design Guide November 2008 Order Number: 313457-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


    Original     		PDF 313457-004US thermal test vehicle -intel PCM45F honeywell thermocouple

    Intel reflow soldering profile BGA

    Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710
    Text: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original     		PDF

    Chomerics T710

    Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 Chomerics T710 PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2

    intel 945 ich7 family motherboard

    Abstract: ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance
    Text: Mobile Intel 945GME Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide June 2007 308623-002 Mobile Intel® 945GME Express Chipset GMCH Thermal Design Guide ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 945GME intel 945 ich7 family motherboard ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance

    P64H2

    Abstract: flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934
    Text: R Intel E7500/E7501/E7505 Chipset Thermal Design Guide For the Intel® E7500/E7501/E7505 Chipset Memory Controller Hub MCH December 2002 Document Number: 298647-003 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF E7500/E7501/E7505 E7500/E7501/E7505 P64H2 flotherm 82801CA 82801DB E7500 E7501 E7505 251929 1156 pin FCBGA 251934

    intel 82801DB

    Abstract: 82801CA 82801DB 82870P2 ATA-33 E7500 E7505 P64H2 chipset reflow profile Chomerics T710
    Text: R Intel E7500/E7505 Chipset Thermal Design Guide Intel® E7500/E7505 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 298647-002 R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF E7500/E7505 E7500 intel 82801DB 82801CA 82801DB 82870P2 ATA-33 E7505 P64H2 chipset reflow profile Chomerics T710

    PCM45

    Abstract: INTEL 5520 honeywell 95C TCONTROL PCM45F honeywell pcm45 foxconn motherboard la 7630
    Text: Intel 5520 and Intel® 5500 Chipsets Thermal/Mechanical Design Guidelines November 2009 Document Number: 321330, Revision: -003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS


    Original     		PDF

    82915g motherboard

    Abstract: Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6
    Text: R Intel 915G/915GV/915GL/910GL Express Chipset Thermal Design Guide For the Intel® 82915G/82915GV/82915GL, 82910GL Graphics and Memory Controller Hub GMCH February 2005 Document Number: 301469-006 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,


    Original     		PDF 915G/915GV/915GL/910GL 82915G/82915GV/82915GL, 82910GL 915G/915GV/910GL 82915g motherboard Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6

    845GL

    Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
    Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF 845G/845GL/845GV 82845G/82845GL/82845GV Pkg760 845GL 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard

    intel 845

    Abstract: MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide January 2002 Document Number: 298586-002 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 intel 845 MOTHERBOARD INTEL 845 INTEL 845 sdr 82801BA ATA-33 T-710 intel pin grid array package intel 82845 foxconn motherboard

    Thermagon T-MATE2905

    Abstract: mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard
    Text: R Intel 82854 Graphics Memory Controller Hub GMCH for Fanless Set Top Box Applications Thermal Design Guide March 2005 Revision 1.0 Reference Number: D14844-001 Legal Statements INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO


    Original     		PDF D14844-001 335C866801A 51-SA AF-S-10H-07B ECB-002272 ECB-00228 ECB-00229 Thermagon T-MATE2905 mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard

    865GV

    Abstract: 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset
    Text: R Intel 865G/865GV/865PE/865P Chipset Thermal Design Guide For the Intel 82865G/82865GV Graphics and Memory Controller Hub GMCH and Intel 82865PE/82865P Memory Controller Hub (MCH) September 2003 Document Number: 252519-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


    Original     		PDF 865G/865GV/865PE/865P 82865G/82865GV 82865PE/82865P 865G/865GV/865PE/865P 865GV 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset