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    EP80579

    Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
    Text: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile


    Original     		EP805799 L5408, EP80579 loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard PDF