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    PAL22VP10 Search Results

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    PAL22VP10 Price and Stock

    Rochester Electronics LLC TIBPAL22VP10-20CFN

    OT PLD, 20NS, PAL-TYPE, TTL,
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    DigiKey TIBPAL22VP10-20CFN Bulk 108
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    Cypress Semiconductor PAL22VP10G-5JC

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    Bristol Electronics PAL22VP10G-5JC 1,373 1
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    Quest Components PAL22VP10G-5JC 1,098
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    Texas Instruments TIBPAL22VP10-20CNT

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    NexGen Digital TIBPAL22VP10-20CNT 1,005
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    Component Electronics, Inc TIBPAL22VP10-20CNT 17
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    Texas Instruments TIBPAL22VP10-20CFN

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    Bristol Electronics TIBPAL22VP10-20CFN 38
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    Rochester Electronics TIBPAL22VP10-20CFN 1,849 1
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    Cypress Semiconductor PAL22VP10CF-10PC

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    Component Electronics, Inc PAL22VP10CF-10PC 33
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    PAL22VP10 Datasheets (32)

    Part ECAD Model Manufacturer Description Curated Type PDF
    PAL22VP10C-10DC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-10JC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-10PC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-10YC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-12DC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-12JC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-12PC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-6JC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-7DC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-7JC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-7PC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10C-7YC Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-10DMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-10KMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-10LMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-10YMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-12DMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-12KMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-12LMB Cypress Semiconductor Universal PAL Device Scan PDF
    PAL22VP10CM-12YMB Cypress Semiconductor Universal PAL Device Scan PDF

    PAL22VP10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sumitomo 131 datasheet

    Abstract: HTSSL sumitomo epoxy EME-6300H
    Text: Qualification Report Augusst, 1994 QTP# 94073 & 94232 Version 1.0 BiCMOS PLD Marketing Part # Description PAL22V10G Universal PAL Device PAL22VP10G Universal PAL® Device PLD20G10G Generic 24-Pin PAL® PAL is registered trademark of Monolithic Memories Inc.


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    PDF PAL22V10G PAL22VP10G PLD20G10G 24-Pin JEDEC22, --40C sumitomo 131 datasheet HTSSL sumitomo epoxy EME-6300H

    Device-List

    Abstract: cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2
    Text: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which


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    PDF ALL-11 Z86E73 Z86E83 Z89371 ADP-Z89371/-PL Z8E000 ADP-Z8E001 Z8E001 Device-List cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2

    cy7c9101

    Abstract: CY2901 CY7C190 PLD20RA10 CY2149 CY7C122 CY7C148 CY7C149 CY7C150 22V10-Macrocell
    Text: Military Product Selector Guide Static RAMs Size Organization 64 64 1K 1K 4K 4K 4K 4K 4K 8K 8K 16K 16K 16K 16K 16K 16K 16K 16K 16K 32K 32K 32K 32K 32K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 256K 256K 256K 256K 256K 256K 256K 1M 1M


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    PDF MILSTD883D 22pin 24pin 28pin 32pin 300mil cy7c9101 CY2901 CY7C190 PLD20RA10 CY2149 CY7C122 CY7C148 CY7C149 CY7C150 22V10-Macrocell

    Device-List

    Abstract: NEC D2716D novatek nt68f63 nt68f63 NEC D2732D D2716D 16V8H-25 ATMEL 220 24C16 D2732D 16V8H-15
    Text: LabTool-48 Version 4.67 <ALL> Device List Page 1 of 20 ACTRANS AC29LV400B *44PS AC29LV400B *48TS AC29LV400T *44PS AC29LV400T *48TS ALi M6759 M6759 *44 M6759 *44Q M8720 Alliance AS29F040 AS29LV800T *48TS AS29LV800B *44PS AS29LV800B *48TS AS29LV800T *44PS Altera


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    PDF LabTool-48 AC29LV400B AC29LV400T M6759 M8720 AS29F040 Device-List NEC D2716D novatek nt68f63 nt68f63 NEC D2732D D2716D 16V8H-25 ATMEL 220 24C16 D2732D 16V8H-15

    CY27S03A

    Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
    Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability


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    PDF CY7C122 CY27S03A 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide

    NEC D2732D

    Abstract: nt68f63 novatek nt68f63 d2716d NEC D2716D atc 93lc46 D2732D CIRCUIT NEC D2716D TMS87C510 16V8H-25
    Text: Dataman-48 Version 4.30 <ALL> Device List ALi M6759 www.dataman.com M6759 *44 M6759 *44Q M8720 AS29LV800B *44PS AS29LV800B *48TS AS29LV800T *44PS Altera EP1210 EP220 EP312 EP330 EP900 EP910-T EPC1064 EPC1213 EPC1441 as 1213 EPM3064A *44 EPM5192 @84 EPM7032AEas7032 *44


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    PDF Dataman-48 M6759 M8720 AS29LV800B AS29LV800T EP1210 EP220 NEC D2732D nt68f63 novatek nt68f63 d2716d NEC D2716D atc 93lc46 D2732D CIRCUIT NEC D2716D TMS87C510 16V8H-25

    EP600PC

    Abstract: gal22v8 GAL22CV10 EP600PC-3 DPLD610-25 EP600DC-3 PPLD610-25 ep600pc-45 EP910PC-40 EP900PC
    Text: PinPin-Compatible PEEL Array Cross Reference Package, speed and power options Altera EP312 EP600PC EP600PC-45 EP600PC-3 EP600DC* EP600DC-3* EP610PC-35 EP610PC-30 EP610PC-25T EP610PC-25 EP610PC-20T EP610PC-20 EP610PC-15T EP610PC-15 EP610PI-30 EP610DC-35*


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    PDF EP312 EP600PC EP600PC-45 EP600PC-3 EP600DC* EP600DC-3* EP610PC-35 EP610PC-30 EP610PC-25T EP610PC-25 EP600PC gal22v8 GAL22CV10 EP600PC-3 DPLD610-25 EP600DC-3 PPLD610-25 ep600pc-45 EP910PC-40 EP900PC

    Untitled

    Abstract: No abstract text available
    Text: PAL22V10C _ PAL22VP10C Universal PAL Device SEMICONDUCTOR Features • • Ultra high speed supports today’s and tomorrow’s fastest microprocessors 10 user>programmable output macrocells — Output polarity control — Registered or combinatorial


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    PDF PAL22V10C PAL22VP10C PAL22VP10C) 28-Pin PAL22VP10CM 28-Square PAL22VP10CM 15KMB 12YMB

    P10CF-10PC

    Abstract: No abstract text available
    Text: PAL22V10CF _ PAL22VP10CF ^ SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 7.5 ns — t§u = 3 ns — fM AX — 2 new feedback paths PAL22VP10CF • Synchronous PRESET, asynchronous


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    PDF PAL22V10CF PAL22VP10CF PAL22V10CF PAL22VP10CF L22VP10CF L22VP10CF--7JC L22VP10CF--7PC L22V10CF--10DC PAL22VP10 P10CF-10PC

    Untitled

    Abstract: No abstract text available
    Text: PAL22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­


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    PDF PAL22V10G PAL22VP10G PAL22VP10G) L22V10G PAL22VP10G h00-M 28-Pin 300-M 24-Lead

    L22V10C-10PC

    Abstract: No abstract text available
    Text: PAL22V10C PAL22VP10C y CYPRESS Universal PAL Device B iC M O S process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the fam iliarsum -of-products A N D -O R logic structure and a new concept, the program ­ m able m acrocell. • 10 user-programmable output


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    PDF PAL22VP10C) PAL22V10C PAL22VP10C PAL22VP10C 300-M 28-Square 28-Pin 24-Lead L22V10C-10PC

    Untitled

    Abstract: No abstract text available
    Text: bSE D • ESÔTbbS G D l P M n 221 ■ CYP PAL22V10G PAL22VP10G PRELIMINARY r CYPRESS SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — t|ij > = S ns Universal PAL Device ■—-Registered or combinatorial


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    PDF PAL22V10G PAL22VP10G PAL22VP10G) p00-MU) 24-Lead 300-Mil) 28-Pin DD1QM57

    PAL22V10C-7JC

    Abstract: 22V10C 22V10C-10 CERAMIC LEADLESS CHIP CARRIER PAL22V10C-10JC K73 Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PAL22V10C10DC PAL22V10C7JC PAL22VP10C-10JC
    Text: PAL22V10C PAL22VP10C CYPRESS • 10 user-programmable output macrocells — Output polarity control — Registered or combinatorial operation — 2 new feedback paths PAL22VP10C • Synchronous PRESET, asynchronous RESET, and PRELOAD capability for flexible design and testability


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    PDF PAL22V10C PAL22VP10C PAL22VP10C) 28-Square PAL22VP10CMâ 12YMB 28-Pin 15DMB 24-Lead PAL22V10C-7JC 22V10C 22V10C-10 CERAMIC LEADLESS CHIP CARRIER PAL22V10C-10JC K73 Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PAL22V10C10DC PAL22V10C7JC PAL22VP10C-10JC

    10DC IR 3 PINS

    Abstract: No abstract text available
    Text: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR • Ultra high speed supports today's and tomorrow's fastest microprocessors — tp j * user-programmable output macrocells — Output polarity control BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the


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    PDF PAL22V10C PAL22VP10C PAL22VP10C PAL22VP10CM 22VP10CM --15DMB 10DC IR 3 PINS

    ersa 111

    Abstract: No abstract text available
    Text: CYPRESS SEMI CONDUCTOR bSE D • HSf l TbbS QQI QMOI *CYP PAL22V10CF PAL22VP10CF CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 7.5 ns — tsu = 3 n s — fltfAX = 100 MHz — Drives SO-pF load C l


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    PDF PAL22V10CF PAL22VP10CF PAL22VP10CF) T-90-20 ersa 111

    22V10C

    Abstract: PAL22V10C-7DC
    Text: — . _ PAL22V10C _ PAL22VP10C SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 6 ns — tsu = 3 ns — fMAX = 117 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­


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    PDF PAL22V10C PAL22VP10C PAL22V10C PAL22VP10C PAL22VP10C--12DC PAL22VP10C-12JC 22V10C PAL22V10C-7DC

    PAL22

    Abstract: No abstract text available
    Text: PAL22V10C PAL22VP10C CYPRESS SEMICONDUCTOR Universal PAL Device BiCMOS process and Ti-W fuses, the PAL22V10C and PAL22VP10C use the familiar sum-of-products AND-OR log­ ic structure and a new concept, the pro­ grammable macrocell. • 10 user-programmable output


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    PDF PAL22V10C PAL22VP10C PAL22V10C PAL22VP10C L22VP10CMâ 15KMB PAL22VP10CM 15LMB PAL22

    Untitled

    Abstract: No abstract text available
    Text: PAL22V10CF PAL22VP10CF CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 7.5 ns — tsu = 3 ns — f\lA X = 100 MHz — Drives 50-pF load C l — 2 new feedback paths (PAL22VP10CF) • Synchronous PRESET, asynchronous


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    PDF PAL22V10CF PAL22VP10CF 50-pF PAL22VP10CF) PAL22VP10CF P10CFâ 300-M

    22V10C

    Abstract: No abstract text available
    Text: PAL22V10C PAL22VP10C Universal PAL Device CYPRESS Features • Ultra high speed supports today's and tomorrow’s fastest microprocessors — tpi = 6 ns — txir = 3 ns -fM AX = H 7 M H z • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­


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    PDF PAL22V10C PAL22VP10C PAL22V PAL22VPIOC) PA122V10C PAI-22VP10C 22V10C

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest


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    PDF PAL22VP10G) 300-M PAL22 10DMB L22VP10G 10LMB 28-Pin

    22V10G-7

    Abstract: No abstract text available
    Text: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages w ith addi­ tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous


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    PDF PAL22V10G PAL22VP10G PAL22VP10G 10LMB 22V10G-7

    22V10G

    Abstract: No abstract text available
    Text: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest


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    PDF PAL22V10G PAL22VP10G L22V10G L22VP10G 300-M 28-Pin 24-Lead --10PC 22V10G

    PAL22V10-20

    Abstract: fuse smd marking L7 PAL22V10-12 PAL22Y10 5962-86053
    Text: REVISIONS LTR DATE YR-MO-DA DESCRIPTION Add device type 05 to the drawing for vendor CAGE 34335. Add vendor CAGE 01295 for device type 04LX, 043X, and 04KX. Add footnote 9 to table I, subgroups 9, 10, and 11 testing. Changes to vendor similar part number for vendor CAGE 01295.


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    PDF MIL-BUL-103. MIL-BUL-103 PAL22V10-20 fuse smd marking L7 PAL22V10-12 PAL22Y10 5962-86053

    Untitled

    Abstract: No abstract text available
    Text: This is an abbreviated datasheet. C ontact a Cypress representative for complete specifications. For new designs, please refer to the PALC22V10D or PAL22V10G. CYPRESS Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors


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    PDF PALC22V10D PAL22V10G. 50-pF PAL22VP10CF) FAL22V PAL22VP10CF PAL22V10CF PAL22VP10CF PAL22V L22VP10CF