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Catalog Datasheet	MFG & Type	Document Tags	PDF
5962L0053605VYC Abstract: 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA Text: NOT MEASUREMENT SENSITIVE MIL-HDBK-103AJ 19 SEPTEMBER 2011 SUPERSEDING MIL-HDBK-103AH 28 MARCH 2011 DEPARTMENT OF DEFENSE HANDBOOK LIST OF STANDARD MICROCIRCUIT DRAWINGS This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A	Original	MIL-HDBK-103AJ MIL-HDBK-103AH MIL-HDBK-103AJ 5962L0053605VYC 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA	PDF
Untitled Abstract: No abstract text available Text: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest	OCR Scan	PAL22VP10G) 300-M PAL22 10DMB L22VP10G 10LMB 28-Pin	PDF
22V10G-7 Abstract: No abstract text available Text: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under shoot • PLCC and LCC packages w ith addi tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous	OCR Scan	PAL22V10G PAL22VP10G PAL22VP10G 10LMB 22V10G-7	PDF
22V10A Abstract: qml-38535 22V10B Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Updated document. Added device types 07 thru 10. Added CAGE 18324. Added L package. 94-10-17 M. A. Frye Added device types 11 thru 14. Added device class N option for some devices. Added X package, represents plastic dual-in-line. Editorial changes	OCR Scan	MIL-BUL-103 QML-38535. QML-38535 MIL-BUL-103. JUL94 22V10A 22V10B	PDF
22V10G Abstract: No abstract text available Text: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest	OCR Scan	PAL22V10G PAL22VP10G L22V10G L22VP10G 300-M 28-Pin 24-Lead --10PC 22V10G	PDF
Untitled Abstract: No abstract text available Text: 22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi	OCR Scan	PAL22V10G PAL22VP10G PAL22VP10G) L22V10G PAL22VP10G h00-M 28-Pin 300-M 24-Lead	PDF
Untitled Abstract: No abstract text available Text: bSE D • ESÔTbbS G D l P M n 221 ■ CYP 22V10G PAL22VP10G PRELIMINARY r CYPRESS SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — t\|ij > = S ns Universal PAL Device ■—-Registered or combinatorial	OCR Scan	PAL22V10G PAL22VP10G PAL22VP10G) p00-MU) 24-Lead 300-Mil) 28-Pin DD1QM57	PDF
VX 1818 Abstract: 22V10G-7 TS13-1 PAL22 Text: CYPRESS Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 4 ns — tg = 2.5 ns — f[HAX = 166 MH* External • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional Vcc and Vss pins for lowest	OCR Scan	PAL22V10G PAL22VP10G PAL22VP10G) 300-Mil) 28-Pin PAL22VP10G- 28-Lead 24-Lead VX 1818 22V10G-7 TS13-1 PAL22	PDF