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    PACKAGE OUTLINE WEIGHT ABSTRACT Search Results

    PACKAGE OUTLINE WEIGHT ABSTRACT Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE OUTLINE WEIGHT ABSTRACT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		PDF SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    BGS67A

    Abstract: philips if catv amplifier philips hybrid amplifier modules philips application catv
    Text: Application Note BGS67A Application Note AN10201 Philips Semiconductors TPAN02_02W97 Philips Semiconductors BGS67A application note Application Note AN10201 Abstract The BGS67A is a high dynamic range hybrid amplifier designed for applications as a reverse amplifier in two-way CATV systems.


    Original     		PDF BGS67A AN10201 TPAN02 02W97 BGS67A philips if catv amplifier philips hybrid amplifier modules philips application catv

    Untitled

    Abstract: No abstract text available
    Text: New Low-Profile Hermetic LTCC Mixer Series Raises the Bar for Reliability, Performance, and Price Abstract. A new family of ultra‐reliable mixers, developed by Mini‐Circuits, combines low‐temperature cofired ceramic


    Original     		PDF 1/10th AN-00-015 M150261 AN00015

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    csp defects

    Abstract: 13B1 IMT-2000 PCB design for very fine pitch csp package mitsubishi gaAs 1998 plasma display address electrode driving
    Text: The Dawn of 3D Packaging as System-in-Package SIP Morihiro Kada Abstract The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the forerunner from which 3D system packages realize full-scale capability. In the future, 3D package technology will act as a savior in achieving greater shrink of


    Original     		PDF

    6117 heat sink

    Abstract: 13B1 note inverter sharp backlight inverter foil heat sink lcd aluminum Sharp Mechanical design considerations for liquid
    Text: LCD Application Note Liquid Crystal Displays MECHANICAL DESIGN CONSIDERATIONS FOR INTEGRATING LIQUID CRYSTAL DISPLAYS INTO NOTEBOOK & PEN BASED COMPUTERS ABSTRACT In portable computers, there is a need to reduce overall size and weight of the units. The following


    Original     		PDF SMT92024 6117 heat sink 13B1 note inverter sharp backlight inverter foil heat sink lcd aluminum Sharp Mechanical design considerations for liquid

    sharp backlight inverter

    Abstract: liquid crystal display foil heat aluminum
    Text: Liquid Crystal Displays LCD Application Note MECHANICAL DESIGN CONSIDERATIONS FOR INTEGRATING LIQUID CRYSTAL DISPLAYS INTO NOTEBOOK & PEN BASED COMPUTERS Charles Guthrie, Field Applications Engineer ABSTRACT In portable computers, there is a need to reduce


    Original     		PDF 2613-banchi, J63428 SMT92024 sharp backlight inverter liquid crystal display foil heat aluminum

    ixan0002

    Abstract: 0002 ixan0002 2 ixan0002 4 SCHEMATIC 10kw POWER SUPPLY WITH IGBTS VERIDUL M power factor correction boost topology veridul dc-dc power converter IGBT 10kW Single phase power factor correction
    Text: IXAN0002 Single and Three Phase Recti ers with Active Power Factor Correction for Enhanced Mains Power Quality Andreas Lindemann IXYS Semiconductor GmbH Postfach 1180 D { 68619 Lampertheim www.ixys.net Abstract Johann W. Kolar Swiss Federal Institute of Technology ETH Zurich


    Original     		PDF IXAN0002 U-159, IXYSVUM25-E ixan0002 0002 ixan0002 2 ixan0002 4 SCHEMATIC 10kw POWER SUPPLY WITH IGBTS VERIDUL M power factor correction boost topology veridul dc-dc power converter IGBT 10kW Single phase power factor correction

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		PDF AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3

    SD57045

    Abstract: pb97 PD57045S AN1294 GSM1800 GSM900 IS-54 MO-184 PCS1900 PowerSO-10RF
    Text: AN1294 APPLICATION NOTE PowerSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE S. Juhel - N. Hamelin 1. ABSTRACT During the last 10 years, as the size of electronic assemblies decreased and their reliability increased, there has been a need across the board for various components which have to be surface mounted.


    Original     		PDF AN1294 PowerSO-10RF: PowerSO-10RF SD57045 pb97 PD57045S AN1294 GSM1800 GSM900 IS-54 MO-184 PCS1900

    pb97

    Abstract: SD57045 MO-184 similar at PD57006 PD57045S AN1294 GSM1800 GSM900 IS-54 PCS1900
    Text: AN1294 APPLICATION NOTE PowerSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE S. Juhel - N. Hamelin 1. ABSTRACT During the last 10 years, as the size of electronic assemblies decreased and their reliability increased, there has been a need across the board for various components which have to be surface mounted.


    Original     		PDF AN1294 PowerSO-10RF: PowerSO-10RF pb97 SD57045 MO-184 similar at PD57006 PD57045S AN1294 GSM1800 GSM900 IS-54 PCS1900

    Schottky Diode 039 B34

    Abstract: S4 84a DIODE schottky MELF ZENER DIODE color bands blue diode RGP 15J sb050 d 331 s104 diode 87a 252 B34 SMD ZENER DIODE SB050 transistor equivalent MELF DIODE color bands smd transistor P2D
    Text: VISHAY INTERTECHNOLOGY , INC . INTERACTIVE data book rectifiers vishay general semiconductor vse-db0001-0809 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


    Original     		PDF vse-db0001-0809 Schottky Diode 039 B34 S4 84a DIODE schottky MELF ZENER DIODE color bands blue diode RGP 15J sb050 d 331 s104 diode 87a 252 B34 SMD ZENER DIODE SB050 transistor equivalent MELF DIODE color bands smd transistor P2D

    Cu3Sn

    Abstract: ipc 610 non-wetting
    Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.


    Original     		PDF AN10365 Cu3Sn ipc 610 non-wetting

    IXAN0060

    Abstract: series connection of mosfet ISOPLUS247 calculation of IGBT snubber dt300
    Text: Fast, faster, fastest! Optimized diodes for switching applications by Udo Steinebrunner, IXYS Semiconductor GmbH, Lampertheim IXAN0060 Abstract Great efforts have been made to improve power switches – MOSFETs and IGBTs – to decrease forward voltage drop and as


    Original     		PDF IXAN0060 IXAN0060 series connection of mosfet ISOPLUS247 calculation of IGBT snubber dt300

    calculation of IGBT snubber

    Abstract: DSEP ISOPLUS247 dt300
    Text: Fast, faster, fastest! Optimized diodes for switching applications by Udo Steinebrunner, IXYS Semiconductor GmbH, Lampertheim Abstract Great efforts have been made to improve power switches – MOSFETs and IGBTs – to decrease forward voltage drop and as


    Original     		PDF

    TPS54610

    Abstract: TPS54611 TPS54612 TPS54613 TPS54614 TPS54615 TPS54616 TPS54672 SLVA113A
    Text: Application Report SLVA113A – February 2002 Optimizing the Layout of the TPS546xx for Thermal Performance Brian King Power Management Products ABSTRACT This application report examines the thermal performance of different layout techniques for the TPS5461x family of 6-amp, synchronous buck regulators. The TPS5461x family


    Original     		PDF SLVA113A TPS546xx TPS5461x TPS54610, TPS54611, TPS54612, TPS54613, TPS54614, TPS54615, TPS54610 TPS54611 TPS54612 TPS54613 TPS54614 TPS54615 TPS54616 TPS54672 SLVA113A

    56QN50T18080

    Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
    Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages


    Original     		PDF SCEA032 56-Pin 56-terminal MO-220, 56QN50T18080 Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb

    second order low pass filter advantage and disadvantages

    Abstract: Passive filters used in wireless lans SRF 1063 ceramic capacitor footprint 0201 dimension 3 to 10 GHz bandpass filter military passive component ltcc chip monoxid makl passive process inductor
    Text: Embedded Passive Functions for RF and Mixed-Signal Circuits Raymond L. Brown W. R. “Dick” Smith National Semiconductor Corporation 520 Superior Avenue Newport Beach, CA, 92663 714-515-5200, Fax 714-515-9612 ray@ltcc.nsc.com, dick@ltcc.nsc.com Abstract


    Original     		PDF

    MMA7660

    Abstract: SURFACE MOUNT CAPACITORS footprint land pattern AN3839 MMA7660FC accelerometer sensor land pattern for DFN
    Text: Freescale Semiconductor Application Note AN3839 Rev 2, 9/2009 MMA7660FC Board Mounting Guidelines by: Laura Salhuana ACRONYMS PCB: Printed Circuit Board DFN: Dual Flat No-Lead Cl: Chlorine Br: Bromine RoHS: Restrictions on Hazardous Substances Sn: tin Pb: lead


    Original     		PDF AN3839 MMA7660FC MMA7660 SURFACE MOUNT CAPACITORS footprint land pattern AN3839 accelerometer sensor land pattern for DFN

    6000A 16 1

    Abstract: m2408n
    Text: EVALUATION LABORATORY Rating Report - Issue 2 Date - 23 July, 2004 Origin - PAR 985 Total Pages - 13 Fast Recovery Diode Types M2408N#020 to M2408N#060 Old Type No.: SM02-06CXC504 Author EL Check/Approval QA Approval S & M Approval N. A. Tarling Abstract The M2408N#020-060 fast recovery diode consists of a 50mm diameter silicon slice manufacturing


    Original     		PDF M2408N SM02-06CXC504 M1825NC020-060 6000A 16 1

    Untitled

    Abstract: No abstract text available
    Text: Known Good Die: The Challenge of the Technology M ark Lippold and Sherburne Bridges National Semiconductor, Inc. South Portland, M aine Abstract The challenges of supplying high yield, high quality, cost effective Known Good Die KGD are discussed in detail. A review of the history behind die supply processing and technology drivers provide insight into the


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